公开(公告)号：US20240213231A1

公开(公告)日：2024-06-27

申请号：US18599304

申请日：2024-03-08

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Junghwan Jang ,  Giwoong Nam ,  Myongsuk Kang

IPC: H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/00

CPC classification number: H01L25/105 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/214 ,  H01L2225/1035 ,  H01L2225/1058

Abstract: A semiconductor device has a substrate and a first light sensitive material formed over the substrate. A plurality of first conductive posts is formed over the substrate by patterning the first light sensitive material and filling the pattern with a conductive material. A plurality of electrical contacts is formed over the substrate and the conductive posts are formed over the electrical contacts. A first electric component is disposed over the substrate between the first conductive posts. A plurality of second conductive posts is formed over the first electrical component by patterning a second light sensitive material and filling the pattern with conductive material. A first encapsulant is deposited over the first electrical component and conductive posts. A portion of the first encapsulant is removed to expose the first conductive posts. A second electrical component is disposed over the first electrical component and covered with a second encapsulant.

公开(公告)号：US11955467B2

公开(公告)日：2024-04-09

申请号：US17347065

申请日：2021-06-14

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Junghwan Jang ,  Giwoong Nam ,  Myongsuk Kang

IPC: H01L25/10 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/00

CPC classification number: H01L25/105 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/214 ,  H01L2225/1035 ,  H01L2225/1058

Abstract: A semiconductor device has a substrate and a first light sensitive material formed over the substrate. A plurality of first conductive posts is formed over the substrate by patterning the first light sensitive material and filling the pattern with a conductive material. A plurality of electrical contacts is formed over the substrate and the conductive posts are formed over the electrical contacts. A first electric component is disposed over the substrate between the first conductive posts. A plurality of second conductive posts is formed over the first electrical component by patterning a second light sensitive material and filling the pattern with conductive material. A first encapsulant is deposited over the first electrical component and conductive posts. A portion of the first encapsulant is removed to expose the first conductive posts. A second electrical component is disposed over the first electrical component and covered with a second encapsulant.

公开(公告)号：US20230317663A1

公开(公告)日：2023-10-05

申请号：US17657792

申请日：2022-04-04

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Junghwan Jang ,  Giwoong Nam ,  Myongsuk Kang

IPC: H01L23/00

CPC classification number: H01L24/19 ,  H01L24/94 ,  H01L2224/214 ,  H01L2224/19 ,  H01L2224/94 ,  H01L24/20

Abstract: A semiconductor device has a semiconductor die. A first dielectric layer is formed over the semiconductor die. A second dielectric layer is formed over the first dielectric layer. A trench is formed in the second dielectric layer. A via opening is formed to expose a contact pad of the semiconductor die within the trench. A seed layer is formed over the second dielectric layer. The seed layer extends into the trench and via opening. A conductive material is deposited into the via opening and trench. The conductive material is overburdened from the trench. The seed layer around the conductive material is etched in a first etching step. The conductive material is etched in a second etching step.

公开(公告)号：US20220399315A1

公开(公告)日：2022-12-15

申请号：US17347065

申请日：2021-06-14

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Junghwan Jang ,  Giwoong Nam ,  Myongsuk Kang

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00

Abstract: A semiconductor device has a substrate and a first light sensitive material formed over the substrate. A plurality of first conductive posts is formed over the substrate by patterning the first light sensitive material and filling the pattern with a conductive material. A plurality of electrical contacts is formed over the substrate and the conductive posts are formed over the electrical contacts. A first electric component is disposed over the substrate between the first conductive posts. A plurality of second conductive posts is formed over the first electrical component by patterning a second light sensitive material and filling the pattern with conductive material. A first encapsulant is deposited over the first electrical component and conductive posts. A portion of the first encapsulant is removed to expose the first conductive posts. A second electrical component is disposed over the first electrical component and covered with a second encapsulant.