公开(公告)号：US10728958B2

公开(公告)日：2020-07-28

申请号：US15868451

申请日：2018-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seyun Kim ,  Jinhong Kim ,  Haengdeog Koh ,  Doyoon Kim ,  Hajin Kim ,  Soichiro Mizusaki ,  Minjong Bae ,  Changsoo Lee

IPC: H05B3/14 ,  H05B3/26 ,  C03C4/16 ,  H01C17/30 ,  C03C3/064 ,  H01C17/06

Abstract: A The heating element structure includes: a conductive metal substrate; a heating layer spaced apart from the conductive metal substrate and configured to generate heat in response to an electrical signal; electrodes in contact with the heating layer and configured to provide the electrical signal to the heating layer; and a first insulating layer on the conductive metal substrate, the first insulating layer comprising a first matrix material and a particle, wherein a difference between a coefficient of thermal expansion (CTE) of the first matrix material and a coefficient of thermal expansion of the particle is about 4×10−6 per Kelvin or less.

公开(公告)号：US20240239820A1

公开(公告)日：2024-07-18

申请号：US18329976

申请日：2023-06-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghyun HAN ,  Haengdeog Koh ,  Yoonhyun Kwak ,  Kyungoh Kim ,  Mijeong Kim ,  Jaejun Lee ,  Hasup Lee ,  Kyuhyun IM ,  Sukkoo Hong

IPC: C07F7/22 ,  G03F7/004 ,  G03F7/20

CPC classification number: C07F7/2224 ,  G03F7/0042 ,  G03F7/0048 ,  G03F7/2004

Abstract: Provided are an organometallic compound represented by one of Formulas 1-1 to 1-4 below.






a resist composition including the same, and a pattern forming method using the same. For descriptions of M11, L11 to L14, a11 to a14, R11 to R14, X11 to X14, n11 to n15, Y11 to Y13, and R15 to R17 in Formulas 1-1 to 1-4, refer to the specification.

公开(公告)号：US10893578B2

公开(公告)日：2021-01-12

申请号：US16145753

申请日：2018-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haengdeog Koh ,  Hajin Kim ,  Minjong Bae ,  Doyoon Kim ,  Seyun Kim ,  Jinhong Kim ,  Soichiro Mizusaki ,  Changsoo Lee

IPC: H05B3/14 ,  C08K7/00 ,  C08K3/40 ,  C08K9/06 ,  H01B1/14 ,  C08K9/04 ,  C08K3/22 ,  C03C8/00

Abstract: A composition for forming a heating element; a dried and sintered product thereof; and a method of preparing the composition for forming a heating element, the composition including a matrix particle, a composite filler, and a solvent, wherein the composite filler includes a core and a coating layer disposed on the core, the core includes a nanosheet filler, and the composition has a pH in a range of about 5 to about 9.

公开(公告)号：US20180168000A1

公开(公告)日：2018-06-14

申请号：US15836002

申请日：2017-12-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hiesang Sohn ,  Seyun Kim ,  Haengdeog Koh ,  Doyoon Kim ,  Soichiro Mizusaki ,  Jinhong Kim ,  Hajin Kim ,  Minjong Bae ,  Changsoo Lee

IPC: H05B1/02 ,  H05B3/14 ,  C03C4/14 ,  C03C14/00 ,  B29C70/02 ,  B29C70/88

CPC classification number: H05B1/0263 ,  B29C70/025 ,  B29C70/88 ,  C03C4/14 ,  C03C8/14 ,  C03C8/16 ,  C03C14/004 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/452 ,  C03C2217/48 ,  H05B3/14 ,  H05B3/141 ,  H05B3/146 ,  H05B3/26 ,  H05B2203/013

Abstract: A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.

公开(公告)号：US12239008B2

公开(公告)日：2025-02-25

申请号：US17471474

申请日：2021-09-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haengdeog Koh ,  Hajin Kim ,  Moonil Jung

IPC: H10K85/20 ,  C01B32/16 ,  H01L29/06 ,  H10K10/46

Abstract: A method of preparing a carbon nanotube monolayer film includes applying a bifunctional hydrogen-bond linker onto a substrate to prepare a surface-treated substrate, mixing carbon nanotubes having a heteroatom-containing aromatic polymer coating film with a hydrophobic solvent to obtain a composition and contacting the surface-treated substrate with the composition, and heat-treating the surface-treated substrate contacting the composition.

公开(公告)号：US12041697B2

公开(公告)日：2024-07-16

申请号：US16919792

申请日：2020-07-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hiesang Sohn ,  Seyun Kim ,  Haengdeog Koh ,  Doyoon Kim ,  Soichiro Mizusaki ,  Jinhong Kim ,  Hajin Kim ,  Minjong Bae ,  Changsoo Lee

IPC: H05B1/02 ,  B29C70/02 ,  B29C70/88 ,  C03C4/14 ,  C03C8/04 ,  C03C8/14 ,  C03C8/16 ,  C03C14/00 ,  C03C17/00 ,  H05B3/14 ,  H05B3/26

CPC classification number: H05B1/0263 ,  B29C70/025 ,  B29C70/88 ,  C03C4/14 ,  C03C8/04 ,  C03C8/14 ,  C03C8/16 ,  C03C14/004 ,  C03C17/007 ,  C03C17/008 ,  H05B3/14 ,  H05B3/141 ,  H05B3/146 ,  H05B3/26 ,  C03C2217/452 ,  C03C2217/48 ,  H05B2203/013

Abstract: A heating element includes a plurality of matrix particles and a conductive inorganic filler disposed at interfaces between the plurality of matrix particles to provide a conductive network.

公开(公告)号：US11162687B2

公开(公告)日：2021-11-02

申请号：US15633832

申请日：2017-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changsoo Lee ,  Doyoon Kim ,  Hajin Kim ,  Haengdeog Koh ,  Seyun Kim ,  Jinhong Kim ,  Taehun Kim ,  Soichiro Mizusaki ,  Minjong Bae ,  Hiesang Sohn ,  Kunwoo Choi

IPC: F24C7/06 ,  F24C15/00 ,  A47J37/06 ,  H05B3/26 ,  H05B3/08 ,  F24C7/04 ,  H05B3/14 ,  H05B3/62

Abstract: A planar heating apparatus includes a substrate, first electrodes on the substrate, second electrodes alternately arranged with the first electrodes, an electrode connector connecting end portions of the first or second electrodes to each other and a power connector connected to the electrode connector and to which a power supply is connected. The power connector extends outside of the substrate.

公开(公告)号：US20180136181A1

公开(公告)日：2018-05-17

申请号：US15810229

申请日：2017-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minjong Bae ,  Jinhong Kim ,  Hajin Kim ,  Haengdeog Koh ,  Doyoon Kim ,  Seyun Kim ,  Soichiro MIZUSAKI ,  Hiesang Sohn ,  Changsoo Lee

IPC: G01N33/00 ,  H01B1/14 ,  H01B5/14

CPC classification number: G01N33/0027 ,  G08B17/103 ,  H01B1/14 ,  H01B3/004 ,  H01B3/087 ,  H01B5/14

Abstract: A composite filler structure includes a substrate, a filler layer spaced apart from the substrate and comprising a matrix material layer and a plurality of conductive filler particles, an electrode in contact with the filler layer and configured to provide an electrical signal to the filler layer, and an insulating layer between the substrate and the electrode, and including an alkali oxide in an amount of about 7 weight percent or less, based on a total weight of the composite filler structure.

公开(公告)号：US20240231228A1

公开(公告)日：2024-07-11

申请号：US18326617

申请日：2023-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haengdeog Koh ,  Cheol Kang ,  Yoonhyun Kwak ,  Minsang Kim ,  Sunyoung Lee ,  Changheon Lee ,  Kyuhyun Im ,  Jungha Chae ,  Sunghyun Han

IPC: G03F7/038 ,  C08F12/30 ,  G03F7/004

CPC classification number: G03F7/0382 ,  C08F12/30 ,  G03F7/0045

Abstract: Provided are a resist composition and a method of forming a pattern using the same, the resist composition including an organometallic compound represented by Formula 1 below, and a polymer including a repeating unit represented by Formula 2 below:




wherein, in Formulas 1 and 2, M11, R11, R12, n, A21, L21 to L23, a21 to a23, R21 to R24, b22, p, and X21 are as described in the specification.

公开(公告)号：US20240231223A1

公开(公告)日：2024-07-11

申请号：US18326632

申请日：2023-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haengdeog Koh ,  Yoonhyun Kwak ,  Mijeong Kim ,  Minsang Kim ,  Sunyoung Lee ,  Changheon Lee ,  Kyuhyun Im ,  Jungha Chae ,  Sunghyun Han

IPC: G03F7/004 ,  C07F7/22

CPC classification number: G03F7/0042 ,  C07F7/2208

Abstract: Provided are a resist composition and a method of forming a pattern by using the same, the resist composition including: an organometallic compound represented by Formula 1; and a polymer including a repeating unit containing a radical generating group, a repeating unit containing a radical accepting group, or any combination thereof.


Sn(R11)n(OR12)(4-n)   Formula 1

Descriptions of R11, R12 and n in Formula 1 are provided in the specification.