公开(公告)号：US11545448B2

公开(公告)日：2023-01-03

申请号：US16924144

申请日：2020-07-08

Applicant: THALES

Inventor： Philippe Kertesz

IPC: H01L21/48 ,  H01L23/538 ,  H01L23/00 ,  H01L23/367 ,  H01L23/552

Abstract: An electronic component includes a first set comprising an interconnect layer and an electronic circuit having a front face and a back face, which is connected to the interconnect layer by the front face, wherein the first set comprises a metal plate having a front face and a back face joined to the back face of the electronic circuit; a coupling agent between the front face of the metal plate and the back face of the electronic circuit, configured to thermally and electrically connect the metal plate to the electronic circuit; and in that the electronic component comprises: one or more layers made of organic materials stacked around the first set and the metal plate using a printed circuit-type technique and encapsulating the electronic circuit; a thermally conductive metal surface arranged at least partially in contact with the back face of the metal plate.

公开(公告)号：US20150129292A1

公开(公告)日：2015-05-14

申请号：US14365070

申请日：2012-12-11

Applicant: THALES

Inventor： Bernard Ledain ,  Dominique Henriot ,  Philippe Kertesz

IPC: H05K3/46 ,  H05K1/09 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K3/4623 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/115 ,  H05K3/4614 ,  H05K2201/0129 ,  H05K2201/041 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49124

Abstract: A process is provided for producing a printed circuit board comprising at least two elementary circuit boards drilled with metallized holes the mouth of which is covered with a first metal, and at least one first intermediate layer, made of a compressible material, drilled with holes facing the elementary circuit boards and the mouth of which is covered with a second metal, which layer is placed between the two elementary circuit boards and soldered to each of the circuits by thermodiffusion of two metals forming an alloy at a formation temperature of the alloy. At least two second intermediate layers, the second layers not covering the first and second metal, being thermoplastics and having a melting point above the formation temperature of the alloy, are placed between the first intermediate layer and the elementary circuit boards.

Abstract translation: 提供了一种用于生产印刷电路板的方法，该印刷电路板包括至少两个基本电路板，所述至少两个基本电路板钻有金属化孔，其孔被第一金属覆盖，以及至少一个由可压缩材料制成的第一中间层， 基本电路板，其口部被第二金属覆盖，该层被放置在两个基本电路板之间，并且通过在合金的形成温度下形成合金的两种金属的热扩散而被焊接到每个电路。 至少两个第二中间层，不覆盖第一和第二金属的第二层是热塑性塑料并且具有高于合金的形成温度的熔点，放置在第一中间层和基本电路板之间。

公开(公告)号：US09818706B2

公开(公告)日：2017-11-14

申请号：US15141442

申请日：2016-04-28

Applicant: Thales

Inventor： Philippe Kertesz

IPC: H01L21/00 ,  H01L23/66 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/367 ,  H01L23/60 ,  H01L23/24 ,  H01L21/54 ,  H05K1/18 ,  H01L23/36 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/54 ,  H01L21/56 ,  H01L21/565 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/4985 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/564 ,  H01L23/60 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/6683 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/83801 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1423 ,  H01L2924/15311 ,  H01L2924/302 ,  H01L2924/3025 ,  H05K1/186 ,  H01L2924/0105

Abstract: A component comprises at least one support on which is fixed at least one electronic circuit, for example a circuit of MMIC type, one or more layers of organic materials stacked on the support according to a technique of printed circuit type and forming a pre-existing cavity containing the electronic circuit, the cavity being filled with a material of low permeability to water vapor such as LCP.