公开(公告)号：US11920028B2

公开(公告)日：2024-03-05

申请号：US17751337

申请日：2022-05-23

Applicant: Sunstar Engineering Inc.

Inventor： Toshio Kobayashi ,  Takaaki Inoue

IPC: C08K5/16 ,  C08K5/25 ,  C08K5/3445 ,  C08L63/00 ,  C09J163/00 ,  C08J3/24 ,  C08K5/00

CPC classification number: C08L63/00 ,  C08K5/25 ,  C08K5/3445 ,  C08J3/24 ,  C08K5/0025 ,  C08K5/16 ,  C08L2205/03 ,  C09J163/00

Abstract: Disclosed is a curable composition comprising an elastomer (A), an epoxy resin (B) and a latent curing agent (C), wherein the latent curing agent (C) comprises a combination of two or more latent curing agents.