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公开(公告)号：US09345124B2
公开(公告)日：2016-05-17
申请号：US14235811
申请日：2013-11-07
Inventor： Jianyong Fu
CPC classification number: H05K1/0203 , H01L23/36 , H01L23/48 , H01L23/49838 , H01L23/50 , H01L23/552 , H01L2924/0002 , H01L2924/19041 , H01L2924/19105 , H01L2924/37001 , H05K1/0209 , H05K1/0231 , H05K1/092 , H05K1/115 , H05K1/18 , H05K2201/09227 , H05K2201/10015 , H05K2201/10522 , H05K2201/10674 , H05K2201/10969 , H01L2924/00
Abstract: The present invention provides a chip structure and a circuit structure, chip structure is disposed on a printed circuit board provided with an element layer and a copper grounding layer, and comprises: a chip body disposed on the element layer and having a plurality of power pins; a power line disposed on the element layer for supplying electric power to the chip body; a plurality of power input lines, each of which has a body disposed on the copper grounding layer and two ends disposed on the element layer and connected with the body through corresponding through holes of the printed circuit board; and a plurality of bypass capacitors having one end connected with the power pins of the chip body through the element layer and the other end of the bypass capacitors connected with the power line through the power input line. The present invention further provides a chip structure. The power line of the chip structure and the circuit structure of the present invention is disposed on the element layer, so that the heat dissipation effect of the copper grounding layer is better, and the yield of the chip and corresponding circuit structure is improved.
Abstract translation: 本发明提供了一种芯片结构和电路结构，芯片结构设置在具有元件层和铜接地层的印刷电路板上，包括：芯片体，设置在元件层上并具有多个电源引脚 ; 电源线，设置在所述元件层上，用于向所述芯片主体供电; 多个电源输入线，每个电源输入线具有布置在铜接地层上的主体和设置在元件层上的两端，并通过印刷电路板的相应通孔与主体相连; 以及多个旁路电容器，其一端通过元件层与芯片主体的电源引脚相连，旁路电容器的另一端通过电源输入线与电源线连接。 本发明还提供一种芯片结构。 芯片结构的电源线和本发明的电路结构设置在元件层上，使得铜接地层的散热效果更好，并且提高了芯片的产量和相应的电路结构。
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公开(公告)号：US09615459B2
公开(公告)日：2017-04-04
申请号：US14416671
申请日：2014-12-31
Inventor： Jianyong Fu , Dongsheng Guo
CPC classification number: H05K1/165 , H05K3/46 , H05K2201/09627 , H05K2201/09672
Abstract: An inductor, a circuit board and a method for forming an inductor are provided. The inductor comprises: a first pad arranged on a first metal wiring layer of a circuit board; a second pad arranged on a second metal wiring layer of the circuit board; and a first hole with conducting medium filled therein, one end of the first hole being located in the first pad and the other end thereof being located in the second pad. The inductor can effectively reduce the area of the circuit occupied by the inductor.
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Patent Agency Ranking
公开(公告)号：US20160105949A1
公开(公告)日：2016-04-14
申请号：US14408602
申请日：2014-10-20
Inventor： Jianyong Fu
CPC classification number: H05K1/0206 , H01L23/36 , H01L2924/0002 , H05K1/0209 , H05K3/3421 , H05K3/3436 , H01L2924/00
Abstract: A printed circuit board and a display device are provided. The printed circuit board comprises a substrate, a package chip, and a metal heat dissipation layer. The package chip is disposed on a first surface of the substrate and comprises a chip body. The metal heat dissipation layer is disposed on a second surface of the substrate. A projection of the metal heat dissipation layer on the first surface of the substrate covers the chip body. The metal heat dissipation layer of the present invention is disposed on the reverse side of the printed circuit board to reduce the temperature of the package chip.
Abstract translation: 提供印刷电路板和显示装置。 印刷电路板包括基板，封装芯片和金属散热层。 封装芯片设置在基板的第一表面上并且包括芯片体。 金属散热层设置在基板的第二表面上。 金属散热层在基板的第一表面上的突起覆盖芯片体。 本发明的金属散热层设置在印刷电路板的背面，以降低封装芯片的温度。
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公开(公告)号：US20150189739A1
公开(公告)日：2015-07-02
申请号：US14235094
申请日：2014-01-10
Inventor： Jianyong Fu , Dongsheng Guo , Jiehui Qin
IPC: H05K1/02
CPC classification number: H05K1/0225 , H05K3/341 , H05K2201/0355 , H05K2201/0715
Abstract: A printed circuit board (PCB) and a display device having the PCB include a substrate including a first surface that packages electronic components and a second surface opposite to the first surface, and a conductive foil that attaches to the second surface of the substrate. The conductive foil is divided into a plurality of blocks, and spacer regions are arranged between the blocks, where the spacer regions are configured with wires for electrical connection.
Abstract translation: 印刷电路板（PCB）和具有PCB的显示装置包括：基板，包括封装电子部件的第一表面和与第一表面相对的第二表面的第一表面;以及附着到基板的第二表面的导电箔。 导电箔被分成多个块，并且间隔区布置在块之间，其中间隔区配置有用于电连接的导线。
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公开(公告)号：US20150016069A1
公开(公告)日：2015-01-15
申请号：US14004443
申请日：2013-07-15
Inventor： Jianyong Fu , Anle Hu , Xiaoping Tan
IPC: H05K1/02
CPC classification number: H05K1/0271 , H05K3/328 , H05K2201/09136 , H05K2201/093 , H05K2201/0969
Abstract: A printed circuit board (PCB) is disclosed. The PCB includes a main body. A first surface of the main body is a connecting surface for electrical components. A second surface of the main body is a conductive cooper foil layer operating as ground wires. A plurality of grooves is arranged on the conductive cooper foil layer. The grooves pass through the conductive cooper foil layer to connect to the main body of the PCB. The thermal stress generated in the PCB welding process can be effectively released via the grooves. The inflation of the conductive cooper coil is relieved such that the PCB is prevented from being wrapped or cooper bubbling. In this way, the operation efficiency is enhanced and the manufacturing cost is reduced.
Abstract translation: 公开了印刷电路板（PCB）。 PCB包括主体。 主体的第一表面是用于电气部件的连接表面。 主体的第二表面是作为接地线操作的导电铜箔层。 多个凹槽布置在导电铜箔层上。 槽通过导电铜箔层连接到PCB的主体。 PCB焊接过程中产生的热应力可以通过槽有效释放。 释放导电铜线圈的膨胀，使得防止PCB被包裹或起泡。 这样，提高了运行效率，降低了制造成本。
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公开(公告)号：US09521739B2
公开(公告)日：2016-12-13
申请号：US14394477
申请日：2014-08-27
Inventor： Jianyong Fu
CPC classification number: H05K1/0215 , H01R4/34 , H01R4/64 , H01R12/51 , H05K1/0216 , H05K3/0005 , H05K3/3452 , H05K2201/10409
Abstract: A printed circuit board (PCB) is provided. From top to bottom, the PCB sequentially includes: a top layer; an upper solder resist layer; a wiring layer; a lower solder resist layer; a bottom layer; and a hole installation part disposed on the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer. Wherein, the hole installation part includes a screw hole and a copper exposing region; a copper foil is disposed on the copper exposing region of the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer; an area of the copper foil is not less than an area of the copper exposing region.
Abstract translation: 提供印刷电路板（PCB）。 从上到下，PCB顺序包括：顶层; 上阻焊层; 布线层; 下阻焊层; 底层; 以及设置在上阻焊层，布线层，下阻焊层和底层上的孔安装部。 其中，孔安装部分包括螺钉孔和铜暴露区域; 在上阻焊层，布线层，下阻焊层和底层的铜暴露区域上设置铜箔; 铜箔的面积不小于铜曝光区域的面积。
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公开(公告)号：US20160050747A1
公开(公告)日：2016-02-18
申请号：US14394477
申请日：2014-08-27
Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNONOGY CO., LTD , Shenzhen China Star Optoelectronics Technology Co. Ltd.
Inventor： Jianyong Fu
CPC classification number: H05K1/0215 , H01R4/34 , H01R4/64 , H01R12/51 , H05K1/0216 , H05K3/0005 , H05K3/3452 , H05K2201/10409
Abstract: A design method for a PCB having multiple screw holes includes steps of: (A) sequentially disposing a top layer, an upper solder resist layer, a wiring layer, a lower solder resist layer, a bottom layer, and a hole installation part on the above layers, wherein, the hole installation part includes a screw hole and a copper exposing region; disposing a hoard-geometry-outline layer and a route keepout layer; (B) disposing a first circle on the route keepout layer, wherein, the first circle is larger than a cross section of the screw hole; (C) disposing a second circle on the geometry outline layer, wherein, the second circle is equal to the cross section of the screw hole; and (D) respectively disposing a copper foil on the copper exposing region of the top layer, the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer.
Abstract translation: 一种用于具有多个螺孔的PCB的设计方法，包括以下步骤：（A）依次将上层，上阻焊层，布线层，下阻焊层，底层和孔安装部分设置在 上述层，其中，所述孔安装部分包括螺孔和铜暴露区域; 布置囤积几何轮廓层和路线保护层; （B）在所述路径保持层上设置第一圆，其中，所述第一圆大于所述螺纹孔的横截面; （C）在所述几何轮廓层上设置第二圆，其中，所述第二圆等于所述螺孔的横截面; 和（D）分别在顶层的铜暴露区域，上阻焊层，布线层，下阻焊层和底层上设置铜箔。
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