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公开(公告)号：US20150243848A1
公开(公告)日：2015-08-27
申请号：US14699136
申请日：2015-04-29
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Chieh Huang
IPC: H01L33/38
CPC classification number: H01L33/382 , H01L33/387 , H01L33/62 , H01L33/642 , H01L2224/16
Abstract: Multiple through-substrate vias (TSVs) are used to make electrical connections for an LED formed over a substrate. A first TSV extends through the substrate from a back surface of the substrate to the front surface of the substrate and includes a first TSV conductor that electrically connects to a first cladding layer of the LED. A second TSV extends through the substrate and an active layer of the LED from the back surface of the substrate to a second cladding layer or an ITO layer. The second TSV includes an isolation layer that electrically isolates a second TSV conductor from the first cladding layer and the active layer. Additionally dummy TSVs may be formed to conduct heat away from the LED optionally through a package substrate.
Abstract translation: 多个贯通衬底通孔（TSV）用于为衬底上形成的LED形成电连接。 第一TSV从衬底的背表面延伸穿过衬底到衬底的前表面，并且包括电连接到LED的第一覆层的第一TSV导体。 第二TSV从衬底的背面延伸穿过衬底和LED的有源层到第二覆层或ITO层。 第二TSV包括隔离层，其将第二TSV导体与第一包层和有源层电隔离。 另外，可以形成虚拟TSV以将热量从LED中任选地通过封装衬底导出。
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公开(公告)号：US20150054412A1
公开(公告)日：2015-02-26
申请号：US14524060
申请日：2014-10-27
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Chieh Huang
IPC: H05B33/08
CPC classification number: H05B33/0845 , F21V23/0457 , F21Y2115/10 , H05B33/0851 , H05B33/0869
Abstract: An integrated photonic device includes a number of LEDs and a feedback mechanism that measures individual LED light outputs using a photo sensor via a light transmitter disposed in the vicinity of individual LEDs. A controller or driver adjusts a current driven to each LED using the detected values according to various logic based on the device application.
Abstract translation: 集成光子器件包括多个LED和反馈机构，其通过布置在各个LED附近的光发射器使用光传感器来测量各个LED光输出。 根据设备应用的各种逻辑，控制器或驱动器使用检测到的值来调整驱动到每个LED的电流。
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公开(公告)号：US09125272B2
公开(公告)日：2015-09-01
申请号：US14524060
申请日：2014-10-27
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Chieh Huang
IPC: H05B33/08 , F21V23/04 , F21Y101/02
CPC classification number: H05B33/0845 , F21V23/0457 , F21Y2115/10 , H05B33/0851 , H05B33/0869
Abstract: A lighting apparatus includes a board, a first light-emitting diode (LED) bank disposed on the board, a second LED bank disposed on the board, a light detector coupled to the first LED bank, and a driver coupled to the light detector and to each of the first and second LED banks. The first LED bank includes a plurality of first LEDs. The second LED bank includes a plurality of second LEDs, and is electrically coupled to the first LED bank. The light detector is configured to detect an output decay of light from each of the first LEDs. The second LEDs in the second LED bank are initially deactivated and are subsequently activated in response to light output decay of the first LEDs.
Abstract translation: 照明装置包括板，布置在板上的第一发光二极管（LED）组，设置在板上的第二LED组，耦合到第一LED组的光检测器和耦合到光检测器的驱动器， 到第一和第二LED组中的每一个。 第一LED组包括多个第一LED。 第二LED组包括多个第二LED，并且电耦合到第一LED组。 光检测器被配置为检测来自每个第一LED的光的输出衰减。 第二LED组中的第二LED最初被去激活，随后响应于第一LED的光输出衰减而被激活。
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公开(公告)号：US20150187992A1
公开(公告)日：2015-07-02
申请号：US14645472
申请日：2015-03-12
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Chieh Huang
CPC classification number: H01L33/22 , H01L33/0066 , H01L33/0075 , H01L33/0079 , H01L33/20 , H01L33/46 , H01L2933/0025
Abstract: A device includes a textured substrate, which further includes a plurality of trenches. Each of the plurality of trenches includes a first sidewall and a second sidewall opposite the first sidewall. A plurality of reflectors configured to reflect light is formed, with each of the plurality of reflectors being on one of the first sidewalls of the plurality of trenches. The second sidewalls of the plurality of trenches are substantially free from any reflector.
Abstract translation: 一种器件包括纹理化衬底，其还包括多个沟槽。 多个沟槽中的每一个包括与第一侧壁相对的第一侧壁和第二侧壁。 多个反射器被配置成反射光，多个反射器中的每一个在多个沟槽的第一侧壁中的一个上。 多个沟槽的第二侧壁基本上没有任何反射器。
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公开(公告)号：US20140191191A1
公开(公告)日：2014-07-10
申请号：US14210522
申请日：2014-03-14
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Chieh Huang
Abstract: A device includes a textured substrate having a trench extending from a top surface of the textured substrate into the textured substrate, wherein the trench comprises a sidewall and a bottom. A light-emitting device (LED) includes an active layer over the textured substrate. The active layer has a first portion parallel to the sidewall of the trench and a second portion parallel to the bottom of the trench.
Abstract translation: 一种器件包括纹理化衬底，其具有从纹理化衬底的顶表面延伸到纹理衬底中的沟槽，其中沟槽包括侧壁和底部。 发光器件（LED）包括纹理衬底上的有源层。 有源层具有平行于沟槽侧壁的第一部分和平行于沟槽底部的第二部分。
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Patent Agency Ranking
6.发明申请Single Phosphor Layer Photonic Device for Generating White Light or Color Lights 有权用于产生白光或彩色光的单磷光体光子器件公开(公告)号：US20140065740A1
公开(公告)日：2014-03-06
申请号：US14084783
申请日：2013-11-20
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Chieh Huang , Chao-Hsiung Wang
CPC classification number: H01L33/502 , H01L27/153 , H01L33/0079 , H01L33/382 , H01L33/504 , H01L33/508 , H01L33/62 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2924/1305 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
Abstract: A photonic device generates light from a full spectrum of lights including white light. The device includes two or more LEDs grown on a substrate, each generating light of a different wavelength and separately controlled. A light-emitting structure is formed on the substrate and apportioned into the two or more LEDs by etching to separate the light-emitting structure into different portions. At least one of the LEDs is coated with a phosphor material so that different wavelengths of light are generated by the LEDs while the same wavelength of light is emitted from the light-emitting structure.
Abstract translation: 光子器件从包括白光的全光谱产生光。 该装置包括在基板上生长的两个或更多个LED，每个LED产生不同波长的光并分别控制。 在衬底上形成发光结构，并通过蚀刻分配到两个或更多个LED中，以将发光结构分离成不同的部分。 LED中的至少一个被磷光体材料涂覆，使得由发光结构发射相同波长的光的同时由LED产生不同波长的光。
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公开(公告)号：US09153739B2
公开(公告)日：2015-10-06
申请号：US14210522
申请日：2014-03-14
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Chieh Huang
Abstract: A device includes a textured substrate having a trench extending from a top surface of the textured substrate into the textured substrate, wherein the trench comprises a sidewall and a bottom. A light-emitting device (LED) includes an active layer over the textured substrate. The active layer has a first portion parallel to the sidewall of the trench and a second portion parallel to the bottom of the trench.
Abstract translation: 一种器件包括纹理化衬底，其具有从纹理化衬底的顶表面延伸到纹理衬底中的沟槽，其中沟槽包括侧壁和底部。 发光器件（LED）包括纹理衬底上的有源层。 有源层具有平行于沟槽侧壁的第一部分和平行于沟槽底部的第二部分。
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公开(公告)号：US20130045556A1
公开(公告)日：2013-02-21
申请号：US13632212
申请日：2012-10-01
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Chieh Huang
IPC: H01L33/20
Abstract: A device includes a textured substrate having a trench extending from a top surface of the textured substrate into the textured substrate, wherein the trench comprises a sidewall and a bottom. A light-emitting device (LED) includes an active layer over the textured substrate. The active layer has a first portion parallel to the sidewall of the trench and a second portion parallel to the bottom of the trench.
Abstract translation: 一种器件包括纹理化衬底，其具有从纹理化衬底的顶表面延伸到纹理衬底中的沟槽，其中沟槽包括侧壁和底部。 发光器件（LED）包括纹理衬底上的有源层。 有源层具有平行于沟槽侧壁的第一部分和平行于沟槽底部的第二部分。
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公开(公告)号：US09461204B2
公开(公告)日：2016-10-04
申请号：US14645472
申请日：2015-03-12
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Chieh Huang
CPC classification number: H01L33/22 , H01L33/0066 , H01L33/0075 , H01L33/0079 , H01L33/20 , H01L33/46 , H01L2933/0025
Abstract: A device includes a textured substrate, which further includes a plurality of trenches. Each of the plurality of trenches includes a first sidewall and a second sidewall opposite the first sidewall. A plurality of reflectors configured to reflect light is formed, with each of the plurality of reflectors being on one of the first sidewalls of the plurality of trenches. The second sidewalls of the plurality of trenches are substantially free from any reflector.
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公开(公告)号：US08884529B2
公开(公告)日：2014-11-11
申请号：US14078631
申请日：2013-11-13
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Chieh Huang
IPC: H05B33/08 , F21V23/04 , F21Y101/02
CPC classification number: H05B33/0845 , F21V23/0457 , F21Y2115/10 , H05B33/0851 , H05B33/0869
Abstract: An integrated photonic device includes a number of LEDs and a feedback mechanism that measures individual LED light outputs using a photo sensor via a light transmitter disposed in the vicinity of individual LEDs. A controller or driver adjusts a current driven to each LED using the detected values according to various logic based on the device application.
Abstract translation: 集成光子器件包括多个LED和反馈机构，其通过布置在各个LED附近的光发射器使用光传感器来测量各个LED光输出。 根据设备应用的各种逻辑，控制器或驱动器使用检测到的值来调整驱动到每个LED的电流。
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