Liquid ejecting head and liquid ejecting apparatus

    公开(公告)号:US10513116B2

    公开(公告)日:2019-12-24

    申请号:US15883812

    申请日:2018-01-30

    Abstract: According to an embodiment, an ink jet head includes a pair of actuator plates, a return plate, and a flow passage plate. The pair of actuator plates are disposed to face each other in a Y-direction. In the actuator plate, a plurality of channels which extend in a Z-direction are arranged at a distance in an X-direction. The return plate is disposed on an opening end side of the channels in the pair of actuator plates. A circulation passage which communicates with the channels is formed in the return plate. The flow passage plate is disposed between the pair of actuator plates. An inlet flow passage into which an ink flows and an outlet flow passage which communicates with the circulation passage are arranged in the Z-direction.

    Liquid ejecting head chip, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of liquid ejecting head chip

    公开(公告)号:US10195849B2

    公开(公告)日:2019-02-05

    申请号:US15924707

    申请日:2018-03-19

    Abstract: Channel grooves for a discharge channel and a non-discharge channel are formed in the surface of an actuator plate by cutting. The discharge channel includes an extension portion and a raise-and-cut portion, and the non-discharge channel also includes an extension portion and a raise-and-cut portion. In an embodiment, an electrode clearance groove is formed in advance by cutting with a dicing blade or the like. After the electrode clearance groove is formed, an electrode is formed by plating. Since plating is performed after the electrode clearance groove is formed, a clearance groove electrode is integrally formed with an AP-side common pad in the electrode clearance groove, and thus the clearance groove electrode and the AP-side common pad are short-circuited. Thus, an electrode separation portion is formed by cutting a short-circuited portion of the clearance groove electrode and the AP-side common pad through cutting or irradiation with laser.

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