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公开(公告)号:US20170131167A1
公开(公告)日:2017-05-11
申请号:US15295051
申请日:2016-10-17
Applicant: Silicon Microstructures, Inc.
Inventor: Holger Doering , Stephen C. Terry , Justin Gaynor , Omar Abed , Fernando Alfaro
IPC: G01L9/00
CPC classification number: G01L9/0044 , G01L9/0042 , G01L9/0052 , G01L9/0057 , G01L19/0069
Abstract: Pressure sensors and associated structures that may facilitate the use of automated connection processes and tools. An example may provide structures for aligning interconnect wires to pressure sensor bondpads in order to facilitate the use of automated processes and tools.
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公开(公告)号:US10041851B2
公开(公告)日:2018-08-07
申请号:US15227370
申请日:2016-08-03
Applicant: Silicon Microstructures, Inc.
Inventor: Holger Doering , Stephen C. Terry , Justin Gaynor , Omar Abed , Fernando Alfaro
Abstract: Pressure sensors and their methods of manufacturing, where the pressure sensors have a small, thin form factor and may include features designed to improve manufacturability and where the method of manufacturing may improve yield and reduce overall costs.
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公开(公告)号:US20180099120A1
公开(公告)日:2018-04-12
申请号:US15785024
申请日:2017-10-16
Applicant: Silicon Microstructures, Inc.
Inventor: Holger Doering , Stephen C. Terry , Justin Gaynor , Omar Abed , Fernando Alfaro
CPC classification number: A61M25/0147 , A61B90/06 , A61B2017/00323 , A61B2090/064 , A61B2562/18 , A61B2562/185 , A61M25/0009 , A61M2025/0002 , A61M2025/0166 , G01L9/0042 , G01L9/0052 , G01L19/0069 , G01L27/005
Abstract: Pressure sensors and associated structures that may have reduced light sensitivity. An example may provide structures reducing light at a component on a membrane of a pressure sensor.
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公开(公告)号:US10682498B2
公开(公告)日:2020-06-16
申请号:US15785024
申请日:2017-10-16
Applicant: Silicon Microstructures, Inc.
Inventor: Holger Doering , Stephen C. Terry , Justin Gaynor , Omar Abed , Fernando Alfaro
Abstract: Pressure sensors and associated structures that may have reduced light sensitivity. An example may provide structures reducing light at a component on a membrane of a pressure sensor.
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公开(公告)号:US20170089788A1
公开(公告)日:2017-03-30
申请号:US15227370
申请日:2016-08-03
Applicant: Silicon Microstructures, Inc.
Inventor: Holger Doering , Stephen C. Terry , Justin Gaynor , Omar Abed , Fernando Alfaro
IPC: G01L9/00
CPC classification number: G01L19/14 , G01L9/0044 , G01L9/0057 , G01L19/0069
Abstract: Pressure sensors and their methods of manufacturing, where the pressure sensors have a small, thin form factor and may include features designed to improve manufacturability and where the method of manufacturing may improve yield and reduce overall costs.
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