公开(公告)号：US10586781B2

公开(公告)日：2020-03-10

申请号：US15373982

申请日：2016-12-09

Applicant: SHINKAWA LTD.

Inventor： Shigeru Hayata ,  Hiroya Yuzawa ,  Hiromi Tomiyama

IPC: H01L21/28 ,  H01L23/00 ,  H01L21/52 ,  H01L21/67 ,  B23K1/00 ,  B23K3/08 ,  B23K101/40

Abstract: A bonding apparatus 10 having a diagonal optical system 30, the bonding apparatus moves a capillary 24 down to a first heightwise position to calculate a position A11 of a tip end portion of the capillary 24 and a position A12 of a tip end portion of the capillary in an image on an imaging plane of the diagonal optical system 30, and similarly moves the capillary 24 down to a further lower second heightwise position to calculate a position A21 of the tip end portion of the capillary 24 and a position A22 of the tip end portion of the capillary in the image on the imaging plane. The bonding apparatus then estimates the position of the landing point of the capillary 24 on a bonding target 8 based on positional data for the four calculated positions A11, A12, A21, and A22, the first heightwise position, and the second heightwise position. With this, it is possible to use the diagonal optical system in the bonding apparatus to further improve positional accuracy in the bonding process.

公开(公告)号：US11367703B2

公开(公告)日：2022-06-21

申请号：US16758859

申请日：2018-09-19

Applicant: SHINKAWA LTD.

Inventor： Hiroya Yuzawa ,  Shigeru Hayata ,  Yuto Hattori

IPC: B23K20/00 ,  H01L23/00 ,  B23K20/02 ,  B23K20/26 ,  H01L23/495 ,  B23K101/40

Abstract: A bonding apparatus is provided. This bonding apparatus uses images captured by an imaging apparatus and performs a packaging process for a semiconductor chip and additional processes other than the packaging process. The bonding apparatus is provided with: an aperture switching mechanism provided in an optical system of the imaging apparatus and capable of switching between a first aperture and a second aperture that has an aperture hole diameter greater than that of the first aperture; and a control unit which controls the aperture switching mechanism to switch to either the first aperture or the second aperture. The control unit performs the packaging process using an image captured by switching to the first aperture and performs the additional processes using an image captured by switching to the second aperture.

公开(公告)号：US10118246B2

公开(公告)日：2018-11-06

申请号：US15632570

申请日：2017-06-26

Applicant: Shinkawa Ltd.

Inventor： Shigeru Hayata ,  Hiroya Yuzawa ,  Yusuke Matsuki

IPC: B23K31/02 ,  B23K37/00 ,  B23K20/00 ,  H01L23/544 ,  H01L23/00 ,  B23K37/04

Abstract: Provided is a bonding apparatus including a bonding stage 83 for heating a substrate (lead frame) 61 placed on the upper surface thereof or a semiconductor die 63 mounted on the substrate (lead frame) 61, an imaging device 20 arranged above the bonding stage 83 to image the substrate 61 placed on the bonding stage 83 or the semiconductor die 63 mounted on the substrate 61, and a standing wave generating device 35 for generating an ultrasonic standing wave in the space between the upper surface of the bonding stage 83 and the imaging device 20. This improves the accuracy of image position detection by the imaging device with a simple structure.