公开(公告)号：US11305397B2

公开(公告)日：2022-04-19

申请号：US16430540

申请日：2019-06-04

Applicant: Seagate Technology LLC

Inventor： Andrew Habermas ,  Dat Quach ,  Jeff O'Konski ,  Yuhong Xiong ,  Ricky Anderson ,  Joshua Zierhut

IPC: B24B37/015 ,  B24B37/04 ,  G11B5/31 ,  G11B5/60 ,  B24B37/10

Abstract: The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/−5° C., or even +/−0.5° C.

公开(公告)号：US20190381628A1

公开(公告)日：2019-12-19

申请号：US16430540

申请日：2019-06-04

Applicant: Seagate Technology LLC

Inventor： Andrew Habermas ,  Dat Quach ,  Jeff O'Konski ,  Yuhong Xiong ,  Ricky Anderson ,  Joshua Zierhut

IPC: B24B37/04 ,  G11B5/60 ,  G11B5/31

Abstract: The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/−5° C., or even +/−5° C.