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    Photoelectric module and optical device
    1.
    发明授权
    Photoelectric module and optical device 有权

    公开(公告)号：US10483413B2

    公开(公告)日：2019-11-19

    申请号：US15303111

    申请日：2015-04-23

    Applicant: Sony Corporation

    Inventor： Hiizu Ootorii ,  Kazunao Oniki ,  Koki Uchino ,  Hideyuki Suzuki ,  Hiroshi Ozaki ,  Kazuki Sano ,  Eiji Otani ,  Shinji Rokuhara ,  Kiwamu Adachi ,  Shuichi Oka ,  Shusaku Yanagawa ,  Hiroshi Morita ,  Takeshi Ogura

    IPC: H01L31/0232 ,  G02B6/42

    Abstract: A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.

    OPTICAL COMMUNICATION DEVICE, TRANSMISSION APPARATUS, RECEPTION APPARATUS, AND TRANSMISSION AND RECEPTION SYSTEM
    3.
    发明申请
    OPTICAL COMMUNICATION DEVICE, TRANSMISSION APPARATUS, RECEPTION APPARATUS, AND TRANSMISSION AND RECEPTION SYSTEM 有权
    光通信设备，传输设备，接收设备，传输和接收系统

    公开(公告)号：US20150139590A1

    公开(公告)日：2015-05-21

    申请号：US14519678

    申请日：2014-10-21

    Applicant: Sony Corporation

    Inventor： Kazunao Oniki ,  Hiizu Ootorii ,  Eiji Otani

    IPC: G02B6/38 ,  G02B6/42 ,  G02B6/43 ,  H04B10/50 ,  H04B10/60

    CPC classification number: G02B6/3853 ,  G02B6/4249 ,  G02B6/4292

    Abstract: There is provided an optical communication device including a lens substrate configured to have a first face on which a plurality of lenses corresponding to a plurality of channels of optical communication are two-dimensionally formed, and a ferrule configured to be disposed facing a second face that is the opposite face of the first face of the lens substrate and to be provided with through holes into which optical fibers are inserted in positions corresponding to each of the plurality of lenses.

    Abstract translation: 提供了一种光通信装置，其包括透镜基板，该透镜基板被配置为具有第二面，多个透镜对应于多个光通信通道二维地形成在其上，第一面被配置为面对第二面设置的套圈， 是透镜基板的第一面的相对面，并且设置有光纤插入到与多个透镜中的每一个对应的位置的通孔。

    OPTICAL COMMUNICATION DEVICE, RECEPTION APPARATUS, TRANSMISSION APPARATUS, AND TRANSMISSION AND RECEPTION SYSTEM
    4.
    发明申请
    OPTICAL COMMUNICATION DEVICE, RECEPTION APPARATUS, TRANSMISSION APPARATUS, AND TRANSMISSION AND RECEPTION SYSTEM 审中-公开

    公开(公告)号：US20190094477A1

    公开(公告)日：2019-03-28

    申请号：US16199908

    申请日：2018-11-26

    Applicant: Sony Corporation

    Inventor： Shinji Rokuhara ,  Shusaku Yanagawa ,  Eiji Otani ,  Shuichi Oka ,  Kazunao Oniki ,  Hiizu Ootorii

    IPC: G02B6/42 ,  H01L31/0232 ,  H01S5/00 ,  G02B6/43 ,  H04Q11/00 ,  H01L31/0203

    Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.

    Transmission module, transmission cable, and connector
    6.
    发明授权
    Transmission module, transmission cable, and connector 有权
    传输模块，传输电缆和连接器

    公开(公告)号：US09553383B2

    公开(公告)日：2017-01-24

    申请号：US15207705

    申请日：2016-07-12

    Applicant: Sony Corporation

    Inventor： Kazunao Oniki

    IPC: H01R12/00 ,  H01R12/77 ,  H01R13/66

    CPC classification number: H01R12/775 ,  H01R13/665 ,  Y10T29/49204

    Abstract: A transmission module, a transmission cable, and a connector are provided. The transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a transmission cable component including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line are provided, wherein the cable side ground layer disposed at least at lower and upper sides of the signal line is folded, wherein a connector side ground layer electrically connected to the ground terminal is provided on the connector side substrate, and wherein the connector side ground layer disposed at least at lower and upper sides of an area where electromagnetic noises are generated is folded.

    Abstract translation: 提供传输模块，传输电缆和连接器。 传输模块包括具有连接器侧基板的连接器部件，连接器侧基板具有包括接地端子和数据端子的端子部件，以及传输电缆部件，其包括具有柔性的电缆侧基板，电缆侧接地层电连接到地面 端子和信号线，其中设置在信号线的至少下侧和上侧的电缆侧接地层被折叠，其中在连接器侧基板上设置电连接到接地端子的连接器侧接地层，并且 其中至少设置在产生电磁噪声的区域的下侧和上侧的连接器侧接地层被折叠。

    Transmission module, shielding method, transmission cable, and connector
    7.
    发明授权
    Transmission module, shielding method, transmission cable, and connector 有权
    传输模块，屏蔽方式，传输电缆和连接器

    公开(公告)号：US09407023B2

    公开(公告)日：2016-08-02

    申请号：US14286204

    申请日：2014-05-23

    Applicant: Sony Corporation

    Inventor： Kazunao Oniki

    IPC: H01R12/00 ,  H01R12/77

    CPC classification number: H01R12/775 ,  H01R13/665 ,  Y10T29/49204

    Abstract: A transmission module includes a connector component including a connector side substrate having a terminal component including a ground terminal and a data terminal, and a signal processing component mounted on the connector side substrate for processing a high frequency signal having a frequency higher than that of a data signal inputted or outputted via the data terminal; and a transmission cable component for transmitting the high frequency signal including a cable side substrate having a flexibility on which a cable side ground layer electrically connected to the ground terminal and a signal line to which the high frequency signal is transmitted are formed, the cable side ground layer being disposed at least at lower and upper sides of the signal line as a part including the cable side ground layer of the cable side substrate is folded.

    Abstract translation: 传输模块包括具有连接器侧基板的连接器部件，该连接器侧基板具有包括接地端子和数据端子的端子部件，以及安装在连接器侧基板上的信号处理部件，用于处理频率高于 经由数据终端输入或输出的数据信号; 以及传输电缆部件，用于发送包括电缆侧基板的高频信号，所述电缆侧基板具有电连接到接地端子的电缆侧接地层和传输高频信号的信号线的柔性，电缆侧 折叠作为包括电缆侧基板的电缆侧接地层的部分的至少在信号线的下侧和上侧设置接地层。

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