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公开(公告)号：US08999770B2
公开(公告)日：2015-04-07
申请号：US13949556
申请日：2013-07-24
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Tien-Ming Lin , Chih-Hsuan Sun , Wei-Yu Yeh
CPC classification number: H01L33/58 , H01L33/507 , H01L2224/48091 , H01L2924/0002 , H01L2933/0041 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.
Abstract translation: 半导体结构包括具有多个管芯区域的模块，设置在衬底上的多个发光器件，使得每个管芯区域包括一个发光器件，以及在该模块上的透镜板，并且粘附到 基材用胶。 透镜板包括多个微透镜，每个微透镜各自对应于一个裸片区域，并且在每个裸片区域中，胶水通过相应的一个微透镜提供一个发光器件的气密封装。 此外，作为透镜板的一部分包括磷光体。
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公开(公告)号：US20140184081A1
公开(公告)日：2014-07-03
申请号：US14197288
申请日：2014-03-05
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Wei-Yu Yeh , Chih-Hsuan Sun
IPC: H05B33/08
CPC classification number: H05B33/0863 , H05B33/0824 , H05B33/0869
Abstract: A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time.
Abstract translation: 发光二极管（LED）灯包括许多不同颜色的LED，可以使用可由用户操作的外部开关以不同的组合打开和关闭。 用户或控制器可以调节灯输出的光的色温。 色温变化可能是用户偏好，并且可以补偿随时间降低的磷光体效率。
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公开(公告)号：US20140254180A1
公开(公告)日：2014-09-11
申请号：US14286534
申请日：2014-05-23
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Wei-Yu Yeh , Chih-Hsuan Sun
CPC classification number: H05K1/0203 , F21K9/20 , F21V29/70 , F21V29/763 , F21Y2103/10 , F21Y2115/10 , H05K1/056 , H05K1/111 , H05K3/0061 , H05K2201/066 , H05K2201/10106 , H05K2201/10969 , Y10T29/4913
Abstract: A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad.
Abstract translation: 发光二极管（LED）模块包括具有前侧和后侧的电路板，耦合到电路板的背面的散热器，设置在电路板的前侧的散热垫，设置在LED 在电路板的正面。 LED与散热垫热接触。 模块还包括放置在热垫上并与热垫热接触的散热装置。
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公开(公告)号：US09447948B2
公开(公告)日：2016-09-20
申请号：US14224891
申请日：2014-03-25
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Jin-Hua Wang , Hsueh-Hung Fu , Pei-Wen Ko , Chih-Hsuan Sun
IPC: F21V29/00 , F21V17/02 , F21K99/00 , F21V5/00 , F21V29/74 , F21V29/75 , F21V29/76 , F21V13/04 , F21W131/103 , F21Y101/02 , F21Y113/00
CPC classification number: F21V17/02 , F21K9/20 , F21K9/60 , F21V5/007 , F21V13/04 , F21V29/74 , F21V29/75 , F21V29/763 , F21V29/83 , F21W2131/103 , F21Y2101/00 , F21Y2113/00 , F21Y2115/10 , Y02B20/72
Abstract: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings.
Abstract translation: 本公开涉及路灯。 路灯包括基座，连接到基座的灯柱和联接到灯柱的灯头。 灯头包括壳体和设置在壳体内的多个LED灯模块。 LED灯模块是独立的并且彼此独立。 每个LED灯模块包括用作灯的光源的LED阵列。 每个LED灯模块还包括热耦合到LED的散热器。 散热器可操作以在操作期间散发由LED产生的热量。 每个LED灯模块还包括具有多个开口的导热盖。 每个LED与相应的一个开口对齐并设置在其中。
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公开(公告)号：US09232602B2
公开(公告)日：2016-01-05
申请号：US14197288
申请日：2014-03-05
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Wei-Yu Yeh , Chih-Hsuan Sun
IPC: H05B33/08
CPC classification number: H05B33/0863 , H05B33/0824 , H05B33/0869
Abstract: A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time.
Abstract translation: 发光二极管（LED）灯包括许多不同颜色的LED，可以使用可由用户操作的外部开关以不同的组合打开和关闭。 用户或控制器可以调节灯输出的光的色温。 色温变化可能是用户偏好，并且可以补偿随时间降低的磷光体效率。
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Patent Agency Ranking
公开(公告)号：US20150085493A1
公开(公告)日：2015-03-26
申请号：US14558788
申请日：2014-12-03
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chih-Hsuan Sun , Hsiao-Wen Lee
CPC classification number: F21K9/232 , F21K9/90 , F21V3/00 , F21V29/773 , F21V29/83 , F21Y2115/10 , Y10T29/49117
Abstract: An apparatus includes a light-emitting device. A diffuser is disposed over the light-emitting device. A heat sink is disposed below, and thermally coupled to, the light-emitting device. The heat sink includes a body and a plurality of fins that radially protrude from the body of the heat sink. The fins define a plurality of ducts. A cover plate circumferentially surrounds the heat sink. The cover plate includes a plurality of openings that are disposed over the plurality of ducts, respectively.
Abstract translation: 一种装置包括发光装置。 扩散器设置在发光器件的上方。 散热器设置在发光装置的下方并热耦合到发光装置。 散热器包括主体和从散热体的主体径向突出的多个散热片。 翅片限定多个管道。 盖板周向地围绕散热器。 盖板包括分别设置在多个管道上的多个开口。
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公开(公告)号：US09970603B2
公开(公告)日：2018-05-15
申请号：US14200069
申请日：2014-03-07
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chih-Hsuan Sun , Wei-Yu Yeh , Hsueh-Hung Fu , Dong Jung Suen
IPC: B60Q1/06 , F21K99/00 , F21V3/04 , F21V7/00 , B05D5/06 , F21V29/74 , F21V29/77 , F21K9/20 , F21K9/232 , F21K9/60 , F21K9/66 , F21Y101/00 , F21Y115/10
CPC classification number: F21K9/60 , B05D5/061 , B05D5/063 , F21K9/20 , F21K9/232 , F21K9/66 , F21V3/049 , F21V3/0625 , F21V3/10 , F21V7/0016 , F21V29/74 , F21V29/773 , F21Y2101/00 , F21Y2115/10
Abstract: The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.
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公开(公告)号：US09074738B2
公开(公告)日：2015-07-07
申请号：US14272600
申请日：2014-05-08
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
IPC: F21V9/16 , F21V3/00 , F21K99/00 , F21V29/74 , F21Y101/02 , F21V3/02 , F21V13/02 , F21Y113/00 , F21V29/507
CPC classification number: F21K9/64 , F21K9/232 , F21K9/90 , F21V3/02 , F21V13/02 , F21V29/507 , F21V29/70 , F21V29/74 , F21Y2101/00 , F21Y2113/13 , F21Y2115/10 , Y10T29/4913
Abstract: A lamp includes a substrate, a plurality of light-emitting devices located over the substrate, and a cap that is located over the light-emitting devices. The plurality of light-emitting devices include a first subset of light-emitting devices and a second subset of light-emitting devices. Each light-emitting device in the first subset is free of a phosphor coating. Each light-emitting device in the second subset includes a phosphor coating. The cap has both photo-conversion properties and light-scattering properties, and the cap is located over the first subset of the light-emitting devices but exposes the second subset of the light-emitting devices.
Abstract translation: 灯包括衬底，位于衬底上方的多个发光器件和位于发光器件上方的帽。 多个发光器件包括发光器件的第一子集和发光器件的第二子集。 第一子集中的每个发光器件都不含磷光体涂层。 第二子集中的每个发光器件包括磷光体涂层。 盖具有光转换性质和光散射性质，并且帽位于发光器件的第一子集之上，但暴露出发光器件的第二子集。
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公开(公告)号：US20140293615A1
公开(公告)日：2014-10-02
申请号：US14307545
申请日：2014-06-18
Applicant: TSMC SOLID STATE LIGHTING LTD.
Inventor： Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
IPC: F21K99/00
CPC classification number: F21V3/0625 , F21K9/60 , F21K9/90 , F21V3/02 , F21V5/008 , F21V5/04 , F21V7/0091 , F21V29/77 , F21V29/89 , F21Y2115/10 , H01L33/58 , H01L2933/0091 , Y10T29/49826
Abstract: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a substrate. A light-emitting diode (LED) is disposed over the substrate. A first lens is disposed over the LED. A second lens is disposed over the first lens. The first lens and the second lens are configured to refract light that is emitted by the LED backward.
Abstract translation: 本公开提供了照明结构的一个实施例。 照明结构包括基板。 发光二极管（LED）设置在基板上。 第一透镜设置在LED上。 第二透镜设置在第一透镜上。 第一透镜和第二透镜被配置为折射由LED发射的光。
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公开(公告)号：US20130314915A1
公开(公告)日：2013-11-28
申请号：US13858779
申请日：2013-04-08
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chih-Hsuan Sun , Wei-Yu Yeh , Tien-Ming Lin
IPC: F21V29/00
CPC classification number: F21V29/74 , F21K9/232 , F21K9/90 , F21V3/02 , F21Y2101/00 , F21Y2115/10 , Y10T29/49002
Abstract: A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.
Abstract translation: 照明装置包括具有朝向外侧的中心部分的小面的多面散热器。 小面形成中央封闭部分，并且散热器还具有多个翅片，其中每个翅片放置在相邻小面之间并从散热器向外突出。 照明装置还具有安装有半导体发射体的多个电路板。 每个电路板安装在散热器的相应面上。 所述照明装置还具有覆盖所述多个电路板的光扩散壳体，与所述电路板连通并可操作以将功率转换为与所述半导体发射体兼容的功率模块，以及与所述电力电连通的电源连接器组件 模块。
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