公开(公告)号：US09131632B2

公开(公告)日：2015-09-08

申请号：US13514347

申请日：2010-12-03

Applicant: Roland Moedinger

Inventor： Roland Moedinger

IPC: H01R12/00 ,  H05K3/30 ,  H01R12/58 ,  H01R12/72 ,  H01R13/6587 ,  H05K1/02

CPC classification number: H05K3/308 ,  H01R12/585 ,  H01R12/724 ,  H01R13/6587 ,  H05K1/0245 ,  H05K1/0251 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2203/0242 ,  Y10T29/49126

Abstract: A multipole relief plug-in Connector includes contact elements, the contacting sections of which are arranged in height-offset contact area surfaces, and a multilayer circuit board includes several height-offset contact area surfaces accordingly. In combination, the multipole relief plug-in connector contacts the multilayer circuit board and the multilayer circuit board populates the multipole relief plug-in connector. The contact elements of the relief plug-in connector are designed in the contacting section as press-in contacts for pressing into press-in contact receiving portions of the multilayer circuit board. Contact element receiving portions of the multilayer circuit board are arranged in the contact area surfaces of the multilayer circuit board, the contact element receiving portions being designed as press-in contact receiving portions. A production method produces the multilayer circuit board.

Abstract translation: 多极释放插入式连接器包括接触元件，其接触部分布置在高度偏移的接触区域表面中，并且多层电路板相应地包括多个高度偏移的接触面积表面。 组合在一起，多极释放插入式连接器接触多层电路板，并且多层电路板填充多极释放插入式连接器。 泄压插入式连接器的接触元件设计在接触部分中，作为用于压入多层电路板的压入接触部分的压入触头。 多层电路板的接触元件接收部分布置在多层电路板的接触区域表面中，接触元件接收部分被设计成压入接触部分。 生产方法生产多层电路板。

公开(公告)号：US20120244753A1

公开(公告)日：2012-09-27

申请号：US13514347

申请日：2010-12-03

Applicant: Roland Moedinger

Inventor： Roland Moedinger

IPC: H01R24/50 ,  H05K1/00 ,  H05K3/36

CPC classification number: H05K3/308 ,  H01R12/585 ,  H01R12/724 ,  H01R13/6587 ,  H05K1/0245 ,  H05K1/0251 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2203/0242 ,  Y10T29/49126

Abstract: The invention relates to a multipole relief plug-in connector (10a, 10b) and to a multilayer circuit board (12a, 12b), the relief plug-in connector (10a, 10b) comprising a plurality of contact elements (14a, 14b), the contacting sections (16a, 16b) of which are arranged in height-offset contact area surfaces (18a, 18b), and the multilayer circuit board (12a, 12b) comprising several height-offset contact area surfaces (20, 20b) accordingly, and to a combination of a multipole relief plug-in connector (10a, 10b) for contacting with a multilayer circuit board (12a, 12b) and a multilayer circuit board (12a, 12b) for populating with the multipole relief plug-in connector (10a, 10b). The relief plug-in connector (10a, 10b) according to the invention is characterized in that the contact elements (14a, 14b) are designed in the contacting section (16a, 16b) as press-in contacts (22a, 22b, 26a, 26b, 28a, 28b) for pressing into press-in contact receiving portions (24a, 24b, 38a, 38b, 44a, 44b) of the multilayer circuit board (12a, 12b). The multilayer circuit board (12a, 12b) is characterized in that contact element receiving portions are arranged in the contact area surfaces (20a, 20b) of the multilayer circuit board (12a, 12b), the contact element receiving portions being designed as press-in contact receiving portions (24a, 24b, 38a, 38b, 44a, 44b). The invention further relates to a production method for the multilayer circuit board (12a, 12b).

Abstract translation: 本发明涉及多极释放插入式连接器（10a，10b）和多层电路板（12a，12b），所述释放插入式连接器（10a，10b）包括多个接触元件（14a，14b） ，其接触部分（16a，16b）布置在高度偏移的接触区域表面（18a，18b）中，并且所述多层电路板（12a，12b）相应地包括多个高度偏移接触面积表面（20,20b） 以及用于与多层电路板（12a，12b）接触的多极释放插入式连接器（10a，10b）和用于填充多极释放插入式连接器的多层电路板（12a，12b）的组合 （10a，10b）。 根据本发明的释放插入式连接器（10a，10b）的特征在于，接触元件（14a，14b）被设计在接触部分（16a，16b）中，作为压入触头（22a，22b，26a， 26b，28a，28b），用于压入多层电路板（12a，12b）的压入接触部（24a，24b，38a，38b，44a，44b）。 多层电路板（12a，12b）的特征在于，多层电路板（12a，12b）的接触区域表面（20a，20b）中布置有接触元件接收部分， 在接触接收部分（24a，24b，38a，38b，44a，44b）中。 本发明还涉及多层电路板（12a，12b）的制造方法。