公开(公告)号：US09627360B2

公开(公告)日：2017-04-18

申请号：US15262304

申请日：2016-09-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

IPC: G01R31/00 ,  H01L25/065 ,  H05K1/11 ,  H05K1/18 ,  H01L21/66 ,  H01L23/00 ,  G11C5/06

CPC classification number: H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

公开(公告)号：US09449716B2

公开(公告)日：2016-09-20

申请号：US14719321

申请日：2015-05-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

IPC: G01R31/00 ,  G11C29/12 ,  H01L23/538 ,  H01L25/18 ,  H05K1/02 ,  G01R31/28 ,  H01L21/66 ,  G11C5/02 ,  H01L23/498 ,  G11C5/06 ,  G11C29/04 ,  H05K1/18 ,  G11C29/56 ,  H01L25/065 ,  H05K1/11 ,  H05K3/28 ,  H05K3/32 ,  H01L23/00 ,  H05K3/00 ,  H05K3/24

CPC classification number: H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

公开(公告)号：US20170018535A1

公开(公告)日：2017-01-19

申请号：US15262304

申请日：2016-09-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

IPC: H01L25/065 ,  G11C5/06 ,  H01L21/66 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

Abstract translation: 提供具有印刷电路板的电子设备。 在一个实施例中，印刷电路板包括要与外部装置耦合的多个外部焊盘和用于测试电路的多个旁路焊盘。 外部焊盘被暴露，并且多个旁路焊盘中的至少一个不暴露于PCB的外表面。 还提供了使用电子设备的系统和测试电子设备的方法。

公开(公告)号：US08659946B2

公开(公告)日：2014-02-25

申请号：US13692334

申请日：2012-12-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Beom-jun Jin ,  Byung-seo Kim ,  Sung-Dong Kim

IPC: G11C16/04 ,  G11C16/06

CPC classification number: H01L27/11582 ,  H01L21/28282 ,  H01L21/308 ,  H01L21/76802 ,  H01L27/11519 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11565 ,  H01L27/11578

Abstract: A NAND based non-volatile memory device can include a plurality of memory cells vertically arranged as a NAND string and a plurality of word line plates each electrically connected to a respective gate of the memory cells in the NAND string. A plurality of word line contacts can each be electrically connected to a respective word line plate, where the plurality of word line contacts are aligned to a bit line direction in the device.

Abstract translation: 基于NAND的非易失性存储器件可以包括垂直地布置为NAND串的多个存储单元和多个字线板，每个字线板电连接到NAND串中的存储器单元的相应栅极。 多个字线触点可以各自电连接到相应的字线板，其中多个字线触点与器件中的位线方向对准。

公开(公告)号：US20150257255A1

公开(公告)日：2015-09-10

申请号：US14719321

申请日：2015-05-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

IPC: H05K1/02 ,  G11C29/04 ,  G11C5/02 ,  G11C5/06 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

公开(公告)号：US20150243371A1

公开(公告)日：2015-08-27

申请号：US14705971

申请日：2015-05-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

IPC: G11C29/12 ,  G01R31/28 ,  H01L25/065 ,  H01L23/498 ,  G11C5/02 ,  H01L25/18

CPC classification number: H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

公开(公告)号：US09171644B2

公开(公告)日：2015-10-27

申请号：US14705971

申请日：2015-05-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

IPC: G01R31/00 ,  G11C29/12 ,  G11C5/02 ,  H01L25/18 ,  H01L25/065 ,  H01L23/498 ,  G01R31/28

CPC classification number: H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

公开(公告)号：US09069036B2

公开(公告)日：2015-06-30

申请号：US14104315

申请日：2013-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

IPC: G01R31/00 ,  G01R31/28 ,  H01L23/538 ,  H05K1/02 ,  H01L21/66 ,  H01L25/065 ,  H01L25/18 ,  H05K1/11 ,  H05K3/28 ,  H05K3/32 ,  H01L23/00

CPC classification number: H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

Abstract translation: 提供具有印刷电路板的电子设备。 在一个实施例中，印刷电路板包括要与外部装置耦合的多个外部焊盘和用于测试电路的多个旁路焊盘。 外部焊盘被暴露，并且多个旁路焊盘中的至少一个不暴露于PCB的外表面。 还提供了使用电子设备的系统和测试电子设备的方法。

公开(公告)号：US20130095653A1

公开(公告)日：2013-04-18

申请号：US13692334

申请日：2012-12-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Beom-jun Jin ,  Byung-seo Kim ,  Sung-Dong Kim

IPC: H01L21/768

CPC classification number: H01L27/11582 ,  H01L21/28282 ,  H01L21/308 ,  H01L21/76802 ,  H01L27/11519 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11565 ,  H01L27/11578

Abstract: A NAND based non-volatile memory device can include a plurality of memory cells vertically arranged as a NAND string and a plurality of word line plates each electrically connected to a respective gate of the memory cells in the NAND string. A plurality of word line contacts can each be electrically connected to a respective word line plate, where the plurality of word line contacts are aligned to a bit line direction in the device.