Electronic assembly including optical modules

    公开(公告)号:US11443998B2

    公开(公告)日:2022-09-13

    申请号:US16869888

    申请日:2020-05-08

    Abstract: An electronic assembly includes an electronic package including a package substrate and an integrated circuit component mounted to an upper surface. The electronic package includes upper package contacts electrically connected to the integrated circuit component. The electronic assembly includes an interposer assembly including an array of compressible interposer contacts each having upper and lower mating interfaces. The interposer assembly defining a separable interface. The electronic assembly includes optical modules coupled to the separable interface of the interposer assembly and having an optical module substrate having module contacts and an optical engine mounted to the optical module substrate electrically connected to the module contacts. The optical module is mounted to the interposer assembly such that the module contacts are electrically connected to the upper mating interfaces of the interposer contacts. Each optical module includes at least one optical fiber terminated to the optical engine.

    Dual connector system
    4.
    发明授权

    公开(公告)号:US10264675B2

    公开(公告)日:2019-04-16

    申请号:US15490252

    申请日:2017-04-18

    Abstract: A dual connector system includes a host circuit board, a first electrical connector at a front mounting area of the host circuit board, and a second electrical connector at a rear mounting area of the host circuit board. The first electrical connector has a housing having a card slot for a module circuit board and the second electrical connector has a housing having an upper mating surface for the module circuit board. The housing has towers having ledges defining a gap between the upper mating surface and the ledges. The housing has biasing members at each tower facing the gap configured to engage the module circuit board to locate the module circuit board between the towers. The housing holds second contacts at the upper mating surface.

    Optical pluggable module for a communication system

    公开(公告)号:US11125958B2

    公开(公告)日:2021-09-21

    申请号:US16895613

    申请日:2020-06-08

    Abstract: A communication system includes a host circuit board and an interposer assembly coupled to the host circuit board having an interposer substrate including an host circuit board contacts at a lower surface and module contacts at an upper surface. The communication system includes an optical pluggable module having a mating interface along a bottom of the optical pluggable module facing the interposer assembly. The optical pluggable module includes a module substrate and optical engines coupled to the module substrate with optical fiber cables extending from the optical engines to the cable end. The module substrate has module substrate contacts at a lower surface of the module substrate being electrically connected to corresponding module contacts of the interposer assembly at the upper surface of the interposer substrate.

    ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES

    公开(公告)号:US20210274673A1

    公开(公告)日:2021-09-02

    申请号:US17168413

    申请日:2021-02-05

    Abstract: An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

    Dual connector system having a securing strap

    公开(公告)号:US10312633B2

    公开(公告)日:2019-06-04

    申请号:US15723287

    申请日:2017-10-03

    Abstract: A dual connector system includes a host circuit board and first and second electrical connectors mounted to the host circuit board. The first electrical connector has a housing having a card slot for a module circuit board and the second electrical connector has a housing having an upper mating surface for the module circuit board. The housing has a first side and an opposite second side with connector latching features and holding second contacts at the upper mating surface between the first and second sides. A dual connector module is mated to the first and second electrical connectors. A securing strap is secured to the dual connector module and has a first strap latching feature being latchably coupled to the corresponding connector latching feature to secure the dual connector module to the second electrical connector.

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