公开(公告)号：US20150099426A1

公开(公告)日：2015-04-09

申请号：US14048326

申请日：2013-10-08

Applicant: Seagate Technology LLC

Inventor： Marc Perry Ronshaugen ,  Gordon Merle Jones ,  Robert Edward Chapin

IPC: B24B37/34 ,  B24B49/00 ,  B24B37/30

CPC classification number: B24B37/345 ,  B24B37/30 ,  B24B49/00

Abstract: A head structure for a lapping assembly including a lapping control feature is disclosed. The lapping control feature includes a raised contact surface elevated from a front surface of the head structure of the lapping assembly. A relative position of the workpiece and raised contact surface are aligned to control workpiece thickness and other lapping parameters. In illustrated embodiments, the relative position of the workpiece and raised contact surface are aligned via an adjustment mechanism on the head structure. In illustrated embodiments, the adjustment mechanism is configured to adjust a position of the workpiece relative to the raised contact surface.

Abstract translation: 公开了一种用于包括研磨控制特征的研磨组件的头部结构。 研磨控制特征包括从研磨组件的头部结构的前表面升高的凸起的接触表面。 对准工件和凸起接触表面的相对位置，以控制工件厚度和其他研磨参数。 在所示实施例中，工件和凸起接触表面的相对位置经由头部结构上的调节机构对准。 在所示实施例中，调节机构构造成调节工件相对于凸起接触表面的位置。

公开(公告)号：US09321143B2

公开(公告)日：2016-04-26

申请号：US14048326

申请日：2013-10-08

Applicant: Seagate Technology LLC

Inventor： Marc Perry Ronshaugen ,  Gordon Merle Jones ,  Robert Edward Chapin

IPC: B24B37/34 ,  B24B37/30 ,  B24B49/00

CPC classification number: B24B37/345 ,  B24B37/30 ,  B24B49/00

Abstract: A head structure for a lapping assembly including a lapping control feature is disclosed. The lapping control feature includes a raised contact surface elevated from a front surface of the head structure of the lapping assembly. A relative position of the workpiece and raised contact surface are aligned to control workpiece thickness and other lapping parameters. In illustrated embodiments, the relative position of the workpiece and raised contact surface are aligned via an adjustment mechanism on the head structure. In illustrated embodiments, the adjustment mechanism is configured to adjust a position of the workpiece relative to the raised contact surface.

Abstract translation: 公开了一种用于包括研磨控制特征的研磨组件的头部结构。 研磨控制特征包括从研磨组件的头部结构的前表面升高的凸起的接触表面。 对准工件和凸起接触表面的相对位置，以控制工件厚度和其他研磨参数。 在所示实施例中，工件和凸起接触表面的相对位置经由头部结构上的调节机构对准。 在所示实施例中，调节机构构造成调节工件相对于凸起接触表面的位置。

公开(公告)号：US20140273764A1

公开(公告)日：2014-09-18

申请号：US13797008

申请日：2013-03-12

Applicant: SEAGATE TECHNOLOGY LLC

Inventor： Marc Perry Ronshaugen ,  Joel W. Hoehn

IPC: B24B37/27 ,  B24B37/04

CPC classification number: B24B37/27 ,  B24B37/048

Abstract: A carrier for a slider row bar for a lapping process. The carrier has a mounting structure comprising a material configured to have a first modulus of at least 1,000,000 Pa at a first period of time and a second modulus of 500 Pa to 500,000 Pa at a second period of time subsequent to the first period. The change from the first modulus to the second modulus is due to an external stimulus on the material.

Abstract translation: 用于研磨过程的滑块排条的载体。 载体具有安装结构，该安装结构包括被配置为在第一时间段内具有至少1,000,000Pa的第一模量并且在第一周期之后的第二时间段具有500Pa至500,000Pa的第二模量的材料。 从第一模量到第二模量的变化是由于材料上的外部刺激。

公开(公告)号：US09017139B2

公开(公告)日：2015-04-28

申请号：US13797008

申请日：2013-03-12

Applicant: Seagate Technology LLC

Inventor： Marc Perry Ronshaugen ,  Joel W. Hoehn

IPC: B24B49/10 ,  B24B37/27 ,  B24B37/04

CPC classification number: B24B37/27 ,  B24B37/048

Abstract: A carrier for a slider row bar for a lapping process. The carrier has a mounting structure comprising a material configured to have a first modulus of at least 1,000,000 Pa at a first period of time and a second modulus of 500 Pa to 500,000 Pa at a second period of time subsequent to the first period. The change from the first modulus to the second modulus is due to an external stimulus on the material.

Abstract translation: 用于研磨过程的滑块排条的载体。 载体具有安装结构，该安装结构包括被配置为在第一时间段内具有至少1,000,000Pa的第一模量并且在第一周期之后的第二时间段具有500Pa至500,000Pa的第二模量的材料。 从第一模量到第二模量的变化是由于材料上的外部刺激。