公开(公告)号：US20220157739A1

公开(公告)日：2022-05-19

申请号：US16950295

申请日：2020-11-17

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/56

Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US11862478B2

公开(公告)日：2024-01-02

申请号：US17806924

申请日：2022-06-14

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L21/683 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L23/544

CPC classification number: H01L21/4814 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/544 ,  H01L23/552 ,  H01L2221/6835 ,  H01L2221/68322 ,  H01L2223/54413

Abstract: A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.

公开(公告)号：US11990424B2

公开(公告)日：2024-05-21

申请号：US18303308

申请日：2023-04-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49822

Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US20230275034A1

公开(公告)日：2023-08-31

申请号：US18303308

申请日：2023-04-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak Lee ,  KyungHwan Kim ,  HeeSoo Lee ,  ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49822

Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

公开(公告)号：US20220199423A1

公开(公告)日：2022-06-23

申请号：US17127079

申请日：2020-12-18

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/544 ,  H01L23/552 ,  H01L21/683

Abstract: A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.

公开(公告)号：US20240006335A1

公开(公告)日：2024-01-04

申请号：US17810028

申请日：2022-06-30

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  JinHee Jung ,  OMin Kwon

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565

Abstract: A semiconductor device has a substrate. A semiconductor die is disposed over the substrate. A first encapsulant is deposited over the semiconductor die. A ferromagnetic film is disposed over the first encapsulant. A second encapsulant is deposited over the ferromagnetic film. A shielding layer is optionally formed over the substrate, first encapsulant, and second encapsulant.

公开(公告)号：US20230207485A1

公开(公告)日：2023-06-29

申请号：US18174790

申请日：2023-02-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/56 ,  H01L21/033 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L24/13 ,  H01L21/565 ,  H01L21/0334 ,  H01L23/3107 ,  H01L2924/15313

Abstract: A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.

公开(公告)号：US11616025B2

公开(公告)日：2023-03-28

申请号：US17126621

申请日：2020-12-18

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/56 ,  H01L21/033 ,  H01L23/31

Abstract: A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.

公开(公告)号：US20220310408A1

公开(公告)日：2022-09-29

申请号：US17806924

申请日：2022-06-14

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L21/48 ,  H01L23/552 ,  H01L21/683 ,  H01L23/498 ,  H01L23/31 ,  H01L23/544

Abstract: A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.

公开(公告)号：US12266615B2

公开(公告)日：2025-04-01

申请号：US18174790

申请日：2023-02-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  JinHee Jung ,  OMin Kwon ,  JiWon Lee ,  YuJeong Jang

IPC: H01L23/552 ,  H01L21/033 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor device has a semiconductor package including a substrate comprising a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A fanged metal mask is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The fanged metal mask is removed after forming the shielding layer.