Memory system design using buffer(s) on a mother board

    公开(公告)号:US11537540B2

    公开(公告)日:2022-12-27

    申请号:US17316586

    申请日:2021-05-10

    Applicant: Rambus Inc.

    Abstract: A mother board topology including a processor operable to be coupled to one or more communication channels for communicating commands. The topology includes a first communication channel electrically coupling a first set of two or more dual in-line memory modules (DIMMs) and a first primary data buffer on a mother board. The topology includes a second communication channel electrically coupling a second set of two or more DIMMs and a second primary data buffer on the mother board. The topology includes a third channel electrically coupling the first primary data buffer, the primary second data buffer, and the processor.

    Memory system design using buffer(s) on a mother board

    公开(公告)号:US11003601B2

    公开(公告)日:2021-05-11

    申请号:US16837844

    申请日:2020-04-01

    Applicant: Rambus Inc.

    Abstract: A mother board topology including a processor operable to be coupled to one or more communication channels for communicating commands. The topology includes a first communication channel electrically coupling a first set of two or more dual in-line memory modules (DIMMs) and a first primary data buffer on a mother board. The topology includes a second communication channel electrically coupling a second set of two or more DIMMs and a second primary data buffer on the mother board. The topology includes a third channel electrically coupling the first primary data buffer, the primary second data buffer, and the processor.

    Memory system design using buffer(s) on a mother board

    公开(公告)号:US10169258B2

    公开(公告)日:2019-01-01

    申请号:US15071072

    申请日:2016-03-15

    Applicant: Rambus Inc.

    Abstract: A mother board topology including a processor operable to be coupled to one or more communication channels for communicating commands. The topology includes a first communication channel electrically coupling a first set of two or more dual in-line memory modules (DIMMs) and a first primary data buffer on a mother board. The topology includes a second communication channel electrically coupling a second set of two or more DIMMs and a second primary data buffer on the mother board. The topology includes a third channel electrically coupling the first primary data buffer, the primary second data buffer, and the processor.

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