公开(公告)号：US10361166B2

公开(公告)日：2019-07-23

申请号：US15255111

申请日：2016-09-01

Applicant: SHINKAWA LTD.

Inventor： Osamu Kakutani ,  Hidehiro Tazawa ,  Masahito Tuji

IPC: H01L23/00

Abstract: Provided is a bonding apparatus including a table (52), a first reaction member (58A) and a second reaction member (58B), which are each provided movably in a Y axis direction with respect to a pedestal (41). The first and second reaction members are each configured to move in a direction opposite to the table in the Y axis direction when the table moves in the Y axis direction. As viewed in an X axis direction, the first and second reaction members are arranged on both sides of the table, respectively, with the table being interposed between the first and second reaction members, so that the centers of gravity of the first and second reaction members are positioned based on the center of gravity of the table. Consequently, the bonding apparatus can suppress an increase in space, and can improve a weight balance on the pedestal.

公开(公告)号：US10350692B2

公开(公告)日：2019-07-16

申请号：US14597635

申请日：2015-01-15

Applicant: Shinkawa Ltd.

Inventor： Kohei Seyama ,  Yasuhiro Chida ,  Osamu Kakutani

IPC: B23K3/08 ,  H01L23/00 ,  B23K3/047 ,  H05B3/14 ,  H05B3/26 ,  B23K1/00 ,  B23K101/42

Abstract: Provided is a plate-like heater for a bonding apparatus (30) including: a lower surface (31b) to which a bonding tool (40) is attached; and an upper surface (31a) to which a heat insulator (20) is attached. The upper surface (31a) is provided with a large number of capillary slits (35), and the large number of capillary slits (35) and a matching surface (21) of the heat insulator (20) attached to the upper surface (31a) form a large number of capillary coolant flow-paths (37) each extending from a cavity (36) to a lateral surface (33). This allows effective cooling of the heater for a bonding apparatus.

公开(公告)号：US09576927B2

公开(公告)日：2017-02-21

申请号：US14731431

申请日：2015-06-05

Applicant: SHINKAWA LTD.

Inventor： Osamu Kakutani ,  Takatoshi Kawamura ,  Kohei Seyama ,  Akira Sato

IPC: B29C65/00 ,  B32B37/08 ,  B32B43/00 ,  F16K49/00 ,  F16L53/00 ,  H01L23/00 ,  B32B37/06 ,  B29C65/44 ,  B29C65/18 ,  B29K701/10 ,  B29L31/34 ,  B32B37/10

CPC classification number: H01L24/75 ,  B29C65/18 ,  B29C65/44 ,  B29K2701/10 ,  B29L2031/3406 ,  B32B37/06 ,  B32B37/08 ,  B32B37/10 ,  B32B2307/202 ,  B32B2457/14 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/755 ,  H01L2224/75501 ,  H01L2224/75744 ,  H01L2224/75802 ,  H01L2224/75803 ,  H01L2224/75824 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2924/00012

Abstract: A bonding tool cooling apparatus (10) provided in the vicinity of a bonding stage, including a frame (12); a cooling member (16) including a ground plate (14) having a ground surface (14a) on which a front edge surface of a bonding tool (61) is grounded, and a heat radiation fin (15) attached to an opposite surface of the ground plate (14) to the ground surface (14a), wherein the cooling member (16) is supported on the frame (12) by a support mechanism (200) so that the cooling member (16) is rotatable about two axes, i.e., an X axis extending along the ground surface (14a) and a Y axis extending along the ground surface (14a). Bonding tool cooling time can be thereby reduced.

Abstract translation: 一种焊接工具冷却装置（10），设置在包括框架（12）的接合台附近; 包括接地板（14）的冷却构件（16），所述接地板（14）具有接地工具（61）的前边缘表面接地的接地表面（14a），和散热片（15） 所述接地板（14）到达所述地面（14a），其中所述冷却构件（16）通过支撑机构（200）支撑在所述框架（12）上，使得所述冷却构件（16）能够围绕两个轴线旋转， 即沿着地面（14a）延伸的X轴和沿地面（14a）延伸的Y轴。 粘合工具的冷却时间可以降低。

公开(公告)号：US20250088058A1

公开(公告)日：2025-03-13

申请号：US18729728

申请日：2023-01-13

Applicant: Proterial, Ltd. ,  Shinkawa Ltd.

Inventor： Osamu Kakutani ,  Seiki Takedomi ,  Tatsuya Nakano ,  Minoru Yoshida

IPC: H02K3/47 ,  H02K33/18

Abstract: A three-phase coil structure (30) having a two-phase coil set (32) including a plurality of rectangular air-core coils arranged side by side so as to be adjacent to each other in the same plane includes a one-phase coil set (31) including two air-core coils having different sizes and bending angles bent at both ends and disposed to straddle adjacent long sides of the two-phase coil set (32), wherein a number of turns of each of the air-core coils of the one-phase coil set (31) is larger than a number of turns of each of the air-core coils of the two-phase coil set (32).

公开(公告)号：US12080679B2

公开(公告)日：2024-09-03

申请号：US18010458

申请日：2021-08-26

Applicant: SHINKAWA LTD.

Inventor： Toru Maeda ,  Osamu Kakutani

IPC: B23K20/00 ,  B23K20/10 ,  H01L23/00 ,  B23K101/40

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K20/005 ,  B23K20/106 ,  B23K2101/40 ,  H01L2224/78621 ,  H01L2224/78701 ,  H01L2224/78753

Abstract: A bonding apparatus includes: a clamper able to clamp a wire between a pair of arms; a horn, in which a first through hole able to hold a capillary, and a second through hole adjacent to the first through hole and penetrating the horn in an up-down direction are further formed; and a bonding stage able to carry a workpiece. An alignment method for aligning a horn and a damper of a bonding apparatus with each other includes: disposing a mirror surface to be parallel to a bonding stage; aligning a mirror image of a second through hole reflected on the mirror surface with a center of the second through hole when the mirror surface is viewed through the second through hole; and aligning the damper based on a position of the mirror image and the horn.

公开(公告)号：US12057427B2

公开(公告)日：2024-08-06

申请号：US17913441

申请日：2021-02-22

Applicant: SHINKAWA LTD.

Inventor： Osamu Kakutani ,  Shigeru Hayata

IPC: B23K20/00 ,  B23K20/10 ,  H01L23/00 ,  B23K101/40

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K20/10 ,  B23K2101/40 ,  H01L2224/78353 ,  H01L2224/78822 ,  H01L2224/78824 ,  H01L2924/40

Abstract: A wire bonding apparatus (100) includes a bonding stage (12), a bonding head (20), an XY driving mechanism (30), and a frame (50). The XY driving mechanism (30) includes: an X-direction guide (31) installed to the frame (50); an X-direction slider (32), supported by the X-direction guide (31) and moving in the X direction, an X-direction mover (41) being installed thereto; a Y-direction guide (33) installed to a lower side of the X-direction slider (32); and a Y-direction slider (34), supported by the Y-direction guide (33) and moving in the Y direction, the bonding head (20) being installed thereto. The XY driving mechanism (30) is installed to the frame (50), so that a portion of the Y-direction guide (33) is overlapped with a mounting surface (12a) of a bonding stage (12) above the mounting surface (12a) and behind the mounting stage (12) in the Y direction.

公开(公告)号：US10388555B2

公开(公告)日：2019-08-20

申请号：US15247947

申请日：2016-08-26

Applicant: SHINKAWA LTD.

Inventor： Osamu Kakutani ,  Taito Kobayashi ,  Yasushi Sato

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/677 ,  H01L21/687

Abstract: A bonding apparatus, which includes: an intermediate stage; a transfer unit configured to transfer a semiconductor chip and to place the semiconductor chip on the intermediate stage; and a first bonding unit and a second bonding unit each configured to pick up the semiconductor chip from the intermediate stage, and to bond the semiconductor chip to a circuit substrate. The intermediate stage moves between a first position and a second position. The first position is a position at which the first bonding unit is allowed to pick up the semiconductor chip, and the second position is a position at which the second bonding unit is allowed to pick up the semiconductor chip. With this, it is possible to provide a bonding apparatus capable of reducing processing time per circuit substrate and suppressing an increase of a space, as well as such a bonding method.