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公开(公告)号：US20150162315A1
公开(公告)日：2015-06-11
申请号：US14626968
申请日：2015-02-20
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chih-Kuang Yu , Chyi Shyuan Chern
CPC classification number: H01L25/0753 , H01L27/153 , H01L33/0079 , H01L33/32 , H01L33/46 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: The present disclosure provides one embodiment of a light-emitting structure. The light-emitting structure includes a carrier substrate having first metal features; a transparent substrate having second metal features; a plurality of light-emitting diodes (LEDs) bonded with the carrier substrate and the transparent substrate, sandwiched between the carrier substrate and the transparent substrate; and metal pillars bonded to the carrier substrate and the transparent substrate, each of the metal pillars being disposed between adjacent two of the plurality of LEDs, wherein the first metal features, the second metal features and the metal pillars are configured to electrically connect the plurality of LEDs.
Abstract translation: 本公开提供了发光结构的一个实施例。 发光结构包括具有第一金属特征的载体衬底; 具有第二金属特征的透明基板; 与载体基板和透明基板结合的多个发光二极管（LED）夹在载体基板和透明基板之间; 以及结合到所述载体基板和所述透明基板的金属柱，每个所述金属柱设置在所述多个LED的相邻两个之间，其中所述第一金属特征，所述第二金属特征和所述金属柱被配置为电连接所述多个 的LED。
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公开(公告)号：US09324910B2
公开(公告)日：2016-04-26
申请号：US14558798
申请日：2014-12-03
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Hsien Wu , Chyi Shyuan Chern , Chun-Lin Chang , Ching-Wen Hsiao , Kuang-Huan Hsu
CPC classification number: H01L33/22 , H01L21/2654 , H01L21/26546 , H01L21/26593 , H01L33/0025 , H01L33/06 , H01L33/32
Abstract: A device includes: a substrate; and a doped III-V compound layer disposed over the substrate; wherein: the doped III-V compound layer includes an upper boundary; the upper boundary has a micro-roughened texture and a macro-roughened texture where the micro-roughened texture located on; and the upper boundary includes dopant ions that are not present in a remainder of the doped III-V compound layer underneath the upper boundary.
Abstract translation: 一种器件包括：衬底; 以及设置在所述衬底上的掺杂III-V化合物层; 其中：掺杂的III-V化合物层包括上边界; 上边界具有微粗糙纹理和位于其上的微粗糙纹理的宏观粗糙纹理; 并且上边界包括在上边界下方的掺杂III-V化合物层的剩余部分中不存在的掺杂离子。
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公开(公告)号：US20150083998A1
公开(公告)日：2015-03-26
申请号：US14558798
申请日：2014-12-03
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Hsien Wu , Chyi Shyuan Chern , Chun-Lin Chang , Ching-Wen Hsiao , Kuang-Huan Hsu
CPC classification number: H01L33/22 , H01L21/2654 , H01L21/26546 , H01L21/26593 , H01L33/0025 , H01L33/06 , H01L33/32
Abstract: A light-emitting diode (LED) element includes a substrate and a GaN layer formed on the substrate. The GaN layer includes a boundary layer including a surface of the GaN opposing the substrate. The surface has a micro-roughening texture and a macro-roughening texture. The boundary layer includes at least one of As, Si, P, Ge, C, B, F, N, Sb, and Xe ions.
Abstract translation: 发光二极管（LED）元件包括衬底和形成在衬底上的GaN层。 GaN层包括边界层，其包括与衬底相对的GaN的表面。 表面具有微粗糙纹理和宏观粗糙纹理。 边界层包括As，Si，P，Ge，C，B，F，N，Sb和Xe离子中的至少一种。
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公开(公告)号：US08993447B2
公开(公告)日：2015-03-31
申请号：US13858785
申请日：2013-04-08
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsing-Kuo Hsia , Chih-Kuang Yu , Hung-Yi Kuo , Chyi Shyuan Chern
IPC: H01L21/311 , H01L33/64
CPC classification number: H01L33/64 , H01L25/075 , H01L33/54 , H01L33/58 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
Abstract: An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.
Abstract translation: 一种装置包括其中具有多个开口的晶片。 对于每个开口，LED器件以这样的方式耦合到导电载体和晶片，使得每个耦合的LED器件和导电载体的一部分至少部分地填充开口。 制造LED器件的方法包括在晶片中形成多个开口。 该方法还包括将发光二极管（LED）器件耦合到导电载体上。 具有导电载体的LED装置至少部分地填充每个开口。
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公开(公告)号：US20140235053A1
公开(公告)日：2014-08-21
申请号：US14267303
申请日：2014-05-01
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chyi Shyuan Chern , Hsin-Hsien Wu , Chun-Lin Chang , Hsing-Kuo Hsia , Hung-Yi Kuo
IPC: H01L21/768
CPC classification number: H01L21/76801 , H01L21/02057 , H01L21/3065 , H01L21/76898
Abstract: A method of forming a through-silicon-via (TSV) opening includes forming a TSV opening through a substrate. A recast of a material of the substrate on sidewalls of the TSV opening is removed with a first chemical. The sidewalls of the TSV opening are cleaned with a second chemical by substantially removing a residue of the first chemical.
Abstract translation: 形成贯通硅通孔（TSV）开口的方法包括通过基板形成TSV开口。 使用第一种化学物质去除在TSV开口的侧壁上的衬底的材料的重铸。 TSV开口的侧壁通过基本上除去第一种化学物质的残留物而用第二种化学品清洗。
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Patent Agency Ranking
公开(公告)号：US08722436B2
公开(公告)日：2014-05-13
申请号：US14088780
申请日：2013-11-25
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chyi Shyuan Chern , Hsin-Hsien Wu , Chih-Kuang Yu , Hung-Yi Kuo
IPC: H01L21/00
CPC classification number: H01L33/62 , H01L23/49513 , H01L25/0753 , H01L33/0095 , H01L33/08 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
Abstract: A method of light-emitting diode (LED) packaging includes coupling a number of LED dies to corresponding bonding pads on a sub-mount. A mold apparatus having concave recesses housing LED dies is placed over the sub-mount. The sub-mount, the LED dies, and the mold apparatus are heated in a thermal reflow process to bond the LED dies to the bonding pads. Each recess substantially restricts shifting of the LED die with respect to the bonding pad during the heating.
Abstract translation: 一种发光二极管（LED）封装的方法包括将多个LED管芯耦合到子安装座上的对应焊盘。 具有容纳LED管芯的凹入凹槽的模具装置放置在子安装座上。 子载体，LED管芯和模具装置在热回流过程中被加热以将LED管芯接合到接合焊盘。 每个凹槽在加热期间基本上限制相对于接合焊盘的LED管芯的移位。
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公开(公告)号：US09224636B2
公开(公告)日：2015-12-29
申请号：US14267303
申请日：2014-05-01
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chyi Shyuan Chern , Hsin-Hsien Wu , Chun-Lin Chang , Hsing-Kuo Hsia , Hung-Yi Kuo
IPC: H01L21/768 , H01L21/02 , H01L21/3065
CPC classification number: H01L21/76801 , H01L21/02057 , H01L21/3065 , H01L21/76898
Abstract: A method includes forming an opening in a substrate, and the opening completely extends through the substrate. A recast material is formed on sidewalls of the substrate exposed by the opening. A first chemical is applied in the opening to remove the recast material, wherein a residue of the first chemical remains on portions of the sidewalls after the applying of the first chemical. Moreover, A second chemical is applied in the opening to remove the residue of the first chemical, and the second chemical is different from the first chemical.
Abstract translation: 一种方法包括在基板中形成开口，并且开口完全延伸穿过基板。 在由开口暴露的衬底的侧壁上形成重铸材料。 在开口中施加第一种化学品以去除重铸材料，其中在施加第一种化学品之后，第一种化学物质的残留物残留在侧壁的部分上。 此外，在开口中施加第二种化学物质以除去第一化学品的残余物，而第二种化学品与第一种化学品不同。
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公开(公告)号：US20150140703A1
公开(公告)日：2015-05-21
申请号：US14603423
申请日：2015-01-23
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsing-Kuo Hsia , Chih-Kuang Yu , Gordon Kuo , Chyi Shyuan Chern
IPC: H01L33/64 , H01L33/54 , H01L33/58 , H01L25/075
CPC classification number: H01L33/64 , H01L25/075 , H01L33/54 , H01L33/58 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
Abstract: An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.
Abstract translation: 一种装置包括其中具有多个开口的晶片。 对于每个开口，LED器件以这样的方式耦合到导电载体和晶片，使得每个耦合的LED器件和导电载体的一部分至少部分地填充开口。 制造LED器件的方法包括在晶片中形成多个开口。 该方法还包括将发光二极管（LED）器件耦合到导电载体上。 具有导电载体的LED装置至少部分地填充每个开口。
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公开(公告)号：US20140239323A1
公开(公告)日：2014-08-28
申请号：US14272626
申请日：2014-05-08
Applicant: TSMC SOLID STATE LIGHTING LTD.
Inventor： Chyi Shyuan Chern , Hsin-Hsien wu , Chih-Kuang Yu , Hung-Yi Kuo
IPC: H01L33/62
CPC classification number: H01L33/62 , H01L23/49513 , H01L25/0753 , H01L33/0095 , H01L33/08 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
Abstract: A plurality of conductive pads are disposed on a substrate. A plurality of semiconductor dies are each disposed on a respective one of the conductive pads. A mold device is positioned over the substrate. The mold device contains a plurality of recesses that are each configured to accommodate a respective one of the semiconductor dies underneath.
Abstract translation: 多个导电焊盘设置在基板上。 多个半导体管芯各自设置在相应的一个导电焊盘上。 模具装置位于衬底上。 模具装置包括多个凹槽，每个凹槽被配置为容纳下面的半导体模具中的相应的一个。
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公开(公告)号：US09349712B2
公开(公告)日：2016-05-24
申请号：US14626968
申请日：2015-02-20
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chih-Kuang Yu , Chyi Shyuan Chern
CPC classification number: H01L25/0753 , H01L27/153 , H01L33/0079 , H01L33/32 , H01L33/46 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: The present disclosure provides one embodiment of a light-emitting structure. The light-emitting structure includes a carrier substrate having first metal features; a transparent substrate having second metal features; a plurality of light-emitting diodes (LEDs) bonded with the carrier substrate and the transparent substrate, sandwiched between the carrier substrate and the transparent substrate; and metal pillars bonded to the carrier substrate and the transparent substrate, each of the metal pillars being disposed between adjacent two of the plurality of LEDs, wherein the first metal features, the second metal features and the metal pillars are configured to electrically connect the plurality of LEDs.
Abstract translation: 本公开提供了发光结构的一个实施例。 发光结构包括具有第一金属特征的载体衬底; 具有第二金属特征的透明基板; 与载体基板和透明基板结合的多个发光二极管（LED）夹在载体基板和透明基板之间; 以及结合到所述载体基板和所述透明基板的金属柱，每个所述金属柱设置在所述多个LED的相邻两个之间，其中所述第一金属特征，所述第二金属特征和所述金属柱被配置为电连接所述多个 的LED。
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