公开(公告)号：US10218265B2

公开(公告)日：2019-02-26

申请号：US15346484

申请日：2016-11-08

Applicant: TDK-Lambda Corporation

Inventor： Jin He ,  Jeffrey John Boylan

IPC: H02M3/04 ,  G05F1/10 ,  H02M3/08 ,  H02M3/337 ,  H02M3/335 ,  H02M1/00

Abstract: A multi-level voltage regulator system/method providing discrete regulation of a DC-DC intermediate bus converter (IBC) output voltage (Vout) is disclosed. The disclosed system/method allows IBC Vout to be regulated in discrete steps during periods where IBC input voltage (Vin) falls below nominal operating values. Rather than shutting down or degrading IBC Vout in an unpredictable non-linear fashion based on IBC input/loading, IBC Vout is regulated in fixed discrete steps, allowing IBC-connected point-of-load (POL) converters to obtain stable power input that is well-defined over IBC Vin. IBC operating parameters may define multi-dimensional operational state spaces of IBC Vout regulation that ensure optimum power flow to attached POLs while maintaining operational stability within the IBC regulator. Instabilities in IBC/POL performance across variations in IBC Vin, load transients, POL loading, and environmental variables may be prevented using Vin voltage step hysteresis.

公开(公告)号：US09408327B2

公开(公告)日：2016-08-02

申请号：US14800374

申请日：2015-07-15

Applicant: TDK-LAMBDA CORPORATION

Inventor： L. Ray Albrecht, III ,  Gordon K. Y. Lee ,  Jin He

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/14 ,  H01L23/473

CPC classification number: H05K7/20463 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/144 ,  H05K7/20454 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2201/10871 ,  Y10T29/49144

Abstract: A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermally conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired.

Abstract translation: 公开了一种热管理系统/方法，其允许使用回流/波/手焊接将散热PCB的热源PCB与电源/热附件进行高效电连接。 所公开的系统/方法可以包括将热源PCB（及其相关部件）机械连接到散热PCB上的支撑销，间隔垫和/或接触膏的组合，使得可以优化两个PCB之间的导热性 同时允许两个PCB之间的受控电导率。 提供了两个PCB之间的受控电隔离，以使用也可以是导热的间隔垫。 在一些实施例中结合的接触膏允许加热PCB，安装在热源PCB上的导热板和散热PCB之间的增强的导电路径。 在一些实施例中，使用包含排气孔的自定心支撑销允许根据需要进行回流/波/手焊。

公开(公告)号：US20130335043A1

公开(公告)日：2013-12-19

申请号：US13968955

申请日：2013-08-16

Applicant: TDK-Lambda Corporation

Inventor： Jin He ,  Jeffrey John Boylan

IPC: H02M3/04

CPC classification number: H02M3/04 ,  G05F1/10 ,  H02M3/33592 ,  H02M3/3378 ,  H02M2001/0022 ,  H02M2001/008 ,  Y02B70/1475

Abstract: A multi-level voltage regulator system/method providing discrete regulation of a DC-DC intermediate bus converter (IBC) output voltage (Vout) is disclosed. The disclosed system/method allows IBC Vout to be regulated in discrete steps during periods where IBC input voltage (Vin) falls below nominal operating values. Rather than shutting down or degrading IBC Vout in an unpredictable non-linear fashion based on IBC input/loading, IBC Vout is regulated in fixed discrete steps, allowing IBC-connected point-of-load (POL) converters to obtain stable power input that is well-defined over IBC Vin. IBC operating parameters may define multi-dimensional operational state spaces of IBC Vout regulation that ensure optimum power flow to attached POLs while maintaining operational stability within the IBC regulator. Instabilities in IBC/POL performance across variations in IBC Vin, load transients, POL loading, and environmental variables may be prevented using Vin voltage step hysteresis.

Abstract translation: 公开了一种提供DC-DC中间总线转换器（IBC）输出电压（Vout）的离散调节的多电平稳压器系统/方法。 所公开的系统/方法允许IBC Vout在IBC输入电​​压（Vin）低于额定工作值的时段内以离散步骤进行调节。 IBC Vout不是以基于IBC输入/负载的不可预测的非线性方式关闭或降级IBC Vout，而是以固定的离散步骤进行调节，允许IBC连接的负载点（POL）转换器获得稳定的功率输入， 对IBC Vin的定义非常明确。 IBC操作参数可以定义IBC Vout调节的多维操作状态空间，其确保在连接的POL处获得最佳功率流，同时保持IBC调节器内的操作稳定性。 使用Vin电压阶跃滞后可以防止IBC Vin，IB负载变化，负载瞬变，POL负载和环境变量之间IBC / POL性能的不稳定性。

公开(公告)号：US09119327B2

公开(公告)日：2015-08-25

申请号：US13659066

申请日：2012-10-24

Applicant: TDK-Lambda Corporation

Inventor： L. Ray Albrecht, III ,  Gordon K. Y. Lee ,  Jin He

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/14 ,  H01L23/473

CPC classification number: H05K7/20463 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/144 ,  H05K7/20454 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2201/10871 ,  Y10T29/49144

Abstract: A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermal conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired.

Abstract translation: 公开了一种热管理系统/方法，其允许使用回流/波/手焊接将散热PCB的热源PCB与电源/热附件进行高效电连接。 所公开的系统/方法可以包括将热源PCB（及其相关部件）机械连接到散热PCB上的支撑销，间隔垫和/或接触膏的组合，使得可以优化两个PCB之间的导热性 同时允许两个PCB之间的受控电导率。 两个PCB之间的受控电气隔离被提供用于使用也可以是导热的间隔垫。 在一些实施例中结合的接触膏允许加热PCB，安装在热源PCB上的导热板和散热PCB之间的增强的导电路径。 在一些实施例中，使用包含排气孔的自定心支撑销允许根据需要进行回流/波/手焊。

公开(公告)号：US09520772B2

公开(公告)日：2016-12-13

申请号：US13968955

申请日：2013-08-16

Applicant: TDK-Lambda Corporation

Inventor： Jin He ,  Jeffrey John Boylan

IPC: H02M3/04 ,  G05F1/10 ,  H02M3/337 ,  H02M3/335 ,  H02M1/00

CPC classification number: H02M3/04 ,  G05F1/10 ,  H02M3/33592 ,  H02M3/3378 ,  H02M2001/0022 ,  H02M2001/008 ,  Y02B70/1475

Abstract: A multi-level voltage regulator system/method providing discrete regulation of a DC-DC intermediate bus converter (IBC) output voltage (Vout) is disclosed. The disclosed system/method allows IBC Vout to be regulated in discrete steps during periods where IBC input voltage (Vin) falls below nominal operating values. Rather than shutting down or degrading IBC Vout in an unpredictable non-linear fashion based on IBC input/loading, IBC Vout is regulated in fixed discrete steps, allowing IBC-connected point-of-load (POL) converters to obtain stable power input that is well-defined over IBC Vin. IBC operating parameters may define multi-dimensional operational state spaces of IBC Vout regulation that ensure optimum power flow to attached POLs while maintaining operational stability within the IBC regulator. Instabilities in IBC/POL performance across variations in IBC Vin, load transients, POL loading, and environmental variables may be prevented using Vin voltage step hysteresis.

Abstract translation: 公开了一种提供DC-DC中间总线转换器（IBC）输出电压（Vout）的离散调节的多电平稳压器系统/方法。 所公开的系统/方法允许IBC Vout在IBC输入电​​压（Vin）低于额定工作值的时段内以离散步骤进行调节。 IBC Vout不是以基于IBC输入/负载的不可预测的非线性方式关闭或降级IBC Vout，而是以固定的离散步骤进行调节，允许IBC连接的负载点（POL）转换器获得稳定的功率输入， 对IBC Vin的定义非常明确。 IBC操作参数可以定义IBC Vout调节的多维操作状态空间，其确保在连接的POL处获得最佳功率流，同时保持IBC调节器内的操作稳定性。 使用Vin电压阶跃滞后可以防止IBC Vin，IB负载变化，负载瞬变，POL负载和环境变量之间IBC / POL性能的不稳定性。

公开(公告)号：US20150319886A1

公开(公告)日：2015-11-05

申请号：US14800374

申请日：2015-07-15

Applicant: TDK-LAMBDA CORPORATION

Inventor： L. Ray Albrecht, III ,  Gordon K.Y. Lee ,  Jin He

IPC: H05K7/20

CPC classification number: H05K7/20463 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/144 ,  H05K7/20454 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2201/10871 ,  Y10T29/49144

Abstract: A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermally conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired.

Abstract translation: 公开了一种热管理系统/方法，其允许使用回流/波/手焊接将散热PCB的热源PCB与电源/热附件进行高效电连接。 所公开的系统/方法可以包括将热源PCB（及其相关部件）机械连接到散热PCB上的支撑销，间隔垫和/或接触膏的组合，使得可以优化两个PCB之间的导热性 同时允许两个PCB之间的受控电导率。 提供了两个PCB之间的受控电隔离，以使用也可以是导热的间隔垫。 在一些实施例中结合的接触膏允许加热PCB，安装在热源PCB上的导热板和散热PCB之间的增强的导电路径。 在一些实施例中，使用包含排气孔的自定心支撑销允许根据需要进行回流/波/手焊。