公开(公告)号：US12261148B2

公开(公告)日：2025-03-25

申请号：US18008179

申请日：2021-06-01

Applicant: SHINKAWA LTD.

Inventor： Shigeru Hayata

IPC: H01L23/00

Abstract: A wire bonding apparatus is provided with: a bonding stage on which a semiconductor chip is mounted; a wire bonding unit including a capillary bonding a bonding wire to the semiconductor chip, a Z-axis drive section reciprocating the capillary, and a tool XY-stage causing the capillary and the Z-axis drive section to be moved along a two-dimensional plane intersecting a direction of reciprocation; and a base having an optical system and an optical system XY-stage causing the optical system to be moved along a two-dimensional plane intersecting a direction of reciprocation, the base having the wire bonding unit attached thereto. The wire bonding unit is attached to a first portion of the base, and the optical system XY-stage is attached to a second portion of the base which is separate from the first portion.

公开(公告)号：US12057427B2

公开(公告)日：2024-08-06

申请号：US17913441

申请日：2021-02-22

Applicant: SHINKAWA LTD.

Inventor： Osamu Kakutani ,  Shigeru Hayata

IPC: B23K20/00 ,  B23K20/10 ,  H01L23/00 ,  B23K101/40

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K20/10 ,  B23K2101/40 ,  H01L2224/78353 ,  H01L2224/78822 ,  H01L2224/78824 ,  H01L2924/40

Abstract: A wire bonding apparatus (100) includes a bonding stage (12), a bonding head (20), an XY driving mechanism (30), and a frame (50). The XY driving mechanism (30) includes: an X-direction guide (31) installed to the frame (50); an X-direction slider (32), supported by the X-direction guide (31) and moving in the X direction, an X-direction mover (41) being installed thereto; a Y-direction guide (33) installed to a lower side of the X-direction slider (32); and a Y-direction slider (34), supported by the Y-direction guide (33) and moving in the Y direction, the bonding head (20) being installed thereto. The XY driving mechanism (30) is installed to the frame (50), so that a portion of the Y-direction guide (33) is overlapped with a mounting surface (12a) of a bonding stage (12) above the mounting surface (12a) and behind the mounting stage (12) in the Y direction.

公开(公告)号：US10816322B2

公开(公告)日：2020-10-27

申请号：US16463379

申请日：2017-07-27

Applicant: SHINKAWA LTD.

Inventor： Shigeru Hayata ,  Hiromi Tomiyama

IPC: G01B11/06 ,  G06T7/00

Abstract: A bonding apparatus having an optical system, an imaging element for acquiring an image formed by the optical system as a picture, an illumination unit for illuminating an electronic component, and a control part for processing the image acquired by the imaging element, the control part illuminating the electronic component through a first inclined optical path inclined with respect to the optical axis of a first portion of the optical system facing the electronic component and acquiring a first image, illuminating the electronic component through a second inclined optical path inclined toward the opposite side from the first inclined optical path with respect to the optical axis and acquiring a second image of the electronic component as a subject, and calculating an amount of variation from a reference height of the electronic component on the basis of the positional offset amount between the first image and the second image.

公开(公告)号：US10586781B2

公开(公告)日：2020-03-10

申请号：US15373982

申请日：2016-12-09

Applicant: SHINKAWA LTD.

Inventor： Shigeru Hayata ,  Hiroya Yuzawa ,  Hiromi Tomiyama

IPC: H01L21/28 ,  H01L23/00 ,  H01L21/52 ,  H01L21/67 ,  B23K1/00 ,  B23K3/08 ,  B23K101/40

Abstract: A bonding apparatus 10 having a diagonal optical system 30, the bonding apparatus moves a capillary 24 down to a first heightwise position to calculate a position A11 of a tip end portion of the capillary 24 and a position A12 of a tip end portion of the capillary in an image on an imaging plane of the diagonal optical system 30, and similarly moves the capillary 24 down to a further lower second heightwise position to calculate a position A21 of the tip end portion of the capillary 24 and a position A22 of the tip end portion of the capillary in the image on the imaging plane. The bonding apparatus then estimates the position of the landing point of the capillary 24 on a bonding target 8 based on positional data for the four calculated positions A11, A12, A21, and A22, the first heightwise position, and the second heightwise position. With this, it is possible to use the diagonal optical system in the bonding apparatus to further improve positional accuracy in the bonding process.

公开(公告)号：US11367703B2

公开(公告)日：2022-06-21

申请号：US16758859

申请日：2018-09-19

Applicant: SHINKAWA LTD.

Inventor： Hiroya Yuzawa ,  Shigeru Hayata ,  Yuto Hattori

IPC: B23K20/00 ,  H01L23/00 ,  B23K20/02 ,  B23K20/26 ,  H01L23/495 ,  B23K101/40

Abstract: A bonding apparatus is provided. This bonding apparatus uses images captured by an imaging apparatus and performs a packaging process for a semiconductor chip and additional processes other than the packaging process. The bonding apparatus is provided with: an aperture switching mechanism provided in an optical system of the imaging apparatus and capable of switching between a first aperture and a second aperture that has an aperture hole diameter greater than that of the first aperture; and a control unit which controls the aperture switching mechanism to switch to either the first aperture or the second aperture. The control unit performs the packaging process using an image captured by switching to the first aperture and performs the additional processes using an image captured by switching to the second aperture.

公开(公告)号：US10262968B2

公开(公告)日：2019-04-16

申请号：US15716525

申请日：2017-09-27

Applicant: SHINKAWA LTD.

Inventor： Shigeru Hayata ,  Satoshi Enokido

IPC: B23K1/00 ,  H01L21/00 ,  H01L23/00 ,  B23K1/06 ,  B23K3/08 ,  B23K35/02 ,  B23K101/40

Abstract: In order to easily and accurately measure an offset for wire bonding and improve precision of wire bonding, a wiring bonding apparatus includes a first imaging unit, a bonding tool, a moving mechanism, a reference member, a second imaging unit arranged on the opposite side to the bonding tool and the first imaging unit with respect to a reference surface, and a control unit. The first imaging unit detects a position of an optical axis of the first image capture unit with respect to a position of the reference member, the second imaging unit detects the position of the reference member when moving the bonding tool above the reference member according to pre-stored offset values, and detects a position of a ball-shaped tip section of a wire, and the control unit measures a change in offset between the bonding tool and the first imaging unit based on each detection result.

公开(公告)号：US10118246B2

公开(公告)日：2018-11-06

申请号：US15632570

申请日：2017-06-26

Applicant: Shinkawa Ltd.

Inventor： Shigeru Hayata ,  Hiroya Yuzawa ,  Yusuke Matsuki

IPC: B23K31/02 ,  B23K37/00 ,  B23K20/00 ,  H01L23/544 ,  H01L23/00 ,  B23K37/04

Abstract: Provided is a bonding apparatus including a bonding stage 83 for heating a substrate (lead frame) 61 placed on the upper surface thereof or a semiconductor die 63 mounted on the substrate (lead frame) 61, an imaging device 20 arranged above the bonding stage 83 to image the substrate 61 placed on the bonding stage 83 or the semiconductor die 63 mounted on the substrate 61, and a standing wave generating device 35 for generating an ultrasonic standing wave in the space between the upper surface of the bonding stage 83 and the imaging device 20. This improves the accuracy of image position detection by the imaging device with a simple structure.