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公开(公告)号:US11411075B2
公开(公告)日:2022-08-09
申请号:US17189700
申请日:2021-03-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Gihee Cho , Sangyeol Kang , Jungoo Kang , Taekyun Kim , Jiwoon Park , Sanghyuck Ahn , Jin-Su Lee , Hyun-Suk Lee , Hongsik Chae
IPC: H01L49/02 , H01L27/108
Abstract: A semiconductor device and a method of manufacturing the same, the device including a plurality of lower electrodes on a semiconductor substrate; a support pattern connecting the lower electrodes at sides of the lower electrodes; and a dielectric layer covering the lower electrodes and the support pattern, wherein each of the plurality of lower electrodes includes a pillar portion extending in a vertical direction perpendicular to a top surface of the semiconductor substrate; and a protrusion protruding from a sidewall of the pillar portion so as to be in contact with the support pattern, the pillar portion includes a conductive material, the protrusion includes a same conductive material as the pillar portion and is further doped with impurities.
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公开(公告)号:US10257416B2
公开(公告)日:2019-04-09
申请号:US15091855
申请日:2016-04-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minyoung Kim , Kenhyung Park , Changryong Heo , Taekyun Kim , Taeseon Kim
Abstract: A method for setting a camera in an electronic device including at least one photographing module is provided. The method includes detecting environment information through a sensor or a microphone, and changing setting information of at least one photographing module according to the detected environment information.
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公开(公告)号:US10218902B2
公开(公告)日:2019-02-26
申请号:US15091855
申请日:2016-04-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minyoung Kim , Kenhyung Park , Changryong Heo , Taekyun Kim , Taeseon Kim
Abstract: A method for setting a camera in an electronic device including at least one photographing module is provided. The method includes detecting environment information through a sensor or a microphone, and changing setting information of at least one photographing module according to the detected environment information.
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公开(公告)号:US20230253445A1
公开(公告)日:2023-08-10
申请号:US17993943
申请日:2022-11-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hongsik Chae , Taekyun Kim , Jinsu Lee , Yirang Lim , Hanjin Lim , Hyungsuk Jung
IPC: H10B12/00
CPC classification number: H01L28/75 , H01L28/91 , H10B12/315 , H01L28/92 , H10B12/0335
Abstract: A semiconductor device includes: a substrate; a contact plug on the substrate; a lower electrode electrically connected to the contact plug, and including a first electrode layer, a first buffer layer, and a second electrode layer, sequentially stacked; a first support layer in contact with an upper surface of the lower electrode and disposed to overlap at least a portion of the lower electrode, the first support layer extending in a direction parallel to an upper surface of the substrate; a dielectric layer disposed on the lower electrode and the first support layer; and an upper electrode disposed on the dielectric layer. The lower electrode comprises a first region overlapping the first support layer, and having a first height; and a second region not overlapping the first support layer, and having a second height lower than the first height.
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公开(公告)号:US20230217647A1
公开(公告)日:2023-07-06
申请号:US17952386
申请日:2022-09-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hongsik CHAE , Taekyun Kim , Jin-Su Lee , Hyo-Sun Min , Hyungsuk Jung , Jaehyoung Choi , Donguk Han
IPC: H01L27/108 , H01L49/02
CPC classification number: H01L27/10814 , H01L28/90
Abstract: A semiconductor device includes bottom electrodes on a substrate. A supporting pattern is disposed between the bottom electrodes in a plan view. A top electrode covers the bottom electrodes and the supporting pattern. A dielectric layer is disposed between the bottom electrodes and the top electrode and between the supporting pattern and the top electrode. A capping pattern is interposed between the bottom electrodes and the dielectric layer and between the supporting pattern and the dielectric layer. The capping pattern covers at least a portion of a side surface of the supporting pattern and extends to cover a top surface of the supporting pattern and top surfaces of the bottom electrodes.
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公开(公告)号:US11754700B2
公开(公告)日:2023-09-12
申请号:US17261403
申请日:2019-04-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Wuseong Lee , Minwook Kim , Taekyun Kim , Youngho Park , Youngbae Lee , Seungnyun Kim , Yongsang Yun
CPC classification number: G01S13/723 , G01S13/50 , H01Q21/205
Abstract: An electronic device comprises a plurality of array antennas arranged in a plurality of directions, and a control circuit, wherein the control circuit may be set so as to determine a plurality of statuses corresponding to the plurality of directions outside of the electronic device by means of using the plurality of array antennas, deactivate at least one first array antenna if the status of the at least one first array antenna of the plurality of statuses satisfies a first designated condition, activate at least one second array antenna if the status of the at least one second array antenna of the plurality of statuses satisfies a second designated condition, and detect an external object by means of using the at least one second array antenna, when the at least one first array antenna is in a deactivated status.
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公开(公告)号:US12119374B2
公开(公告)日:2024-10-15
申请号:US17857383
申请日:2022-07-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Gihee Cho , Sangyeol Kang , Jungoo Kang , Taekyun Kim , Jiwoon Park , Sanghyuck Ahn , Jin-Su Lee , Hyun-Suk Lee , Hongsik Chae
CPC classification number: H01L28/92 , H10B12/0335 , H10B12/053 , H10B12/315 , H10B12/34 , H10B12/482 , H10B12/488
Abstract: A semiconductor device and a method of manufacturing the same, the device including a plurality of lower electrodes on a semiconductor substrate; a support pattern connecting the lower electrodes at sides of the lower electrodes; and a dielectric layer covering the lower electrodes and the support pattern, wherein each of the plurality of lower electrodes includes a pillar portion extending in a vertical direction perpendicular to a top surface of the semiconductor substrate; and a protrusion protruding from a sidewall of the pillar portion so as to be in contact with the support pattern, the pillar portion includes a conductive material, the protrusion includes a same conductive material as the pillar portion and is further doped with impurities.
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公开(公告)号:US11885554B2
公开(公告)日:2024-01-30
申请号:US17826795
申请日:2022-05-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yongwoo Joo , Hosang Park , Taekyun Kim , Wansu Park , Yountae Shin
CPC classification number: F25D19/04 , F25D23/065
Abstract: A refrigerator includes a first refrigerator including a first cabinet and a second refrigerator including a second cabinet, and operating independently from the first refrigerator. A first connector is installed on the first cabinet; and a second connector is installed on the second cabinet to correspond to the first connector. The second connector is configured to be coupled to the first connector, such that in a state in which the first connector and the second connector are coupled to each other, a movement of the first cabinet in a first direction with respect to the second cabinet is allowed, and a movement of the first cabinet in a second direction with respect to the second cabinet is restricted, with the second direction being perpendicular to the first direction.
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公开(公告)号:US11563280B2
公开(公告)日:2023-01-24
申请号:US16929329
申请日:2020-07-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Taekyun Kim , Haekwon Lee , Taejoon Bae
Abstract: In various embodiments, an electronic device may include: a housing including an inner space, and a first antenna structure disposed in the inner space of the housing, the first antenna structure including: a dielectric substrate, at least one first conductor disposed in a first area of the dielectric substrate, and at least one second conductor disposed in a second area of the dielectric substrate extending from the first area of the dielectric substrate. The electronic device may further include at least one third conductor capacitively coupled with the at least one second conductor, a first wireless communication circuit configured to transmit and/or receive a signal of a first frequency band through the at least one first conductor, and a second wireless communication circuit configured to transmit and/or receive a radio signal of a second frequency band through the at least one second conductor and the at least one third conductor.
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公开(公告)号:US11432389B2
公开(公告)日:2022-08-30
申请号:US17256460
申请日:2019-01-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngbae Lee , Minwook Kim , Taekyun Kim , Wuseong Lee , Seungnyun Kim , Yongsang Yun
IPC: H05B47/115 , H05B45/10 , H05B45/20
Abstract: Disclosed is an electronic device including a housing, a plurality of output devices which are visually exposed through a part of the housing and are disposed at different positions, at least one sensor which is positioned in the housing and disposed at a position adjacent to the positions at which the plurality of output devices are disposed, and a processor. The electronic device may obtain a plurality of first distance values between the plurality of output devices and an object using the at least one sensor, output light through at least one first output device selected from among the plurality of output devices, based on at least one first distance value belonging to values in a first specified range among the plurality of first distance values, obtain a plurality of second distance values between the plurality of output devices and the object using the at least one sensor, and output light through at least one second output device selected from among the plurality of output devices, based on at least one second distance value belonging to values in a second specified range among the plurality of second distance values. In addition, various embodiments understood from the specification are possible.
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