公开(公告)号：US11261358B2

公开(公告)日：2022-03-01

申请号：US16639115

申请日：2018-08-03

Applicant: Sunstar Engineering Inc.

Inventor： Kazunobu Takami ,  Takatomi Nishida

IPC: C09J163/04 ,  C08G59/24 ,  C08G59/50 ,  C08G59/68

Abstract: The present invention provides an epoxy resin-based curable composition which may be used as a structural adhesive for an automobile. Particularly, the present invention provides an epoxy resin-based curable composition having excellent low-temperature curability, while maintaining good storage stability and good adhesion.
The present invention relates to a curable composition comprising an epoxy resin, a urea-based curing accelerator (A) and an amine-based curing agent (B) having a pyrazine ring.

公开(公告)号：US10774247B2

公开(公告)日：2020-09-15

申请号：US16109917

申请日：2018-08-23

Applicant: Sunstar Engineering Inc. ,  Mazda Motor Corporation

Inventor： Takatomi Nishida ,  Shohei Yanagisawa ,  Katsuya Himuro ,  Kenichi Yamamoto ,  Motoyasu Asakawa ,  Tomoya Yoshida

IPC: C09J163/00 ,  C09J11/08

Abstract: The present invention provides a one-component type thermosetting adhesive composition used as an automotive structural adhesive having high damping performance without reducing adhesive strength and having excellent low-temperature curability and a body structure for vehicle, on which the one-component type thermosetting adhesive composition is applied. The present invention relates to a one-component type thermosetting adhesive composition comprising an epoxy resin and an amine-based latent curing agent, wherein the epoxy resin comprises: (1) a dibasic acid ester-based epoxy resin, (2) a butadiene-acrylonitrile copolymer modified epoxy resin, and (3) an unmodified bisphenol A type epoxy resin, and wherein a thermally cured product formed from the composition has: a loss tangent tan δ at 23° C. of not less than 0.2 as a damping performance, and a Young's modulus of not less than 50 MPa, and a body structure for vehicle, on which the one-component type thermosetting adhesive composition is applied.