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公开(公告)号：US20140254180A1
公开(公告)日：2014-09-11
申请号：US14286534
申请日：2014-05-23
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Wei-Yu Yeh , Chih-Hsuan Sun
CPC classification number: H05K1/0203 , F21K9/20 , F21V29/70 , F21V29/763 , F21Y2103/10 , F21Y2115/10 , H05K1/056 , H05K1/111 , H05K3/0061 , H05K2201/066 , H05K2201/10106 , H05K2201/10969 , Y10T29/4913
Abstract: A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad.
Abstract translation: 发光二极管（LED）模块包括具有前侧和后侧的电路板，耦合到电路板的背面的散热器，设置在电路板的前侧的散热垫，设置在LED 在电路板的正面。 LED与散热垫热接触。 模块还包括放置在热垫上并与热垫热接触的散热装置。
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公开(公告)号：US09232602B2
公开(公告)日：2016-01-05
申请号：US14197288
申请日：2014-03-05
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Wei-Yu Yeh , Chih-Hsuan Sun
IPC: H05B33/08
CPC classification number: H05B33/0863 , H05B33/0824 , H05B33/0869
Abstract: A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time.
Abstract translation: 发光二极管（LED）灯包括许多不同颜色的LED，可以使用可由用户操作的外部开关以不同的组合打开和关闭。 用户或控制器可以调节灯输出的光的色温。 色温变化可能是用户偏好，并且可以补偿随时间降低的磷光体效率。
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公开(公告)号：US20150078014A1
公开(公告)日：2015-03-19
申请号：US14549596
申请日：2014-11-21
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Wei-Yu Yeh
CPC classification number: F21V19/005 , B23K20/002 , B23K20/10 , B23K2101/36 , F21V29/70 , H01L2924/0002 , H05K1/0203 , H05K1/05 , H05K3/0061 , H05K2201/10106 , H05K2203/0285 , H01L2924/00
Abstract: The present disclosure provides a lighting module. The lighting module includes a heat sink, a board disposed over the heat sink, and a bonding component that bonds the heat sink and the board together. The bonding component contains a combination of a first metal and a second metal. The lighting module also includes a photonic lighting device disposed over the board.
Abstract translation: 本公开提供了一种照明模块。 照明模块包括散热器，设置在散热器上方的板以及将散热器和板连接在一起的结合部件。 接合部件包含第一金属和第二金属的组合。 照明模块还包括设置在板上的光子照明装置。
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公开(公告)号：US08894249B2
公开(公告)日：2014-11-25
申请号：US14153347
申请日：2014-01-13
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Wei-Yu Yeh
CPC classification number: F21V19/005 , B23K20/002 , B23K20/10 , B23K2101/36 , F21V29/70 , H01L2924/0002 , H05K1/0203 , H05K1/05 , H05K3/0061 , H05K2201/10106 , H05K2203/0285 , H01L2924/00
Abstract: The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB).
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公开(公告)号：US09504120B2
公开(公告)日：2016-11-22
申请号：US14556318
申请日：2014-12-01
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Wei-Yu Yeh
CPC classification number: H05B33/089 , H05B33/0851 , Y02B20/341
Abstract: A system includes a plurality of light-emitting devices electrically coupled together. A temperature of each of the light-emitting devices is correlated with a voltage of said light-emitting device. The system includes a current driver configured to control an amount of current through at least a subset of the light-emitting devices. The system includes electronic circuitry that is electrically coupled to the subset of the light-emitting devices. The electronic circuitry is configured to: measure a voltage of the subset of the light-emitting devices while the light-emitting devices are in operation; determine, based on the measured voltage, whether the subset of the light-emitting devices is hotter than an acceptable temperature threshold; and instruct the current driver to reduce the amount of current through the subset of the light-emitting devices if the subset of the light-emitting devices has been determined to be hotter than the acceptable temperature threshold.
Abstract translation: 一种系统包括电耦合在一起的多个发光器件。 每个发光器件的温度与所述发光器件的电压相关。 该系统包括被配置为控制通过至少一个发光器件子集的电流量的电流驱动器。 该系统包括电耦合到发光器件的子集的电子电路。 电子电路被配置为：在发光装置运行时测量发光装置的子集的电压; 基于测量的电压确定发光器件的子集是否比可接受的温度阈值更热; 并且如果已经确定发光装置的子集比可接受的温度阈值更热，则指示当前的驱动器减少通过发光装置的子集的电流量。
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Patent Agency Ranking
公开(公告)号：US20150123571A1
公开(公告)日：2015-05-07
申请号：US14556318
申请日：2014-12-01
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Wei-Yu Yeh
IPC: H05B33/08
CPC classification number: H05B33/089 , H05B33/0851 , Y02B20/341
Abstract: A system includes a plurality of light-emitting devices electrically coupled together. A temperature of each of the light-emitting devices is correlated with a voltage of said light-emitting device. The system includes a current driver configured to control an amount of current through at least a subset of the light-emitting devices. The system includes electronic circuitry that is electrically coupled to the subset of the light-emitting devices. The electronic circuitry is configured to: measure a voltage of the subset of the light-emitting devices while the light-emitting devices are in operation; determine, based on the measured voltage, whether the subset of the light-emitting devices is hotter than an acceptable temperature threshold; and instruct the current driver to reduce the amount of current through the subset of the light-emitting devices if the subset of the light-emitting devices has been determined to be hotter than the acceptable temperature threshold.
Abstract translation: 一种系统包括电耦合在一起的多个发光器件。 每个发光器件的温度与所述发光器件的电压相关。 该系统包括被配置为控制通过至少一个发光器件子集的电流量的电流驱动器。 该系统包括电耦合到发光器件的子集的电子电路。 电子电路被配置为：在发光装置运行时测量发光装置的子集的电压; 基于测量的电压确定发光器件的子集是否比可接受的温度阈值更热; 并且如果已经确定发光装置的子集比可接受的温度阈值更热，则指示当前的驱动器减少通过发光装置的子集的电流量。
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公开(公告)号：US08999770B2
公开(公告)日：2015-04-07
申请号：US13949556
申请日：2013-07-24
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Tien-Ming Lin , Chih-Hsuan Sun , Wei-Yu Yeh
CPC classification number: H01L33/58 , H01L33/507 , H01L2224/48091 , H01L2924/0002 , H01L2933/0041 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.
Abstract translation: 半导体结构包括具有多个管芯区域的模块，设置在衬底上的多个发光器件，使得每个管芯区域包括一个发光器件，以及在该模块上的透镜板，并且粘附到 基材用胶。 透镜板包括多个微透镜，每个微透镜各自对应于一个裸片区域，并且在每个裸片区域中，胶水通过相应的一个微透镜提供一个发光器件的气密封装。 此外，作为透镜板的一部分包括磷光体。
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公开(公告)号：US20140184081A1
公开(公告)日：2014-07-03
申请号：US14197288
申请日：2014-03-05
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Wei-Yu Yeh , Chih-Hsuan Sun
IPC: H05B33/08
CPC classification number: H05B33/0863 , H05B33/0824 , H05B33/0869
Abstract: A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time.
Abstract translation: 发光二极管（LED）灯包括许多不同颜色的LED，可以使用可由用户操作的外部开关以不同的组合打开和关闭。 用户或控制器可以调节灯输出的光的色温。 色温变化可能是用户偏好，并且可以补偿随时间降低的磷光体效率。
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公开(公告)号：US09970603B2
公开(公告)日：2018-05-15
申请号：US14200069
申请日：2014-03-07
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chih-Hsuan Sun , Wei-Yu Yeh , Hsueh-Hung Fu , Dong Jung Suen
IPC: B60Q1/06 , F21K99/00 , F21V3/04 , F21V7/00 , B05D5/06 , F21V29/74 , F21V29/77 , F21K9/20 , F21K9/232 , F21K9/60 , F21K9/66 , F21Y101/00 , F21Y115/10
CPC classification number: F21K9/60 , B05D5/061 , B05D5/063 , F21K9/20 , F21K9/232 , F21K9/66 , F21V3/049 , F21V3/0625 , F21V3/10 , F21V7/0016 , F21V29/74 , F21V29/773 , F21Y2101/00 , F21Y2115/10
Abstract: The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.
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公开(公告)号：US09074738B2
公开(公告)日：2015-07-07
申请号：US14272600
申请日：2014-05-08
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
IPC: F21V9/16 , F21V3/00 , F21K99/00 , F21V29/74 , F21Y101/02 , F21V3/02 , F21V13/02 , F21Y113/00 , F21V29/507
CPC classification number: F21K9/64 , F21K9/232 , F21K9/90 , F21V3/02 , F21V13/02 , F21V29/507 , F21V29/70 , F21V29/74 , F21Y2101/00 , F21Y2113/13 , F21Y2115/10 , Y10T29/4913
Abstract: A lamp includes a substrate, a plurality of light-emitting devices located over the substrate, and a cap that is located over the light-emitting devices. The plurality of light-emitting devices include a first subset of light-emitting devices and a second subset of light-emitting devices. Each light-emitting device in the first subset is free of a phosphor coating. Each light-emitting device in the second subset includes a phosphor coating. The cap has both photo-conversion properties and light-scattering properties, and the cap is located over the first subset of the light-emitting devices but exposes the second subset of the light-emitting devices.
Abstract translation: 灯包括衬底，位于衬底上方的多个发光器件和位于发光器件上方的帽。 多个发光器件包括发光器件的第一子集和发光器件的第二子集。 第一子集中的每个发光器件都不含磷光体涂层。 第二子集中的每个发光器件包括磷光体涂层。 盖具有光转换性质和光散射性质，并且帽位于发光器件的第一子集之上，但暴露出发光器件的第二子集。
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