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公开(公告)号：US20200373109A1
公开(公告)日：2020-11-26
申请号：US16418332
申请日：2019-05-21
Applicant: Rosemount Aerospace, Inc.
Inventor： David P. Potasek , Ben Ping-Tao Fok , Roger Alan Backman
Abstract: Disclosed is a thin-film micro-fuse assembly having: a substrate; an insulating layer disposed on the substrate, the insulating layer comprising silicon dioxide; a conductor disposed on the insulating layer, the conductor forming: an inlet terminal, an outlet terminal and a fuse element between the inlet terminal and the outlet terminal, the inlet terminal and the outlet terminal widthwise converging toward the fuse element, and the fuse element having a first thickness and a first width that is between 1 and 5 times the first thickness.
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公开(公告)号：US20210041316A1
公开(公告)日：2021-02-11
申请号：US16536486
申请日：2019-08-09
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Roger Alan Backman
Abstract: A micromechanical pressure sensor for measuring a pressure differential includes a diaphragm having an inner region and two edge regions, one opposite the other with respect to the inner region. Two or more piezoresistive resistance devices are on the diaphragm, at least one in each of the inner and edge region, and are configured to be electrically connected in a bridge circuit. The micromechanical pressure sensor is configured so that an operating temperature of the one or more piezoresistive resistance devices in the inner region is substantially the same as an operating temperature of the one or more piezoresistive resistance devices in at least one of the edge regions throughout a full operating range such that an error of the micromechanical pressure sensor output resulting from self-heating is less than if the micromechanical pressure sensor were not configured to maintain the operating temperatures substantially the same.
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公开(公告)号：US10861665B1
公开(公告)日：2020-12-08
申请号：US16593714
申请日：2019-10-04
Applicant: Rosemount Aerospace Inc.
Inventor： Roger Alan Backman , David P. Potasek
IPC: H01H85/041 , H01H85/00 , H01H69/02 , H01H85/175
Abstract: A micro-fuse assembly includes a substrate, a number of thin-film micro-fuses on the substrate, and a topping wafer configured to sealingly engage to at least one of the substrate or the thin-film micro-fuses to define a cavity therebetween. The cavity is configured to encapsulate the thin-film micro-fuses within an inert environment sealed within the cavity. A method of encapsulating a micro-fuse assembly within an inert environment using a topping wafer is also disclosed.
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公开(公告)号：US11099093B2
公开(公告)日：2021-08-24
申请号：US16536486
申请日：2019-08-09
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Roger Alan Backman
Abstract: A micromechanical pressure sensor for measuring a pressure differential includes a diaphragm having an inner region and two edge regions, one opposite the other with respect to the inner region. Two or more piezoresistive resistance devices are on the diaphragm, at least one in each of the inner and edge region, and are configured to be electrically connected in a bridge circuit. The micromechanical pressure sensor is configured so that an operating temperature of the one or more piezoresistive resistance devices in the inner region is substantially the same as an operating temperature of the one or more piezoresistive resistance devices in at least one of the edge regions throughout a full operating range such that an error of the micromechanical pressure sensor output resulting from self-heating is less than if the micromechanical pressure sensor were not configured to maintain the operating temperatures substantially the same.
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