公开(公告)号：US12087725B2

公开(公告)日：2024-09-10

申请号：US17603584

申请日：2020-09-04

Applicant: SHINKAWA LTD.

Inventor： Toshihiko Toyama

IPC: B23K20/00 ,  H01L23/00

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K20/005 ,  H01L2224/78001 ,  H01L2224/78353 ,  H01L2224/78621

Abstract: A wire bonding apparatus of an aspect includes: a clamp apparatus, having a pair of arms; a stage, moving the clamp apparatus in a horizontal direction; a rod member; a contact detection part, detecting contact between the rod member and the clamp apparatus; and a control apparatus, controlling opening and closing of the pair of arms and an operation of the stage and acquiring position information of the clamp apparatus. The control apparatus obtains an opening amount of the pair of arms based on position information of the clamp apparatus at a time when an outer side surface of a first arm contacts the rod member in a state where the pair of arms are closed and position information of the clamp apparatus at the time when the outer side surface of the first arm contacts the rod member in a state where the pair of arms are open.

公开(公告)号：US12154801B2

公开(公告)日：2024-11-26

申请号：US18026589

申请日：2021-10-21

Applicant: SHINKAWA LTD.

Inventor： Toshihiko Toyama ,  Yuu Hasegawa

IPC: B23K20/00 ,  H01L21/67

Abstract: Provided is a wire tension adjuster (60) that adjusts tension (T) applied to a wire (18) of a wire bonding apparatus (100). In the wire tension adjuster (60), in a state in which the wire (18) is gripped by a wire clamper (17), air is supplied to a wire tensioner (40) and a height position (H) of a tip (14f) of a bonding arm (14) is detected, and a flow rate (G) of the air supplied to the wire tensioner (40) is adjusted based on the height position (H) detected, thereby adjusting the tension (T) applied to the wire (18).

公开(公告)号：US12191173B2

公开(公告)日：2025-01-07

申请号：US18026589

申请日：2021-10-21

Applicant: SHINKAWA LTD.

Inventor： Toshihiko Toyama ,  Yuu Hasegawa

IPC: B23K20/00 ,  H01L21/67

Abstract: Provided is a wire tension adjuster (60) that adjusts tension (T) applied to a wire (18) of a wire bonding apparatus (100). In the wire tension adjuster (60), in a state in which the wire (18) is gripped by a wire clamper (17), air is supplied to a wire tensioner (40) and a height position (H) of a tip (14f) of a bonding arm (14) is detected, and a flow rate (G) of the air supplied to the wire tensioner (40) is adjusted based on the height position (H) detected, thereby adjusting the tension (T) applied to the wire (18).