公开(公告)号：US09487684B2

公开(公告)日：2016-11-08

申请号：US14389596

申请日：2013-03-25

Applicant: tesa SE

Inventor： Thorsten Krawinkel ,  Klaus Keite-Telgenbüsher ,  Judith Grünauer ,  Jan Ellinger

IPC: C08K5/07 ,  C09J153/02 ,  C08F8/36 ,  C09J7/02 ,  C09J193/04 ,  C09J11/06 ,  C09J5/02 ,  C09J5/06 ,  C09J153/00 ,  C08K5/00 ,  H01L51/52 ,  C08L91/00

CPC classification number: C09J153/025 ,  C08F8/36 ,  C08K5/0091 ,  C08K5/07 ,  C08L53/025 ,  C08L91/00 ,  C08L2205/02 ,  C09J5/02 ,  C09J5/06 ,  C09J7/20 ,  C09J7/35 ,  C09J7/387 ,  C09J11/06 ,  C09J153/00 ,  C09J193/04 ,  C09J2203/318 ,  C09J2453/00 ,  H01L51/5246 ,  H01L2924/0002 ,  Y10T428/2852 ,  H01L2924/00

Abstract: Adhesive compound as a permeant barrier, comprising (i) block copolymers having a construction A-B-A, (A-B)n, (A-B)nX, or (A-B-A)nX, where X is the radical of the coupling reagent, n is a whole number between 2 and 10, A is a polymer made of a vinyl aromatic compound and B is a polymer block made of an alkene or diene, wherein this polymer block can also be hydrated, with the condition that at least part of the A blocks is sulfonated, optionally with two-block copolymers in the form of A-B as an admixture component, and (ii) at least one tackifier resin.

Abstract translation: 粘合剂作为渗透屏障，包括（i）嵌段共聚物，其具有结构ABA，（AB）n，（AB）nX或（ABA）nX，其中X是偶联剂的基团，n是 如图2和图10所示，A是由乙烯基芳族化合物制成的聚合物，B是由烯烃或二烯制成的聚合物嵌段，其中该聚合物嵌段也可以水合，条件是至少部分A嵌段被磺化， 任选地以AB作为混合组分的形式的双嵌段共聚物，和（ii）至少一种增粘树脂。

公开(公告)号：US20140371376A1

公开(公告)日：2014-12-18

申请号：US14354458

申请日：2012-10-26

Applicant: tesa SE

Inventor： Thorsten Krawinkel

IPC: C09J153/02 ,  C09J153/00

CPC classification number: C09J153/02 ,  C08L35/06 ,  C08L57/02 ,  C09J153/00 ,  C09J2453/00 ,  C09J2467/00

Abstract: The invention relates to an adhesive paste containing at least • a vinyl aromatic block copolymer • at least one adhesive resin • a second copolymer based on a vinyl aromatic and on an unsaturated anhydride, wherein the vinyl aromatic content is preferably at least 50 mol %.

Abstract translation: 本发明涉及至少含有乙烯基芳族嵌段共聚物的粘合剂糊剂•至少一种粘合剂树脂•基于乙烯基芳族化合物和不饱和酸酐的第二共聚物，其中乙烯基芳族化合物的含量优选至少为50摩尔％。

公开(公告)号：US20140315016A1

公开(公告)日：2014-10-23

申请号：US14351800

申请日：2012-10-19

Applicant: tesa SE

Inventor： Thilo Dollase ,  Thorsten Krawinkel ,  Minyoung Bai

IPC: H01L23/29 ,  C09J7/02 ,  C09J153/00

CPC classification number: H01L23/293 ,  B32B17/06 ,  B32B17/064 ,  C03C27/10 ,  C08L53/00 ,  C08L63/00 ,  C08L93/00 ,  C08L93/04 ,  C09J7/00 ,  C09J7/387 ,  C09J153/00 ,  C09J163/00 ,  C09J193/00 ,  C09J193/04 ,  C09J2203/326 ,  C09J2453/00 ,  C09K3/10 ,  H01L31/0481 ,  H01L51/52 ,  H01L51/5246 ,  H01L2251/5338 ,  H01L2924/0002 ,  Y02E10/50 ,  Y10T428/269 ,  Y10T428/287 ,  H01L2924/00

Abstract: An adhesive and method for encapsulating an electronic arrangement with respect to permeants, wherein the adhesive and method have (a) at least one copolymer comprising at least isobutylene or butylene as comonomer kind and at least one comonomer kind which, considered as hypothetical homopolymer, has a softening temperature of greater than 40° C., (b) at least one kind of an at least partly hydrogenated tackifier resin, (c) at least one kind of a reactive resin based on cyclic ethers having a softening temperature of less than 40° C., preferably less than 20° C., and (d) at least one kind of a photoinitiator for initiating cationic curing

Abstract translation: 一种用于相对于渗透剂封装电子装置的粘合剂和方法，其中所述粘合剂和方法具有（a）至少一种共聚物，其至少包含异丁烯或丁烯作为共聚单体类型和至少一种被认为是假定均聚物的共聚单体类型 软化温度大于40℃，（b）至少一种至少部分氢化的增粘树脂，（c）至少一种基于软化温度低于40℃的环醚的反应性树脂 ℃，优选小于20℃，和（d）至少一种用于引发阳离子固化的光引发剂

公开(公告)号：US20140024756A1

公开(公告)日：2014-01-23

申请号：US13946326

申请日：2013-07-19

Applicant: tesa SE

Inventor： Thorsten Krawinkel ,  Gaelle de Roton

IPC: C09J123/24 ,  C09J153/02

CPC classification number: C09J123/24 ,  C08L53/02 ,  C08L2205/02 ,  C09J7/387 ,  C09J153/02

Abstract: The invention relates to a pressure-sensitive adhesive comprising at least 70 wt. % of a mixture of (i) block copolymers comprising a mixture of block copolymers having the structure I and II A′-B′, A-B-A, (A-B)n, (A-B)nX and/or (A-B-A)nX, where X is the residue of a coupling reagent, n is an integer between 2 and 10, A and A′ are each a polymer block of a vinylaromatic, B and B′ are each a polymer block formed from butadiene, a mixture of butadiene and isoprene and/or a mixture of butadiene and styrene and A and A′, and B and B′, may each be identical or different, (ii) at least one tackifier resin.

Abstract translation: 本发明涉及一种压敏粘合剂，其包含至少70重量％ （i）包含具有结构I和IIA'-B'，ABA，（AB）n，（AB）nX和/或（ABA）nX的嵌段共聚物的混合物的嵌段共聚物的混合物的％，其中X是 偶联剂的残基，n为2至10的整数，A和A'各自为乙烯基芳族化合物的聚合物嵌段，B和B'各自为由丁二烯形成的聚合物嵌段，丁二烯和异戊二烯的混合物和/ 或丁二烯和苯乙烯以及A和A'以及B和B'的混合物各自可以相同或不同，（ii）至少一种增粘树脂。

公开(公告)号：US20240360341A1

公开(公告)日：2024-10-31

申请号：US18639378

申请日：2024-04-18

Applicant: tesa SE

Inventor： Thorsten Krawinkel ,  Shuang Wang

IPC: C09J7/28 ,  C09J11/04 ,  C09J11/06 ,  C09J133/10

CPC classification number: C09J7/28 ,  C09J11/04 ,  C09J11/06 ,  C09J133/10 ,  C09J2301/124 ,  C09J2301/16 ,  C09J2301/208 ,  C09J2301/302 ,  C09J2301/314 ,  C09J2301/408 ,  C09J2301/412 ,  C09J2301/502 ,  C09J2400/16 ,  C09J2433/00

Abstract: An adhesive tape, and adhesive tape assembly, that includes: a first layer of adhesive (D), the layer (D) comprising at least one electrolyte; a second layer of adhesive (C), the layer (C) being electrically conductive; and an electrically conductive carrier layer (T), the carrier layer (T) disposed between the first layer (D) and the second layer (C). Further, the layers (D), (T), and (C) are disposed one above another such that none of the layers (D), (T), and (C) laterally protrudes beyond any of the other layers (D), (T), and (C). The adhesive tape assembly can further include a first substrate (A) that is electrically conductive, a second substrate (B) disposed on a face of the second layer (C) that is opposite the carrier layer (T), and wherein the second layer (C) laterally protrudes beyond the substrate (B) such that the layer (C) has an exposed face.

公开(公告)号：US20240059930A1

公开(公告)日：2024-02-22

申请号：US18452078

申请日：2023-08-18

Applicant: tesa SE

Inventor： Shuang Wang ,  Klaus Keite-Telgenbüscher ,  Thorsten Krawinkel

IPC: C09J5/06 ,  C09J7/38 ,  C08J9/22 ,  B32B15/20 ,  B32B27/36 ,  B32B7/12 ,  B32B15/09 ,  B32B27/08 ,  B32B43/00 ,  B32B7/06

CPC classification number: C09J5/06 ,  C09J7/381 ,  C08J9/22 ,  B32B15/20 ,  B32B27/365 ,  B32B7/12 ,  B32B15/09 ,  B32B27/08 ,  B32B43/006 ,  B32B7/06 ,  C09J2301/502 ,  C08J2203/22 ,  C08J2375/04 ,  C08J2207/02 ,  C09J2425/00 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/748 ,  B32B2405/00

Abstract: A laminate that includes:



(i) a first pressure-sensitive adhesive layer, the first layer comprising a block copolymer containing at least one polymer block formed from vinylaromatics and at least one polymer block formed from alkenes;
(ii) a metal layer disposed on the first layer;
(iii) a blowing agent layer disposed on the metal layer; and
(iv) a second pressure-sensitive adhesive layer disposed on the blowing agent layer, the second layer comprising a block copolymer containing at least one polymer block formed from vinylaromatics and at least one polymer block formed from alkenes.

公开(公告)号：US11866614B2

公开(公告)日：2024-01-09

申请号：US17471642

申请日：2021-09-10

Applicant: tesa SE

Inventor： Klaus Keite-Telgenbuscher ,  Christian Schuh ,  Bernd Luhmann ,  Thilo Dollase ,  Minyoung Bai ,  Thorsten Krawinkel

IPC: C09J125/08 ,  C09J153/00 ,  C09J153/02 ,  C09J7/38 ,  C08L63/00 ,  B82Y30/00 ,  B82Y40/00 ,  H10K50/844

CPC classification number: C09J125/08 ,  C08L63/00 ,  C09J7/387 ,  C09J153/00 ,  C09J153/025 ,  B82Y30/00 ,  B82Y40/00 ,  C08L2205/04 ,  C09J2301/122 ,  C09J2301/124 ,  C09J2301/302 ,  C09J2301/312 ,  C09J2425/00 ,  C09J2453/00 ,  H10K50/844 ,  Y10T428/269 ,  Y10T428/287 ,  C09J153/025 ,  C08L63/00

Abstract: A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

公开(公告)号：US11242469B2

公开(公告)日：2022-02-08

申请号：US16321106

申请日：2017-07-17

Applicant: TESA SE

Inventor： Christian Schuh ,  Thorsten Krawinkel

IPC: C09J7/29 ,  C09J7/40 ,  C09J7/21 ,  C09J7/24 ,  C09J7/26 ,  C09J7/25 ,  C09J7/38 ,  B32B27/14 ,  C08K3/38 ,  C08K3/36 ,  C08K3/34 ,  C09J7/20 ,  C08K3/22 ,  C08K3/26 ,  C08K3/30

Abstract: The aim is to provide an adhesive tape that effectively protects an electronic construction from permeants, especially water, and that at the same time has good gap-filling qualities. To solve this problem an adhesive tape is proposed that has in the following order:—a carrier layer without barrier effect at least towards water and with a WVTR of at least 1 g/(m2*d) (38° C., 90% relative humidity, 50 μm layer thickness); —a layer comprising at least one getter material capable of sorbing at least water; —a water barrier ply; and—a layer of pressure-sensitive adhesive, where the carrier layer bears an outward-facing release layer and/or the layer of pressure-sensitive adhesive is lined with a release liner which has a release layer lying on the layer of pressure-sensitive adhesive.

公开(公告)号：US20150064462A1

公开(公告)日：2015-03-05

申请号：US14389529

申请日：2013-03-25

Applicant: tesa SE

Inventor： Klaus Keite-Telgenbüsher ,  Jan Ellinger ,  Judith Grünauer ,  Thorsten Krawinkel

IPC: C09J153/00 ,  B05D3/02 ,  C09J7/02

CPC classification number: C09J153/00 ,  B05D3/0218 ,  B05D3/0254 ,  C08K5/0025 ,  C08K5/0091 ,  C09J7/387 ,  C09J11/06 ,  C09J153/025 ,  C09J2453/00 ,  Y10T428/2857

Abstract: Temperature-stable adhesive compound, comprising (i) block copolymers having a construction A-B-A, (A-B)n, (A-B)nX, or (A-B-A)nX, where X is the radical of a coupling reagent, n is an integer between 2 and 10, A is a polymer block of a vinylaromatic, and B is a polymer block of an alkene or diene, at least some of the A blocks being sulfonated, and optionally diblock copolymers of the form A-B, and (ii) at least one tackifier resin, and (iii) at least one metal complex with a substitutable complexing agent.

Abstract translation: 温度稳定的粘合剂化合物，其包含（i）具有结构ABA，（AB）n，（AB）nX或（ABA）nX的嵌段共聚物，其中X是偶联试剂的基团，n是2和 10，A是乙烯基芳族化合物的聚合物嵌段，B是烯烃或二烯的聚合物嵌段，至少一些A嵌段被磺化，和任选的AB型的二嵌段共聚物，和（ii）至少一种增粘剂 树脂，和（iii）至少一种具有可取代的络合剂的金属络合物。

公开(公告)号：US08845846B2

公开(公告)日：2014-09-30

申请号：US13865539

申请日：2013-04-18

Applicant: tesa SE

Inventor： Marc Husemann ,  Thorsten Krawinkel ,  Daniel Klier

IPC: C09J153/00 ,  C08K5/07

CPC classification number: C09J153/005 ,  B32B17/10 ,  B32B2367/00 ,  C08L57/02 ,  C08L2205/02 ,  C08L2312/00 ,  C08L2666/02 ,  C09J151/006 ,  C09J153/025

Abstract: A method and an adhesive bond optical components, such that a first optical component is bonded to a second optical component with the adhesive, wherein the adhesive comprises at least an acid anhydride-modified vinylaromatic block copolymer, a metal chelate, and a tackifier resin, and the adhesive has a transmittance of greater than 86% and a haze of less than 5%.

Abstract translation: 一种方法和粘合剂粘合光学部件，使得第一光学部件用粘合剂结合到第二光学部件，其中粘合剂包含至少一种酸酐改性的乙烯基芳族嵌段共聚物，金属螯合物和增粘树脂， 并且粘合剂具有大于86％的透射率和小于5％的雾度。