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公开(公告)号：US11765531B2
公开(公告)日：2023-09-19
申请号：US17372745
申请日：2021-07-12
Applicant: Starkey Laboratories, Inc.
Inventor： Douglas F. Link , David Prchal , Sidney A. Higgins
IPC: H04R25/00
CPC classification number: H04R25/609 , H04R25/604 , H04R25/65 , H04R25/603
Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
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公开(公告)号：US10448176B2
公开(公告)日：2019-10-15
申请号：US16058335
申请日：2018-08-08
Applicant: Starkey Laboratories, Inc.
Inventor： Douglas F. Link , David Prchal , Sidney A. Higgins
IPC: H04R25/00
Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
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公开(公告)号：US20180352347A1
公开(公告)日：2018-12-06
申请号：US16058335
申请日：2018-08-08
Applicant: Starkey Laboratories, Inc.
Inventor： Douglas F. Link , David Prchal , Sidney A. Higgins
IPC: H04R25/00
CPC classification number: H04R25/604 , H04R25/60 , H04R25/65
Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
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公开(公告)号：US20170318402A1
公开(公告)日：2017-11-02
申请号：US15595302
申请日：2017-05-15
Applicant: Starkey Laboratories, Inc.
Inventor： Douglas F. Link , David Prchal , Sidney A. Higgins
IPC: H04R25/00
CPC classification number: H04R25/604 , H04R25/60 , H04R25/65
Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
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公开(公告)号：US09906879B2
公开(公告)日：2018-02-27
申请号：US14692849
申请日：2015-04-22
Applicant: Starkey Laboratories, Inc.
Inventor： David Prchal , Susie Johansson , John Dzarnoski
IPC: H04R25/00
CPC classification number: H04R25/608 , H04R25/658 , H04R2225/021 , H04R2225/023 , H04R2225/025 , H04R2420/09 , Y10T29/49117
Abstract: Disclosed herein, among other things, are systems and methods for solderless module connectors for hearing assistance devices. One aspect of the present subject matter includes a method of assembling a hearing assistance device. According to various embodiments, the method includes providing a structure including a laser-direct structuring (LDS) portion, and inserting a flexible universal circuit module (UCM) having conductive surface traces into the structure. The UCM is electrically connected to the LDS portion using direct compression without the use of wires or solder, according to various embodiments.
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Patent Agency Ranking
公开(公告)号：US20150086051A1
公开(公告)日：2015-03-26
申请号：US14257537
申请日：2014-04-21
Applicant: Starkey Laboratories, Inc.
Inventor： Douglas F. Link , David Prchal , Sidney A. Higgins
IPC: H04R25/00
CPC classification number: H04R25/604 , H04R25/60 , H04R25/65
Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
Abstract translation: 一种助听器，包括麦克风，接收器，耦合到麦克风和接收器的助听器电子器件以及覆盖绝缘体的导电迹线，导电迹线被配置为互连助听器电子设备并且跟随绝缘体的非平面轮廓。 提供了其中绝缘体包括助听器外壳的实例。
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公开(公告)号：US20240031748A1
公开(公告)日：2024-01-25
申请号：US18366967
申请日：2023-08-08
Applicant: Starkey Laboratories, Inc.
Inventor： Douglas F. Link , David Prchal , Sidney A. Higgins
IPC: H04R25/00
CPC classification number: H04R25/609 , H04R25/65 , H04R25/604 , H04R25/603
Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
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公开(公告)号：US11064304B2
公开(公告)日：2021-07-13
申请号：US16599524
申请日：2019-10-11
Applicant: Starkey Laboratories, Inc.
Inventor： Douglas F. Link , David Prchal , Sidney A. Higgins
IPC: H04R25/00
Abstract: A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
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公开(公告)号：US09913052B2
公开(公告)日：2018-03-06
申请号：US14092723
申请日：2013-11-27
Applicant: Starkey Laboratories, Inc.
Inventor： John Dzarnoski , Susie Krzmarzick , Douglas F. Link , David Prchal
CPC classification number: H04R25/608 , H01R12/7076 , H01R12/714 , H01R13/2414 , H01R2201/12 , H04R25/658 , H04R31/00 , H04R2225/021 , H04R2225/023 , H04R2225/025 , Y10T29/49005
Abstract: Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect of the present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing.
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公开(公告)号：US20150230035A1
公开(公告)日：2015-08-13
申请号：US14692849
申请日：2015-04-22
Applicant: Starkey Laboratories, Inc.
Inventor： David Prchal , Susie Johansson , John Dzarnoski
IPC: H04R25/00
CPC classification number: H04R25/608 , H04R25/658 , H04R2225/021 , H04R2225/023 , H04R2225/025 , H04R2420/09 , Y10T29/49117
Abstract: Disclosed herein, among other things, are systems and methods for solderless module connectors for hearing assistance devices. One aspect of the present subject matter includes a method of assembling a hearing assistance device. According to various embodiments, the method includes providing a structure including a laser-direct structuring (LDS) portion, and inserting a flexible universal circuit module (UCM) having conductive surface traces into the structure. The UCM is electrically connected to the LDS portion using direct compression without the use of wires or solder, according to various embodiments.
Abstract translation: 这里公开的是用于听力辅助装置的无焊模块连接器的系统和方法。 本主题的一个方面包括组装听力辅助装置的方法。 根据各种实施例，该方法包括提供包括激光直接结构（LDS）部分和将具有导电表面迹线的柔性通用电路模块（UCM）插入到该结构中的结构。 根据各种实施例，UCM使用直接压缩电连接到LDS部分，而不使用电线或焊料。
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