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公开(公告)号：US09907178B2
公开(公告)日：2018-02-27
申请号：US15013128
申请日：2016-02-02
Applicant: SunASIC Technologies, Inc.
Inventor： Chi-Chou Lin
CPC classification number: H05K1/182 , B42D25/313 , G06K9/0002 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/18 , H01L2224/32245 , H01L2224/73267 , H01L2224/92244 , H05K1/115 , H05K1/183 , H05K3/0044 , H05K3/4046 , H05K3/421 , H05K3/4623 , H05K3/4697 , H05K2201/0187 , H05K2201/0919 , H05K2201/09845 , H05K2201/10106 , H05K2201/10121 , H05K2201/10287 , H05K2203/0228 , Y10T29/49018 , Y10T29/49117 , Y10T29/4913
Abstract: A printed circuit board having an electronic component embedded is disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.
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公开(公告)号：US10168450B2
公开(公告)日：2019-01-01
申请号：US14141717
申请日：2013-12-27
Applicant: SunASIC Technologies, Inc.
Inventor： Chi-Chou Lin , Zheng-Ping He
IPC: H01L23/544 , H01L21/76 , G02B1/00 , G02B5/18 , G02B5/20
Abstract: A silicon wafer having colored top side is disclosed in the present invention. The silicon wafer includes: a wafer; a first semi-conductor layer, formed on at least a portion of a top side of the wafer, having periodical structures to form a grating pattern, and a second semi-conductor layer, formed on the first semi-conductor layer with a bottom side substantially fully contacted with the periodical structures. The first semi-conductor layer and the second semi-conductor layer form a photonic crystal layer and work to reflect a predetermined wavelength range of incident visible light beams. The present invention provides a silicon wafer which can reflect specified color(s) from the surface facing external light beams. Therefore, dies from cutting the silicon wafer with functions to interact with external environment rather than packaged can have advantages to show some specified logo or trademark.
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公开(公告)号：US09836636B2
公开(公告)日：2017-12-05
申请号：US15189022
申请日：2016-06-22
Applicant: SunASIC Technologies, Inc.
Inventor： Chi-Chou Lin , Zheng-Ping He
IPC: G06K9/00 , H01L27/146
CPC classification number: G06K9/0002 , H01L27/14609 , H01L27/14612
Abstract: A capacitive image sensor and a method for running the capacitive image sensor are disclosed. The capacitive image sensor includes a number of capacitive sensing elements, forming an array, each capacitive sensing element for transforming a distance between a portion of a surface of an approaching finger and a top surface thereof into an output voltage, wherein a value of the output voltage is changed by a driving signal exerted on the finger; an A/D converter, for converting the output voltage into a number and outputting the number; and a signal source, for providing the driving signal to the finger.
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公开(公告)号：US09723353B2
公开(公告)日：2017-08-01
申请号：US15070295
申请日：2016-03-15
Applicant: SunASIC Technologies, Inc.
Inventor： Chi-Chou Lin , Zheng-Ping He
IPC: H04N7/16 , H04N7/173 , H04N5/44 , H04N21/422 , H04N21/4415 , G06K9/00 , G08C23/04 , H04N21/475 , G08C17/02
CPC classification number: H04N21/42222 , G06K9/0002 , G06K9/00093 , G08C17/02 , G08C23/04 , G08C2201/30 , G08C2201/61 , H04N21/4415 , H04N21/4751
Abstract: A remote control for a smart TV or a set-top box is disclosed. The remote control includes a capacitive fingerprint sensor, a processor and a wireless transmitter. The present invention takes advantages of the capacitive fingerprint sensor so that every user's personal data and corresponding setting for the smart TV or set-top box are available. Channel (or web-site) content rating can be achieved. Purchasing over TV can be safer than ever.
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5.发明授权Method for forming stacked metal contact in electrical communication with aluminum wiring in semiconductor wafer of integrated circuit 有权在集成电路的半导体晶片中与铝布线电连接形成叠层金属接触的方法公开(公告)号：US09331033B1
公开(公告)日：2016-05-03
申请号：US14580960
申请日：2014-12-23
Applicant: SunASIC Technologies, Inc.
Inventor： Chi-Chou Lin , Zheng-Ping He
IPC: H01L23/00 , H01L21/3213 , H01L23/04
CPC classification number: H01L24/03 , H01L21/32134 , H01L23/04 , H01L23/3192 , H01L24/05 , H01L24/27 , H01L2224/03916 , H01L2224/0401 , H01L2224/04042 , H01L2924/01022 , H01L2924/01024 , H01L2924/0103 , H01L2924/01073 , H01L2924/01074 , H01L2924/0493 , H01L2924/04953
Abstract: A method for forming a stacked metal contact in electrical communication with aluminum wiring in a semiconductor wafer of an integrated circuit is disclosed. The method includes the steps of: forming at least one passivation layer on a surface of the semiconductor wafer of the integrated circuit, where an aluminum wiring is embedded; forming a patterned terminal via opening through the passivation layer to expose the aluminum wiring; removing a portion of the aluminum wiring from the patterned terminal via opening by chemical etching and forming a thin zinc film on an etched surface at the same time; forming a nickel film stacked on the zinc film; and; and forming a metal stack in the patterned terminal via opening and/or at least a portion of the passivation layer by chemical plating or metal plating.
Abstract translation: 公开了一种在集成电路的半导体晶片中形成与铝布线电连通的层叠金属触点的方法。 该方法包括以下步骤：在嵌入铝布线的集成电路的半导体晶片的表面上形成至少一个钝化层; 通过所述钝化层的开口形成图案化的端子以暴露所述铝布线; 通过化学蚀刻通过开口从图案化端子去除一部分铝布线，同时在蚀刻表面上形成薄锌膜; 形成层叠在所述锌膜上的镍膜; 和; 以及通过化学电镀或金属电镀通过开孔和/或至少一部分钝化层在图案化的端子中形成金属堆叠。
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Patent Agency Ranking
公开(公告)号：US20220132053A1
公开(公告)日：2022-04-28
申请号：US17076908
申请日：2020-10-22
Applicant: SunASIC Technologies, Inc.
Inventor： Chi-Chou Lin , Zheng-Ping He
Abstract: An image sensing device that can adjust parameters of an image before sending it to a processor for reducing computing power and/or storage requirement is disclosed. The image sensing device includes an array of sensing pixels; an output amplifier; an analog-to-digital converter; a first set of registers and a second set of registers; an activation circuit; and a profiling logic. The profiling logic conducts statistical analysis on output data and adjusts parameters stored in the first set of registers until results of the statistical analysis reaches a target standard, wherein the adjusted parameters are used to generate an output image by each sensing pixel of the array of sensing pixels once the target standard is reached and a notification signal is sent to an external device for notifying the failure of parameter adjustment if the target standard fails to be reached within a predetermined times of adjustment.
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公开(公告)号：US09305202B2
公开(公告)日：2016-04-05
申请号：US13845237
申请日：2013-03-18
Applicant: SunASIC Technologies, Inc.
Inventor： Chi-Chou Lin
IPC: G06K9/00
CPC classification number: G06K9/00053
Abstract: A portable device having fingerprint recognition function includes an image sensing unit, a microprocessor, a signal transmitting unit, a carrying member, a cleaning unit, and a housing. It is characterized that the cleaning unit removes residual fingerprint from the image sensing unit while the carrying member moves in and out of the housing. The portable device of the present invention is free from fingerprint residue and can reduce security risks.
Abstract translation: 具有指纹识别功能的便携式设备包括图像感测单元，微处理器，信号发送单元，承载构件，清洁单元和外壳。 其特征在于，当携带构件移入和移出壳体时，清洁单元从图像感测单元中去除残留的指纹。 本发明的便携式设备没有指纹残留并且可以降低安全风险。
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公开(公告)号：US09281339B1
公开(公告)日：2016-03-08
申请号：US14488814
申请日：2014-09-17
Applicant: SunASIC Technologies, Inc.
Inventor： Chi-Chou Lin , Zheng-Ping He
IPC: H01L27/146 , H01L21/48 , H01L23/538
CPC classification number: H01L27/1469 , H01L21/4857 , H01L21/4867 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L27/146 , H01L2224/0401 , H01L2224/04105 , H01L2224/24227 , H01L2224/32225 , H01L2224/484 , H01L2224/73267 , H01L2224/92244 , H01L2924/15153
Abstract: A method for mounting a chip on a printed circuit board (PCB) is disclosed. The method includes the steps of: providing a chip having a plurality of bonding pads and a PCB having a recess portion and a plurality of connectors; gluing the recess portion; placing the chip into the recess portion; and forming circuit patterns linking associated bonding pad and connector. A bottom of the recess portion is substantially flat and a shape of the recess portion is similar to that of the chip but large enough so that the chip can be fixed in the recess portion after being glued.
Abstract translation: 公开了一种将芯片安装在印刷电路板（PCB）上的方法。 该方法包括以下步骤：提供具有多个接合焊盘的芯片和具有凹部和多个连接器的PCB; 胶合所述凹部; 将所述芯片放置在所述凹部中; 以及形成连接相关联的焊盘和连接器的电路图案。 凹部的底部基本上是平坦的，并且凹部的形状与芯片的形状相似但足够大，使得芯片可以在胶合之后固定在凹部中。
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公开(公告)号：US11659288B2
公开(公告)日：2023-05-23
申请号：US17076908
申请日：2020-10-22
Applicant: SunASIC Technologies, Inc.
Inventor： Chi-Chou Lin , Zheng-Ping He
IPC: H04N25/75 , G06V40/13 , H04N25/42 , H04N25/44 , H04N25/50 , H04N25/57 , H04N25/59 , H04N25/70 , H04N25/40 , H04N25/77 , H04N25/78 , H04N25/51 , G06V10/98
CPC classification number: H04N25/44 , G06V40/1306 , H04N25/40 , H04N25/42 , H04N25/50 , H04N25/51 , H04N25/57 , H04N25/59 , H04N25/70 , H04N25/75 , H04N25/77 , H04N25/78 , G06V10/993
Abstract: An image sensing device that can adjust parameters of an image before sending it to a processor for reducing computing power and/or storage requirement is disclosed. The image sensing device includes an array of sensing pixels; an output amplifier; an analog-to-digital converter; a first set of registers and a second set of registers; an activation circuit; and a profiling logic. The profiling logic conducts statistical analysis on output data and adjusts parameters stored in the first set of registers until results of the statistical analysis reaches a target standard, wherein the adjusted parameters are used to generate an output image by each sensing pixel of the array of sensing pixels once the target standard is reached and a notification signal is sent to an external device for notifying the failure of parameter adjustment if the target standard fails to be reached within a predetermined times of adjustment.
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公开(公告)号：US10121043B2
公开(公告)日：2018-11-06
申请号：US14543936
申请日：2014-11-18
Applicant: SunASIC Technologies, Inc.
Inventor： Chi-Chou Lin , Zheng-Ping He
Abstract: A printed circuit board assembly (PCBA) and a method to assemble the PCBA are disclosed. The PCBA includes a printed circuit board (PCB), an image sensing chip and a protection layer. The PCB includes a first insulation layer, a second insulation layer, a first electrically conductive layer, a second electrically conductive layer, and a third electrically conductive layer. The image sensing chip has a number of bonding pads with a sensor portion facing down through the second opening. The PCBA can function as an image sensing module and make the module have the thinnest thickness.
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