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1.发明授权公开(公告)号：US09313874B2
公开(公告)日：2016-04-12
申请号：US13922105
申请日：2013-06-19
Applicant: SMART Storage Systems, Inc.
Inventor： David Lee Dean , Robert W. Ellis
IPC: H05K7/20 , H05K1/02 , H05K3/30 , H01L23/367 , H01L21/48 , H01L23/473
CPC classification number: H05K1/0204 , H01L21/4871 , H01L21/4882 , H01L23/367 , H01L2924/0002 , H05K3/303 , Y10T29/4913 , H01L2924/00
Abstract: An electronic system, and a method of manufacture thereof, including: a substrate; an electrical device over the substrate; and a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape characteristic of being formed using an extrusion mechanism.
Abstract translation: 一种电子系统及其制造方法，包括：基板; 基板上的电气装置; 以及靠近电气装置的表面安装散热器，表面安装散热器具有使用挤压机构形成的挤出形状特征。
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Patent Agency Ranking
2.发明申请公开(公告)号：US20140376174A1
公开(公告)日：2014-12-25
申请号：US13922136
申请日：2013-06-19
Applicant: SMART Storage Systems, Inc.
Inventor： David Lee Dean , Dennis Bennett , Robert W. Ellis
IPC: G06F1/20
CPC classification number: G06F1/20 , G01R31/20 , G06F1/186 , H05K1/118 , H05K1/14 , H05K1/144 , H05K1/148 , H05K5/0026 , H05K7/20 , H05K2201/042 , H05K2201/058 , Y10T29/49002
Abstract: An electronic assembly and method of manufacturing includes: an airflow bracket having a circular rail and an airflow tab, the airflow bracket electrically coupling the circular rail and the airflow tab; a top board attached to the circular rail for electrically coupling the top board and the circular rail; and a bottom board attached to the circular rail for electrically coupling the top board and the circular rail, the bottom board positioned to form a thermal channel between the top board and the bottom board for directing air through a vent opening of the circular rail.
Abstract translation: 电子组件和制造方法包括：具有圆形轨道和气流接头的气流支架，气流支架电连接圆形轨道和气流接头; 连接到圆形导轨的顶板，用于电连接顶板和圆形导轨; 以及附接到圆形导轨的底板，用于电连接顶板和圆形导轨，底板被定位成在顶板和底板之间形成热通道，用于引导空气通过圆形导轨的通风口。
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公开(公告)号：US20140253157A1
公开(公告)日：2014-09-11
申请号：US13791797
申请日：2013-03-08
Applicant: SMART STORAGE SYSTEMS, INC.
Inventor： David Lee Dean , Robert W. Ellis , Scott Harrow
CPC classification number: G01R1/44 , G01R1/0458 , G01R3/00 , G01R31/2874 , Y10T29/49117
Abstract: A test system, and a method of manufacture thereof, including: a thermal management head including a heat spreader; an electronic device in direct contact with the heat spreader; and an electrical current for transferring energy between the heat spreader and the electronic device.
Abstract translation: 一种测试系统及其制造方法，包括：热管理头，包括散热器; 与散热器直接接触的电子设备; 以及用于在散热器和电子设备之间传递能量的电流。
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公开(公告)号：US09898056B2
公开(公告)日：2018-02-20
申请号：US13922136
申请日：2013-06-19
Applicant: SMART Storage Systems, Inc.
Inventor： David Lee Dean , Dennis Bennett , Robert W. Ellis
CPC classification number: G06F1/20 , G01R31/20 , G06F1/186 , H05K1/118 , H05K1/14 , H05K1/144 , H05K1/148 , H05K5/0026 , H05K7/20 , H05K2201/042 , H05K2201/058 , Y10T29/49002
Abstract: An electronic assembly and method of manufacturing includes: an airflow bracket having a circular rail and an airflow tab, the airflow bracket electrically coupling the circular rail and the airflow tab; a top board attached to the circular rail for electrically coupling the top board and the circular rail; and a bottom board attached to the circular rail for electrically coupling the top board and the circular rail, the bottom board positioned to form a thermal channel between the top board and the bottom board for directing air through a vent opening of the circular rail.
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公开(公告)号：US09470720B2
公开(公告)日：2016-10-18
申请号：US13791797
申请日：2013-03-08
Applicant: SMART Storage Systems, Inc.
Inventor： David Lee Dean , Robert W. Ellis , Scott Harrow
CPC classification number: G01R1/44 , G01R1/0458 , G01R3/00 , G01R31/2874 , Y10T29/49117
Abstract: A test system, and a method of manufacture thereof, including: a thermal management head including a heat spreader; an electronic device in direct contact with the heat spreader; and an electrical current for transferring energy between the heat spreader and the electronic device.
Abstract translation: 一种测试系统及其制造方法，包括：热管理头，包括散热器; 与散热器直接接触的电子设备; 以及用于在散热器和电子设备之间传递能量的电流。
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6.发明申请公开(公告)号：US20140376190A1
公开(公告)日：2014-12-25
申请号：US13922105
申请日：2013-06-19
Applicant: SMART Storage Systems, Inc.
Inventor： David Lee Dean , Robert W. Ellis
CPC classification number: H05K1/0204 , H01L21/4871 , H01L21/4882 , H01L23/367 , H01L2924/0002 , H05K3/303 , Y10T29/4913 , H01L2924/00
Abstract: An electronic system, and a method of manufacture thereof, including: a substrate; an electrical device over the substrate; and a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape characteristic of being formed using an extrusion mechanism.
Abstract translation: 一种电子系统及其制造方法，包括：基板; 基板上的电气装置; 以及靠近电气装置的表面安装散热器，表面安装散热器具有使用挤压机构形成的挤出形状特征。
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