Three-dimensional laminated integrated circuit

    公开(公告)号:US11244887B2

    公开(公告)日:2022-02-08

    申请号:US16932838

    申请日:2020-07-20

    Applicant: SoftBank Corp.

    Abstract: A three-dimensional stacked integrated circuit includes a plurality of interposers between respective integrated circuits of the three-dimensional stacked integrated circuit and below a lowermost integrated circuit, wherein a plurality of movement paths of a coolant are respectively provided in the plurality of interposers, and the plurality of movement paths of the coolant provided in the plurality of interposers are connected to each other. Alternatively, the three-dimensional stacked integrated circuit is configured by immersion and the system thereof is simplified by the coolant interacting with the outside in grooves provided to the edges of the interposers. In this case, a path for allowing the coolant to flow in the layer direction is not necessary.

    Area construction method
    5.
    发明授权

    公开(公告)号:US11997506B2

    公开(公告)日:2024-05-28

    申请号:US17244967

    申请日:2021-04-30

    Applicant: SoftBank Corp.

    Inventor: Takashi Tsutsui

    CPC classification number: H04W16/18 H04W16/28

    Abstract: There is provided an area construction method for providing a 5G mobile wireless communication network service (hereinafter, referred to as a 5G service) using a millimeter wave, in which a wireless communication area is constructed by using line-of-sight propagation of a radio wave which is emitted by using a beam-forming technology from a base station, and rough surface scattering of the radio wave by a road surface, rather than by using a diffraction phenomenon of the radio wave which causes a large loss, and by using a U-shaped UE relay or CPE.

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