公开(公告)号：US20250022907A1

公开(公告)日：2025-01-16

申请号：US18736459

申请日：2024-06-06

Applicant: Sharp Display Technology Corporation

Inventor： Rikiya TAKITA ,  Fumiki Nakano ,  Makoto Nakazawa ,  Hiroyuki Moriwaki

IPC: H01L27/146

Abstract: A manufacturing method of a photoelectric conversion panel includes forming a short ring, forming a plurality of data lines connected to a TFT and the short ring, forming a first conductive portion of a bias line connected to the photodiode in an upper layer above the photodiode, electrically blocking the short ring and the TFT from each other by cutting the plurality of data lines after the forming of the first conductive portion, and forming an inorganic insulating film in a blocking portion created by the plurality of data lines being cut.

公开(公告)号：US12253636B2

公开(公告)日：2025-03-18

申请号：US17827087

申请日：2022-05-27

Applicant: Sharp Display Technology Corporation

Inventor： Rikiya Takita ,  Fumiki Nakano ,  Makoto Nakazawa ,  Hiroyuki Moriwaki

IPC: G01T1/20 ,  H01L27/146

Abstract: A photoelectric conversion panel includes multiple thin-film transistors (TFTs) formed on an substrate, photodiodes respectively connected to the TFTs, and a metal layer formed on a light incident side of the photodiodes. The metal layer is formed in a position to overlap a subset of the photodiodes in a plan view.

公开(公告)号：US11714203B2

公开(公告)日：2023-08-01

申请号：US17718711

申请日：2022-04-12

Applicant: Sharp Display Technology Corporation

Inventor： Makoto Nakazawa ,  Rikiya Takita ,  Fumiki Nakano

IPC: G01T1/24 ,  H01L27/146

CPC classification number: G01T1/241 ,  G01T1/248 ,  H01L27/1462 ,  H01L27/14663

Abstract: According to an aspect, an active matrix substrate of an X-ray imaging panel includes: an active matrix substrate having a pixel region including a plurality of pixels; and a scintillator that converts X-rays projected onto the X-ray imaging panel to scintillation light. The plurality of pixels include respective photoelectric conversion elements. The active matrix substrate further includes a first planarizing film that covers the photoelectric conversion elements, is formed from an organic resin film, and has a plurality of first contact holes and a first wiring line that is formed in the first contact holes and in a layer upper than the first planarizing film and connected to the photoelectric conversion elements within the first contact holes.