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公开(公告)号：US09706662B2
公开(公告)日：2017-07-11
申请号：US14755490
申请日：2015-06-30
Applicant: Raytheon Company
Inventor： Tse E. Wong , Kenneth T. Teshiba , Shea Chen
IPC: H05K1/11 , H05K1/18 , H01L23/498 , H05K1/14 , H05K3/40 , H01L23/00 , H05K3/34 , B23K35/26 , C22C11/06 , C22C13/00
CPC classification number: H05K1/181 , B23K35/262 , B23K35/268 , C22C11/06 , C22C13/00 , H01L23/15 , H01L23/49827 , H01L23/49866 , H01L24/80 , H05K1/111 , H05K1/141 , H05K3/3436 , H05K3/3463 , H05K3/4061 , H05K2201/10378 , H05K2201/2081 , Y02P70/613
Abstract: An adaptive interposer is provided to be operably disposable between first and second solder materials of first and second electronic devices, respectively. The adaptive interposer includes a plate element formed to define cavities and third solder material disposable in the cavities to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second solder materials.
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公开(公告)号：US20170150596A1
公开(公告)日：2017-05-25
申请号：US14947574
申请日：2015-11-20
Applicant: Raytheon Company
Inventor： Tse E. Wong , Shea Chen , Hoyoung C. Choe
IPC: H05K1/02 , H05K1/11 , H01L25/065 , H01L23/492 , H01L23/498
CPC classification number: H05K1/0271 , H01L23/4924 , H01L23/49811 , H01L23/49822 , H01L23/49838 , H01L23/49866 , H01L25/065 , H05K1/111 , H05K3/3436 , H05K3/3457 , H05K2201/0305 , H05K2201/049 , H05K2201/068 , H05K2201/09036 , H05K2201/094 , H05K2201/10378 , H05K2201/10734 , H05K2203/047 , Y02P70/613
Abstract: A stress reduction interposer is provided for disposition between first and second solder materials of first and second electronic devices, respectively. The stress reduction interposer includes a plate element having a central portion and a periphery surrounding the central portion and being formed to define first cavities having an upper area limit at the periphery and a second cavity having a lower area limit, which is higher than the upper area limit, at the central portion and third and fourth solder materials being disposable in the second cavity and in the first cavities, respectively, to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second and fourth solder materials.
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公开(公告)号：US09648729B1
公开(公告)日：2017-05-09
申请号：US14947574
申请日：2015-11-20
Applicant: Raytheon Company
Inventor： Tse E. Wong , Shea Chen , Hoyoung C. Choe
IPC: H01L23/52 , H05K1/02 , H01L23/492 , H01L23/498 , H01L25/065 , H05K1/11
CPC classification number: H05K1/0271 , H01L23/4924 , H01L23/49811 , H01L23/49822 , H01L23/49838 , H01L23/49866 , H01L25/065 , H05K1/111 , H05K3/3436 , H05K3/3457 , H05K2201/0305 , H05K2201/049 , H05K2201/068 , H05K2201/09036 , H05K2201/094 , H05K2201/10378 , H05K2201/10734 , H05K2203/047 , Y02P70/613
Abstract: A stress reduction interposer is provided for disposition between first and second solder materials of first and second electronic devices, respectively. The stress reduction interposer includes a plate element having a central portion and a periphery surrounding the central portion and being formed to define first cavities having an upper area limit at the periphery and a second cavity having a lower area limit, which is higher than the upper area limit, at the central portion and third and fourth solder materials being disposable in the second cavity and in the first cavities, respectively, to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second and fourth solder materials.
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公开(公告)号：US20170006705A1
公开(公告)日：2017-01-05
申请号：US14755490
申请日：2015-06-30
Applicant: Raytheon Company
Inventor： Tse E. Wong , Kenneth T. Teshiba , Shea Chen
CPC classification number: H05K1/181 , B23K35/262 , B23K35/268 , C22C11/06 , C22C13/00 , H01L23/15 , H01L23/49827 , H01L23/49866 , H01L24/80 , H05K1/111 , H05K1/141 , H05K3/3436 , H05K3/3463 , H05K3/4061 , H05K2201/10378 , H05K2201/2081 , Y02P70/613
Abstract: An adaptive interposer is provided to be operably disposable between first and second solder materials of first and second electronic devices, respectively. The adaptive interposer includes a plate element formed to define cavities and third solder material disposable in the cavities to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second solder materials.
Abstract translation: 提供自适应插入器以分别在第一和第二电子器件的第一和第二焊料材料之间可操作地一次性使用。 自适应插入器包括形成为限定空腔的一个板状元件和在空腔中一次性与第一和第二焊料材料电连通的第三焊料材料。 第三焊料材料更柔顺并且具有比至少第二焊料材料更高的熔化温度。
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