Wire clamp apparatus calibration method and wire bonding apparatus

    公开(公告)号:US11004822B2

    公开(公告)日:2021-05-11

    申请号:US16327340

    申请日:2017-08-23

    Applicant: SHINKAWA LTD.

    Abstract: This wire clamp apparatus calibration method comprises: a step for driving a driving piezoelectric element by applying a predetermined frequency that causes a pair of arm portions to vibrate in an opening/closing direction; a step for detecting whether or not end portions of the pair of arm portions collide with each other on the basis of an output current outputted from the driving piezoelectric element when the pair of arm portions are vibrating in the opening/closing direction; a step for calculating, on the basis of the detection result, reference voltages in a state where the pair of arm portions are closed; and a step for performing calibration of a drive voltage to be applied to the driving piezoelectric element on the basis of the reference voltages. Accordingly, accuracy improvement and stabilization in an opening/closing operation of the wire clamp apparatus can be achieved.

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