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    MULTILAYER ELECTRONIC COMPONENT
    1.
    发明公开
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20230215640A1

    公开(公告)日：2023-07-06

    申请号：US17895414

    申请日：2022-08-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Young Na ,  Jin Hyung Lim ,  Sung Soo Kim ,  Seung Hun Han ,  Ji Hong Jo

    IPC: H01G4/232 ,  H01G4/30

    CPC classification number: H01G4/2325 ,  H01G4/30

    Abstract: A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface, a first band portion extending from the first connection portion onto the first surface, and a third band portion extending from the first connection portion onto the second surface; a second external electrode including a second connection portion on the fourth surface, a second band portion extending from the second connection portion onto the first surface, and a fourth band portion extending from the second connection portion onto the second surface; an insulating layer including oxide including aluminum (Al), disposed on the first and second connection portions, and covering the second surface and the third and fourth band portions; and first and second plating layers respectively disposed on the first and second band portions.

    MULTILAYER ELECTRONIC COMPONENT
    2.
    发明公开
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20230215636A1

    公开(公告)日：2023-07-06

    申请号：US17953923

    申请日：2022-09-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Young Na ,  Jin Hyung Lim ,  Sung Soo Kim ,  Seung Hun Han ,  Ji Hong Jo

    IPC: H01G4/12 ,  H01G4/30 ,  H01G4/248

    CPC classification number: H01G4/1236 ,  H01G4/30 ,  H01G4/248

    Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, and a third band portion extending from the first connection portion to a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a fourth band portion extending from the second connection portion to a portion of the second surface; an insulating layer disposed on the first and second connection portions and covering the second surface and the third and fourth band portions; the insulating layer includes an oxide including zirconium (Zr).

    Multilayer electronic component and method of manufacturing the same
    3.
    发明授权
    Multilayer electronic component and method of manufacturing the same 有权

    公开(公告)号：US12198860B2

    公开(公告)日：2025-01-14

    申请号：US17947323

    申请日：2022-09-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Soo Kim ,  Jin Hyung Lim ,  Jae Young Na ,  Seung Hun Han ,  Ji Hong Jo

    IPC: H01G4/232 ,  H01G4/012 ,  H01G4/30

    Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface; a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface; a cover layer disposed on the first and second connecting portions and disposed to cover the second surface and the third and fourth band portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The cover layer includes a base layer, having hydrophilicity, and an insulating layer disposed on the base layer.

    Multilayer ceramic electronic component
    5.
    发明授权
    Multilayer ceramic electronic component 有权

    公开(公告)号：US11705283B2

    公开(公告)日：2023-07-18

    申请号：US17468240

    申请日：2021-09-07

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Kyo Yeol Lee ,  Seung Hun Han ,  In Young Kang ,  Jung Min Kim ,  Jeong Ryeol Kim

    IPC: H01G4/30 ,  H01G4/232 ,  H01G4/008 ,  H01G4/012

    CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/2325

    Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.

    ACCELERATION SENSOR
    8.
    发明申请
    ACCELERATION SENSOR 审中-公开
    加速传感器

    公开(公告)号：US20140144236A1

    公开(公告)日：2014-05-29

    申请号：US13845094

    申请日：2013-03-18

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chang Hyun Lim ,  Seung Hun Han ,  Jung Won Lee ,  Sung Jun Lee ,  Jeong Suong Yang

    IPC: G01P15/18

    CPC classification number: G01P15/18 ,  G01P15/123 ,  G01P2015/084

    Abstract: Disclosed herein is an accelerator sensor, including: a mass body; a flexible beam that is provided with a piezoresistive element configured of an X-axis resistive element, a Y-axis resistive element, and a Z-axis resistive element having both ends connected with contact pads and is connected with the mass body; and a support portion that is connected with the flexible beam and supports the flexible beam so as to float the mass body, wherein the flexible beam has a slit provided between one-axis resistive element and the other axis resistive element adjacent to each other and the slit is extendedly formed from the contact pads connected with ends of the one axis resistive element and the other axis resistive element to the contact pads connected with the other ends thereof.

    Abstract translation: 这里公开了一种加速器传感器，包括：质量体; 具有由X轴电阻元件，Y轴电阻元件和Z轴电阻元件构成的压阻元件的柔性梁，其两端与接触焊盘连接并与质量体连接; 以及支撑部，其与柔性梁连接并支撑柔性梁以使质量体浮起，其中柔性梁具有设置在彼此相邻的一个轴电阻元件和另一个轴电阻元件之间的狭缝， 狭缝从与单轴电阻元件的端部连接的接触焊盘和另一个轴电阻元件延伸地形成到与其另一端连接的接触焊盘。

    Multilayer electronic component
    9.
    发明授权
    Multilayer electronic component 有权

    公开(公告)号：US12230449B2

    公开(公告)日：2025-02-18

    申请号：US17894273

    申请日：2022-08-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Soo Kim ,  Jae Young Na ,  Jin Hyung Lim ,  Seung Hun Han ,  Ji Hong Jo

    IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

    Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on a portion of the first surface, and a third band portion on a portion of the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on a portion of the first surface, and a fourth band portion on a portion of the second surface, an insulating layer disposed on the first and second connection portions and covering the second surface and the third and fourth band portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes an oxide containing Ba.

    Multilayer electronic component
    10.
    发明授权
    Multilayer electronic component 有权

    公开(公告)号：US12176149B2

    公开(公告)日：2024-12-24

    申请号：US17953923

    申请日：2022-09-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Young Na ,  Jin Hyung Lim ,  Sung Soo Kim ,  Seung Hun Han ,  Ji Hong Jo

    IPC: H01G4/12 ,  H01G4/248 ,  H01G4/30

    Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, and a third band portion extending from the first connection portion to a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a fourth band portion extending from the second connection portion to a portion of the second surface; an insulating layer disposed on the first and second connection portions and covering the second surface and the third and fourth band portions; the insulating layer includes an oxide including zirconium (Zr).

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