Laminated electronic components for insert molding
    4.
    发明申请
    Laminated electronic components for insert molding 审中-公开
    用于嵌件成型的层压电子部件

    公开(公告)号:US20070257398A1

    公开(公告)日:2007-11-08

    申请号:US11429595

    申请日:2006-05-04

    Inventor: Scott Moncrieff

    Abstract: An insert molded article is disclosed wherein the article comprises a laminated appliqué having as one layer of the laminate an electronic component. In one embodiment, the laminated appliqué includes a first substrate and an electronic component bonded to the first substrate. A second substrate is applied over the electronic component and is bonded to the first substrate. The resulting laminated appliqué may be flat or trimmed and formed into a three-dimensional shape which conforms to the shape of the molded article. The appliqué may then be placed in a mold and molten resin may be injected into the mold cavity over the appliqué to produce a one-piece, permanently bonded article containing the electronic component. Additional layers may be added to the appliqué, such as graphic layers, thermally activated adhesive layers and protective layers. A method of fabricating the insert molded article is also disclosed.

    Abstract translation: 公开了一种嵌入成型制品,其中所述制品包括具有电子部件的层压体的一层的层压贴布。 在一个实施例中,层压贴布包括第一基底和结合到第一基底的电子元件。 将第二基板施加在电子部件上并结合到第一基板。 所得的层压贴布可以是平的或修剪的,并且形成为与模制品的形状一致的三维形状。 然后可以将贴花布放置在模具中,并且熔融树脂可以通过贴布贴合到模具腔中,以产生包含电子部件的单件永久粘合制品。 附加层可以添加到贴花布中,例如图形层,热活化的粘合剂层和保护层。 还公开了一种制造嵌件模制品的方法。

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