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公开(公告)号:US11443998B2
公开(公告)日:2022-09-13
申请号:US16869888
申请日:2020-05-08
Applicant: TE CONNECTIVITY CORPORATION
Inventor: Christopher William Blackburn , Jeffery Walter Mason , Nathan Lincoln Tracy , Clarence Leon Yu , Michael David Herring
IPC: H01L23/32 , G02B6/42 , H01L23/367 , H01R12/70 , H01R12/85
Abstract: An electronic assembly includes an electronic package including a package substrate and an integrated circuit component mounted to an upper surface. The electronic package includes upper package contacts electrically connected to the integrated circuit component. The electronic assembly includes an interposer assembly including an array of compressible interposer contacts each having upper and lower mating interfaces. The interposer assembly defining a separable interface. The electronic assembly includes optical modules coupled to the separable interface of the interposer assembly and having an optical module substrate having module contacts and an optical engine mounted to the optical module substrate electrically connected to the module contacts. The optical module is mounted to the interposer assembly such that the module contacts are electrically connected to the upper mating interfaces of the interposer contacts. Each optical module includes at least one optical fiber terminated to the optical engine.
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公开(公告)号:US10910748B2
公开(公告)日:2021-02-02
申请号:US15941575
申请日:2018-03-30
Applicant: TE CONNECTIVITY CORPORATION
Inventor: Jeffery Walter Mason , Michael David Herring
IPC: H01R12/00 , H01R12/82 , H05K7/10 , G06F1/18 , H05K3/34 , H01R43/02 , H01R13/11 , H01R12/52 , H01R12/58 , H01R12/61 , H01R12/70 , H01R12/79 , H01R12/85 , H01R13/24 , H05K1/02 , H05K1/11 , H05K1/18 , H01R13/05 , H01R12/71 , H01L23/40
Abstract: A cable socket connector assembly for an electronic system includes a socket assembly having a socket substrate including socket substrate conductors. The socket assembly has socket contacts extending between terminating ends and mating ends with the terminating ends terminated to corresponding socket substrate conductors and the mating ends configured to be terminated to corresponding package contacts of an electronic package of the electronic system. The cable socket connector assembly includes a cable assembly terminated to the socket assembly having an array of cables each having a cable conductor terminated to a corresponding socket substrate conductor. The socket contacts and the corresponding socket substrate conductors define electrical paths between the cable conductors of the cables and the package conductors of the electronic package.
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公开(公告)号:US10741949B2
公开(公告)日:2020-08-11
申请号:US16183819
申请日:2018-11-08
Applicant: TE CONNECTIVITY CORPORATION
Inventor: Michael David Herring
IPC: H01R12/71 , H01R12/73 , H01R12/72 , H05K1/00 , H01R33/97 , H01R12/70 , H01R12/62 , H01R13/502 , H01R13/622 , H01R13/639 , H01R13/6587 , H01R13/64 , H01R12/52 , H01R12/57 , H01R13/621 , H01R12/79 , H01R13/518
Abstract: A card edge connector assembly includes a card edge connector and support hardware. The card edge connector includes a housing extending between a top and a bottom having a card slot at the top receiving a pluggable module in a mating direction. Contacts electrically connect to the pluggable module and the host circuit board. The support hardware has a top and a bottom and has first and second mounting blocks mounted to the host circuit board. The support hardware has a side rail extending between the first and second mounting blocks. A cavity that receives the card edge connector is defined on a first side by the side rail and on first and second ends by the first and second mounting blocks. The top of the support hardware is flush with or below the top of the card edge connector.
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公开(公告)号:US10264675B2
公开(公告)日:2019-04-16
申请号:US15490252
申请日:2017-04-18
Applicant: TE CONNECTIVITY CORPORATION
Inventor: Michael David Herring
IPC: H01R12/70 , H01R12/72 , H05K1/11 , H05K1/14 , H01R12/71 , H01R13/633 , H01R13/627
Abstract: A dual connector system includes a host circuit board, a first electrical connector at a front mounting area of the host circuit board, and a second electrical connector at a rear mounting area of the host circuit board. The first electrical connector has a housing having a card slot for a module circuit board and the second electrical connector has a housing having an upper mating surface for the module circuit board. The housing has towers having ledges defining a gap between the upper mating surface and the ledges. The housing has biasing members at each tower facing the gap configured to engage the module circuit board to locate the module circuit board between the towers. The housing holds second contacts at the upper mating surface.
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公开(公告)号:US20180301836A1
公开(公告)日:2018-10-18
申请号:US15490252
申请日:2017-04-18
Applicant: TE CONNECTIVITY CORPORATION
Inventor: Michael David Herring
CPC classification number: H05K1/117 , H01R12/7005 , H01R12/714 , H01R12/718 , H01R13/6275 , H01R13/6335 , H05K1/141 , H05K2201/049 , H05K2201/10121 , H05K2201/10189
Abstract: A dual connector system includes a host circuit board, a first electrical connector at a front mounting area of the host circuit board, and a second electrical connector at a rear mounting area of the host circuit board. The first electrical connector has a housing having a card slot for a module circuit board and the second electrical connector has a housing having an upper mating surface for the module circuit board. The housing has towers having ledges defining a gap between the upper mating surface and the ledges. The housing has biasing members at each tower facing the gap configured to engage the module circuit board to locate the module circuit board between the towers. The housing holds second contacts at the upper mating surface.
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公开(公告)号:US11125958B2
公开(公告)日:2021-09-21
申请号:US16895613
申请日:2020-06-08
Applicant: TE CONNECTIVITY CORPORATION
Inventor: Bruce Allen Champion , Christopher William Blackburn , Michael David Herring , Eric David Briant
Abstract: A communication system includes a host circuit board and an interposer assembly coupled to the host circuit board having an interposer substrate including an host circuit board contacts at a lower surface and module contacts at an upper surface. The communication system includes an optical pluggable module having a mating interface along a bottom of the optical pluggable module facing the interposer assembly. The optical pluggable module includes a module substrate and optical engines coupled to the module substrate with optical fiber cables extending from the optical engines to the cable end. The module substrate has module substrate contacts at a lower surface of the module substrate being electrically connected to corresponding module contacts of the interposer assembly at the upper surface of the interposer substrate.
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公开(公告)号:US20210274673A1
公开(公告)日:2021-09-02
申请号:US17168413
申请日:2021-02-05
Applicant: TE CONNECTIVITY CORPORATION
Inventor: Christopher William Blackburn , Jeffery Walter Mason , Nathan Lincoln Tracy , Clarence Leon Yu , Michael David Herring
Abstract: An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.
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公开(公告)号:US10903594B2
公开(公告)日:2021-01-26
申请号:US16516413
申请日:2019-07-19
Applicant: TE CONNECTIVITY CORPORATION
Inventor: Michael David Herring , Matthew Ryan Schmitt , Arash Behziz
IPC: H01R12/72 , H01R12/73 , H01R13/627 , H01R12/79 , H01R12/78
Abstract: A board-to-board connector assembly includes a connector interposer between first and second connectors each having a connector housing holding contacts and having a card slot for interfacing with a circuit card edge of a corresponding add-in card. The connector housings have board guides configured to engage the add-in cards and guide mating therewith. The connectors have latches configured to latchably engage the add-in cards to secure the connector to the add-in cards. The connector interposer electrically interconnects the first contacts and the second contacts.
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公开(公告)号:US20190356089A1
公开(公告)日:2019-11-21
申请号:US16397327
申请日:2019-04-29
Applicant: TE CONNECTIVITY CORPORATION
Inventor: Brian Patrick Costello , Michael David Herring , Arash Behziz , Howard Wallace Andrews, JR.
IPC: H01R13/6587 , H01R12/72 , H01R12/73 , H01R43/24 , H01R13/66 , H01R13/6583 , H01R13/514 , H01R13/6471
Abstract: An electrical connector assembly for a communication system includes a housing and a wafer assembly including a PCB terminated contact wafer and a cable terminated contact wafer arranged in a wafer stack. The PCB terminated contact wafer includes a first contact array having first signal contacts having mating portions and terminating ends for termination to a printed circuit board of the communication system. The cable terminated contact wafer includes a second contact array having second signal contacts and a second contact holder having a mating interface and holding terminating ends of the second signal contacts at the mating interface for electrically connection to a cable connector of a cable assembly.
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公开(公告)号:US10312633B2
公开(公告)日:2019-06-04
申请号:US15723287
申请日:2017-10-03
Applicant: TE CONNECTIVITY CORPORATION
Inventor: Michael Joseph Tryson , Nathan Lincoln Tracy , Michael David Herring , Dean Marlin Harmon, III
IPC: H01R12/00 , H01R13/627 , H01R12/71 , H01R12/70
Abstract: A dual connector system includes a host circuit board and first and second electrical connectors mounted to the host circuit board. The first electrical connector has a housing having a card slot for a module circuit board and the second electrical connector has a housing having an upper mating surface for the module circuit board. The housing has a first side and an opposite second side with connector latching features and holding second contacts at the upper mating surface between the first and second sides. A dual connector module is mated to the first and second electrical connectors. A securing strap is secured to the dual connector module and has a first strap latching feature being latchably coupled to the corresponding connector latching feature to secure the dual connector module to the second electrical connector.
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