THERMAL LASER SCRIBE CUTTING FOR ELECTROCHROMIC DEVICE PRODUCTION
    9.
    发明申请
    THERMAL LASER SCRIBE CUTTING FOR ELECTROCHROMIC DEVICE PRODUCTION 有权
    用于电致发光器件生产的热激光切割切割

    公开(公告)号:US20130266757A1

    公开(公告)日:2013-10-10

    申请号:US13790126

    申请日:2013-03-08

    Abstract: The disclosure is directed to a cutting process involving: (a) creating a starter crack using a scribe wheel, (b) application of laser or electrothermal heating, and (c) subsequent cooling from a gas or an aerosol jet, as the laser beam and cooling jet move along the desired cutting line. The cutting process can be implemented for cutting a glass panel or other substrate into a plurality of smaller panels. The starter crack may be created on any of the smaller panels within about 10 mm to about 20 mm from the corner of the smaller panel.

    Abstract translation: 本公开涉及一种切割过程,其涉及:(a)使用划线器产生起动器裂纹,(b)施​​加激光或电热加热,以及(c)随后从气体或气溶胶射流冷却,作为激光束 并且冷却喷射沿所需的切割线移动。 可以实现切割过程,以将玻璃面板或其他基底切割成多个较小的面板。 起动器裂纹可以在距离较小面板的角落约10mm至约20mm的任何较小的面板上产生。

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