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公开(公告)号：US09136442B2
公开(公告)日：2015-09-15
申请号：US13750097
申请日：2013-01-25
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Jui-Ping Weng , Hsiao-Wen Lee , Chun-Chih Chang , Min-Sheng Wu , Hsin-Hsien Lee
IPC: H01L27/15 , H01L33/62 , H01L33/50 , H01L25/075
CPC classification number: H01L33/50 , H01L25/0753 , H01L27/15 , H01L27/153 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.
Abstract translation: 本公开涉及一种发光二极管（LED）封装结构。 LED封装结构包括具有衬底的基座和在衬底上的多个接合焊盘。 LED封装结构包括通过接合焊盘的第一子集结合到衬底的多个p型LED。 LED封装结构包括通过接合焊盘的第二子集结合到衬底的多个n型LED。 一些接合焊盘属于接合焊盘的第一子集和第二子集。 p型LED和n型LED布置为交替对。 LED封装结构包括多个透明和导电部件，每个透明和导电部件设置在一对p型和n型LED中的一个上并使其互连。 LED封装结构包括设置在n型LED和p型LED上的一个或多个透镜。
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公开(公告)号：US09035334B2
公开(公告)日：2015-05-19
申请号：US14174929
申请日：2014-02-07
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Min Lin
IPC: H01L33/50 , H01L33/62 , H01L25/075
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/50 , H01L2224/13 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
Abstract: The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.
Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 根据该方法，提供一组金属焊盘和一组LED。 该组LED例如通过粘合工艺连接到金属焊盘组上。 LED连接到金属焊盘后，每个LED与相邻的LED间隔开。 同样根据该方法，荧光膜被集体涂覆在LED组上。 荧光膜被涂覆在每个LED的顶表面和侧表面上以及相邻的LED之间。 然后进行切割处理以切割位于相邻LED之间的部分荧光膜。 切割工艺将LED组分成多个单独的磷光体涂覆的LED。
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公开(公告)号：US08889439B2
公开(公告)日：2014-11-18
申请号：US13788536
申请日：2013-03-07
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Min Lin
CPC classification number: H01L33/504 , H01L33/46 , H01L33/505 , H01L2933/0041
Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.
Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 根据该方法，在胶带上设置多个LED。 粘合带设置在基板上。 在一些实施例中，衬底可以是玻璃衬底，硅衬底，陶瓷衬底和氮化镓衬底。 磷光体层被涂覆在多个LED上。 然后将磷光体层固化。 在荧光体层固化之后去除胶带和基材。 然后将替代胶带附接到多个LED。 然后在去除衬底之后，对多个LED进行切割处理。 然后可以将去除的衬底重新用于将来的LED封装工艺。
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公开(公告)号：US20140231836A1
公开(公告)日：2014-08-21
申请号：US14261892
申请日：2014-04-25
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chi Xiang Tseng , Hsiao-Wen Lee , Tien-Ming Lin , Min-Sheng Wu
CPC classification number: H01L33/505 , H01L27/153 , H01L33/504 , H01L33/508 , H01L2933/0041
Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.
Abstract translation: 本公开提供了一种发光二极管（LED）装置。 LED装置包括具有顶表面的LED发射器; 以及设置在LED发射器上的荧光体特征。 荧光体特征包括设置在LED发射器的顶表面上并具有在平行于LED发射器的顶表面的方向上限定的第一尺寸的第一荧光膜; 第二荧光体膜，设置在所述第一荧光膜上并具有沿所述方向限定的第二尺寸; 并且第二尺寸基本上小于第一尺寸。
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公开(公告)号：US20140209930A1
公开(公告)日：2014-07-31
申请号：US13750097
申请日：2013-01-25
Applicant: TSMC SOLID STATE LIGHTING LTD.
Inventor： Jui-Ping Weng , Hsiao-Wen Lee , Chun-Chih Chang , Min-Sheng Wu , Hsin-Hsien Lee
CPC classification number: H01L33/50 , H01L25/0753 , H01L27/15 , H01L27/153 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.
Abstract translation: 本公开涉及一种发光二极管（LED）封装结构。 LED封装结构包括具有衬底的基座和在衬底上的多个接合焊盘。 LED封装结构包括通过接合焊盘的第一子集结合到衬底的多个p型LED。 LED封装结构包括通过接合焊盘的第二子集结合到衬底的多个n型LED。 一些接合焊盘属于接合焊盘的第一子集和第二子集。 p型LED和n型LED布置为交替对。 LED封装结构包括多个透明和导电部件，每个透明和导电部件设置在一对p型和n型LED中的一个上并使其互连。 LED封装结构包括设置在n型LED和p型LED上的一个或多个透镜。
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Patent Agency Ranking
公开(公告)号：US09082942B2
公开(公告)日：2015-07-14
申请号：US14140973
申请日：2013-12-26
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Min Lin
CPC classification number: H01L33/504 , H01L33/46 , H01L33/505 , H01L2933/0041
Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.
Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 根据该方法，在胶带上设置多个LED。 粘合带设置在基板上。 在一些实施例中，衬底可以是玻璃衬底，硅衬底，陶瓷衬底和氮化镓衬底。 磷光体层被涂覆在多个LED上。 然后将磷光体层固化。 在荧光体层固化之后去除胶带和基材。 然后将替代胶带附接到多个LED。 然后在去除衬底之后，对多个LED进行切割处理。 然后可以将去除的衬底重新用于将来的LED封装工艺。
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公开(公告)号：US20140291611A1
公开(公告)日：2014-10-02
申请号：US14305352
申请日：2014-06-16
Applicant: TSMC Solid State Lighting Ltd,
Inventor： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Min Lin
CPC classification number: H01L33/505 , H01L33/46 , H01L33/508 , H01L33/54 , H01L2933/0041
Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A first conductive terminal and a second conductive terminal are each disposed below the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and on side surfaces of the first and second doped semiconductor layers and the light-emitting layer. A bottommost surface of the photo-conversion layer is located closer to the second doped semiconductor layer than bottom surfaces of the first and second conductive terminals.
Abstract translation: 本公开涉及照明装置。 照明装置包括第一掺杂半导体层。 发光层设置在第一掺杂半导体层上。 第二掺杂半导体层设置在发光层上。 第二掺杂半导体层具有与第一掺杂半导体层不同的导电类型。 第一导电端子和第二导电端子分别设置在第一掺杂半导体层的下方。 光转换层设置在第二掺杂半导体层上以及第一和第二掺杂半导体层和发光层的侧表面上。 光转换层的最下表面比第一和第二导电端子的底表面更靠近第二掺杂半导体层。
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公开(公告)号：US20140103372A1
公开(公告)日：2014-04-17
申请号：US14140973
申请日：2013-12-26
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Min Lin
IPC: H01L33/50
CPC classification number: H01L33/504 , H01L33/46 , H01L33/505 , H01L2933/0041
Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.
Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 根据该方法，在胶带上设置多个LED。 粘合带设置在基板上。 在一些实施例中，衬底可以是玻璃衬底，硅衬底，陶瓷衬底和氮化镓衬底。 磷光体层被涂覆在多个LED上。 然后将磷光体层固化。 在荧光体层固化之后去除胶带和基材。 然后将替代胶带附接到多个LED。 然后在去除衬底之后，对多个LED进行切割处理。 然后可以将去除的衬底重新用于将来的LED封装工艺。
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公开(公告)号：US09214610B2
公开(公告)日：2015-12-15
申请号：US14305352
申请日：2014-06-16
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Min Lin
CPC classification number: H01L33/505 , H01L33/46 , H01L33/508 , H01L33/54 , H01L2933/0041
Abstract: A lighting apparatus includes a first doped semiconductor layer, a light-emitting layer disposed over the first doped semiconductor layer, a second doped semiconductor layer disposed over the light-emitting layer, a first conductive terminal, a second conductive terminal, and a photo-conversion layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. The first conductive terminal and the second conductive terminal each are disposed below the first doped semiconductor layer. The photo-conversion layer is disposed over the second doped semiconductor layer and on side surfaces of the first and second doped semiconductor layers and the light-emitting layer. A bottommost surface of the photo-conversion layer is located closer to the second doped semiconductor layer than bottom surfaces of the first and second conductive terminals.
Abstract translation: 照明装置包括第一掺杂半导体层，设置在第一掺杂半导体层上的发光层，设置在发光层上的第二掺杂半导体层，第一导电端子，第二导电端子和光电二极管， 转换层。 第二掺杂半导体层具有与第一掺杂半导体层不同的导电类型。 第一导电端子和第二导电端子各自设置在第一掺杂半导体层的下方。 光转换层设置在第二掺杂半导体层上以及第一和第二掺杂半导体层和发光层的侧表面上。 光转换层的最下表面比第一和第二导电端子的底表面更靠近第二掺杂半导体层。
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公开(公告)号：US20140295593A1
公开(公告)日：2014-10-02
申请号：US14305092
申请日：2014-06-16
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Min Lin
IPC: H01L33/50
CPC classification number: H01L33/504 , H01L33/46 , H01L33/505 , H01L33/508 , H01L33/54 , H01L2933/0041
Abstract: The present disclosure involves a method. The method includes providing a substrate having a layer disposed thereon. A plurality of light-emitting devices is attached to the layer. A gel is applied over the substrate. The gel covers the plurality of light-emitting devices. The gel is shaped into a plurality of lenses. The lenses each cover a respective one of the light-emitting devices. The light-emitting devices are separated from one another. The substrate and the layer are removed.
Abstract translation: 本公开涉及一种方法。 该方法包括提供其上设置有层的基板。 多个发光装置附着在该层上。 将凝胶施加在基底上。 凝胶覆盖多个发光器件。 凝胶成形为多个透镜。 透镜各自覆盖相应的一个发光器件。 发光装置彼此分离。 去除衬底和层。
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