公开(公告)号：US09412928B2

公开(公告)日：2016-08-09

申请号：US13797072

申请日：2013-03-12

Applicant: STMicroelectronics, Inc.

Inventor： William Donley

IPC: H01L35/32 ,  H01L35/28 ,  B32B38/06 ,  B32B38/10

CPC classification number: H01L35/32 ,  B32B38/06 ,  B32B38/10 ,  B32B2310/024 ,  B32B2457/00 ,  H01L35/28 ,  Y10T156/10

Abstract: A thermoelectric device includes a plurality of thin-film thermoelectric elements. Each thin-film thermoelectric element is a Seebeck-Peltier device. The thin-film thermoelectric elements are electrically coupled in parallel with each other. The thermoelectric device may be fabricated using conventional semiconductor processing technologies and may be a thin-film type device.

公开(公告)号：US20130186446A1

公开(公告)日：2013-07-25

申请号：US13797072

申请日：2013-03-12

Applicant: STMicroelectronics, Inc.

Inventor： William Donley

IPC: H01L35/28 ,  H01L35/32

CPC classification number: H01L35/32 ,  B32B38/06 ,  B32B38/10 ,  B32B2310/024 ,  B32B2457/00 ,  H01L35/28 ,  Y10T156/10

Abstract: A thermoelectric device includes a plurality of thin-film thermoelectric elements. Each thin-film thermoelectric element is a Seebeck-Peltier device. The thin-film thermoelectric elements are electrically coupled in parallel with each other. The thermoelectric device may be fabricated using conventional semiconductor processing technologies and may be a thin-film type device.

Abstract translation: 热电装置包括多个薄膜热电元件。 每个薄膜热电元件是Seebeck-Peltier器件。 薄膜热电元件彼此并联电耦合。 热电装置可以使用常规的半导体处理技术制造，并且可以是薄膜型装置。