公开(公告)号：US20180257837A1

公开(公告)日：2018-09-13

申请号：US15980878

申请日：2018-05-16

Applicant: Sonoco Development, Inc.

Inventor： Dave Larsen

IPC: B65D75/58 ,  B65D75/36

CPC classification number: B65D75/585 ,  B65D75/366 ,  B65D2585/88

Abstract: A fold open face seal package is provided. The package may comprise a one or two-piece thermoformed blister adhered to a backing card. In the one piece embodiment upper and lower portions of the blister are connected by one or more hinges. In the two-piece embodiment the blister is cut into upper and lower pieces which are adhered to the backing card. The package may be opened by folding the backing card back along a bend line and then reclosed for later use.

公开(公告)号：US10683152B2

公开(公告)日：2020-06-16

申请号：US15980878

申请日：2018-05-16

Applicant: Sonoco Development, Inc.

Inventor： Dave Larsen

IPC: B65D75/58 ,  B65D75/36

Abstract: A fold open face seal package is provided. The package may comprise a one or two-piece thermoformed blister adhered to a backing card. In the one piece embodiment upper and lower portions of the blister are connected by one or more hinges. In the two-piece embodiment the blister is cut into upper and lower pieces which are adhered to the backing card. The package may be opened by folding the backing card back along a bend line and then reclosed for later use.

公开(公告)号：US10221000B2

公开(公告)日：2019-03-05

申请号：US14963463

申请日：2015-12-09

Applicant: Sonoco Development, Inc.

Inventor： Dave Larsen

IPC: B65D75/58 ,  B65D75/36

Abstract: A fold open face seal package is provided. The package may comprise a one or two-piece thermoformed blister adhered to a backing card. In the one piece embodiment upper and lower portions of the blister are connected by one or more hinges. In the two-piece embodiment the blister is cut into upper and lower pieces which are adhered to the backing card. The package may be opened by folding the backing card back along a bend line and then reclosed for later use.

公开(公告)号：US20170166379A1

公开(公告)日：2017-06-15

申请号：US14963463

申请日：2015-12-09

Applicant: Sonoco Development, Inc.

Inventor： Dave Larsen

IPC: B65D75/58 ,  B65D75/36

CPC classification number: B65D75/585 ,  B65D75/366 ,  B65D2585/88

Abstract: A fold open face seal package is provided. The package may comprise a one or two-piece thermoformed blister adhered to a backing card. In the one piece embodiment upper and lower portions of the blister are connected by one or more hinges. In the two-piece embodiment the blister is cut into upper and lower pieces which are adhered to the backing card. The package may be opened by folding the backing card back along a bend line and then reclosed for later use.

公开(公告)号：US10850903B2

公开(公告)日：2020-12-01

申请号：US16183931

申请日：2018-11-08

Applicant: Sonoco Development, Inc.

Inventor： Dave Larsen

IPC: B65D75/58 ,  B65D75/36

Abstract: A fold open face seal package is provided. The package may comprise a one or two-piece thermoformed blister adhered to a backing card. In the one piece embodiment upper and lower portions of the blister are connected by one or more hinges. In the two-piece embodiment the blister is cut into upper and lower pieces which are adhered to the backing card. The package may be opened by folding the backing card back along a bend line and then reclosed for later use.

公开(公告)号：US20190071231A1

公开(公告)日：2019-03-07

申请号：US16183931

申请日：2018-11-08

Applicant: Sonoco Development, Inc.

Inventor： Dave Larsen

IPC: B65D75/58 ,  B65D75/36

Abstract: A fold open face seal package is provided. The package may comprise a one or two-piece thermoformed blister adhered to a backing card. In the one piece embodiment upper and lower portions of the blister are connected by one or more hinges. In the two-piece embodiment the blister is cut into upper and lower pieces which are adhered to the backing card. The package may be opened by folding the backing card back along a bend line and then reclosed for later use.