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    Antenna support to be mounted on an electrical board
    2.
    发明授权
    Antenna support to be mounted on an electrical board 有权

    公开(公告)号：US10109913B2

    公开(公告)日：2018-10-23

    申请号：US15302355

    申请日：2015-04-17

    Applicant: SAGEMCOM BROADBAND SAS

    Inventor： Stephane Kohn ,  Romain Dejardin

    IPC: H01Q1/38 ,  H01Q1/12 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q9/40

    Abstract: An antenna support to be mounted on an electrical board and used to carry an antenna which is electrically connected to the board. The support has a plurality of housings, each one suitable for receiving the antenna according to different orientations; device for adjusting the position of the antenna on the board; and device for fixing the support to the board. An electrical board provided with an antenna support, a method for positioning an antenna to be connected to an electrical board, and a method for producing an electrical board connected to an antenna are also provided.

    Electronic apparatus with thermally-conductive stand
    3.
    发明授权
    Electronic apparatus with thermally-conductive stand 有权

    公开(公告)号：US10251310B2

    公开(公告)日：2019-04-02

    申请号：US15564137

    申请日：2016-04-13

    Applicant: SAGEMCOM BROADBAND SAS

    Inventor： Stephane Kohn ,  Christophe Hervot ,  Radu Nedelcu

    IPC: H05K7/20 ,  H05K5/02 ,  H04N19/44

    Abstract: The invention relates to electronic equipment including the following steps: a box including a thermally-conductive chassis; a thermally-conductive stand in contact with the chassis and including a plastics covering that covers it at least in part; and electronic components inside the box including a hottest electronic component that is the greatest source of heat inside the box and/or that presents the highest temperature from among the electronic components, the hottest electronic component being arranged in contact with the thermally-conductive chassis.

    Air-cooled electronic equipment and device for cooling an electronic component
    4.
    发明授权
    Air-cooled electronic equipment and device for cooling an electronic component 有权

    公开(公告)号：US10201113B2

    公开(公告)日：2019-02-05

    申请号：US14425286

    申请日：2013-09-06

    Applicant: SAGEMCOM BROADBAND SAS

    Inventor： Stephane Kohn ,  Herve Lieven

    IPC: H01L23/467 ,  H05K1/02 ,  H05K7/20 ,  F28D1/02

    Abstract: The invention concerns a piece of electronic equipment comprising a card (2) provided with an electronic component (3), a radiator (5) having a bottom (6) topped by fins (7), the bottom of the radiator resting on the electronic component, and a cover (8) extending above the radiator providing an air flow around the fins of the radiator, the cover comprising a plurality of flexible blades (11), each applied to an upper edge of at least one of the fins to keep the radiator applied against the component, and the flexible blades (11) have a first end integral with the cover and a second free end applied against the upper edge of the fins. A cooling device with a radiator and a cover for holding the radiator in place.

    Air-Cooled Electronic Equipment and Device for Cooling an Electronic Component
    6.
    发明申请
    Air-Cooled Electronic Equipment and Device for Cooling an Electronic Component 审中-公开
    风冷电子设备和冷却电子元件的设备

    公开(公告)号：US20150264835A1

    公开(公告)日：2015-09-17

    申请号：US14425286

    申请日：2013-09-06

    Applicant: SAGEMCOM BROADBAND SAS

    Inventor： Stephane Kohn ,  Herve Lieven

    IPC: H05K7/20 ,  F28D1/02

    CPC classification number: H05K7/20172 ,  F28D1/02 ,  F28D2001/0286 ,  H01L23/467 ,  H05K7/20154 ,  H05K7/20436 ,  H05K7/2049

    Abstract: The invention concerns a piece of electronic equipment comprising a card (2) provided with an electronic component (3), a radiator (5) having a bottom (6) topped by fins (7), the bottom of the radiator resting on the electronic component, and a cover (8) extending above the radiator providing an air flow around the fins of the radiator, the cover comprising a plurality of flexible blades (11), each applied to an upper edge of at least one of the fins to keep the radiator applied against the component, and the flexible blades (11) have a first end integral with the cover and a second free end applied against the upper edge of the fins. A cooling device with a radiator and a cover for holding the radiator in place.

    Abstract translation: 本发明涉及一种电子设备，其包括设置有电子部件（3）的卡（2），具有由翅片（7）顶起的底部（6）的散热器（5）的电子设备，散热器的底部搁置在电子 以及在散热器上方延伸的覆盖物（8），其提供围绕散热器的翅片的空气流，所述盖包括多个柔性叶片（11），每个柔性叶片（11）应用于至少一个翅片的上边缘以保持 所述散热器施加在所述部件上，并且所述柔性叶片（11）具有与所述盖一体的第一端和第二自由端施加在所述翅片的上边缘上。 具有散热器和用于将散热器保持在适当位置的盖子的冷却装置。

    SOLDER SPACER AND ELECTRONIC MODULE COMPRISING SUCH A SPACER
    8.
    发明申请
    SOLDER SPACER AND ELECTRONIC MODULE COMPRISING SUCH A SPACER 有权
    包括这种间隔器的焊接间隔器和电子模块

    公开(公告)号：US20150173192A1

    公开(公告)日：2015-06-18

    申请号：US14405094

    申请日：2013-05-23

    Applicant: SAGEMCOM BROADBAND SAS

    Inventor： Stephane Kohn

    IPC: H05K1/14 ,  H05K1/11

    CPC classification number: H05K1/14 ,  H05K1/11 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10409 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036

    Abstract: The invention provides a spacer for soldering comprising an elongate body having one end provided with a tapped hole and an opposite end provided with a transverse bearing surface having a smooth centering peg projecting therefrom, the peg has a longitudinal outer passage extending over at least a fraction of its length as far as the transverse bearing surface to enable molten solder to penetrate by capillarity as far as the transverse bearing surface. The invention also provides a module including such a spacer.

    Abstract translation: 本发明提供了一种用于焊接的间隔件，其包括细长本体，其一端设有螺纹孔，另一端设置有横向支承表面，该横向支承表面具有从其突出的平滑的定中心钉，所述栓具有纵向外部通道， 其长度为横向支承表面，以使熔融焊料能够通过毛细管力渗透到横向支承表面。 本发明还提供了一种包括这种间隔件的模块。

    Electronic Apparatus, Such as a Modem or the Like, Comprising a Plurality of Air-Cooled Processors
    9.
    发明申请
    Electronic Apparatus, Such as a Modem or the Like, Comprising a Plurality of Air-Cooled Processors 有权
    包含多个风冷处理器的诸如调制解调器等的电子设备

    公开(公告)号：US20140254097A1

    公开(公告)日：2014-09-11

    申请号：US14349993

    申请日：2012-10-30

    Applicant: SAGEMCOM BROADBAND SAS

    Inventor： Stephane Kohn

    IPC: H05K7/20

    CPC classification number: H05K7/20154 ,  G06F1/181 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20 ,  H05K7/20145 ,  H01L2924/00

    Abstract: An electronic appliance of modem or analogous type has a fan and an internal casing channeling the air stream generated by the fan, and a plurality of processors fitted with radiators that are mounted in the appliance. The radiators are situated in register with different portions (PS, PI) of the cross-section of the channeled air stream so that the different radiators are cooled by different portions (PS, PI) of the air stream. The appliance applies to the field of home electronics.

    Abstract translation: 调制解调器或类似类型的电子设备具有风扇和引导风扇产生的空气流的内部壳体，以及配备有安装在设备中的散热器的多个处理器。 散热器与通道空气流的横截面的不同部分（PS，PI）对准，使得不同的散热器被空气流的不同部分（PS，PI）冷却。 该设备适用于家庭电子领域。

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