公开(公告)号：US20140009513A1

公开(公告)日：2014-01-09

申请号：US14006531

申请日：2011-11-30

Applicant: Tomoharu Noutoshi ,  Takashi Kanda ,  Toshiyuki Fujine

Inventor： Tomoharu Noutoshi ,  Takashi Kanda ,  Toshiyuki Fujine

IPC: G09G5/10

CPC classification number: G09G5/10 ,  G09G3/3426 ,  G09G3/36 ,  G09G2320/0626 ,  G09G2320/0646 ,  G09G2320/066 ,  G09G2320/0673 ,  G09G2360/16 ,  H04N5/57 ,  H04N21/4318 ,  H04N21/44008

Abstract: A portion of a video signal for emitting light is detected, and the display brightness of the light emission portion is enhanced and displayed in a more conspicuous manner, whereby the sense of radiance is increased and the image quality is improved. A light emission detector (2) of the video display device generates a histogram in which the number of pixels is integrated into a predetermined feature quantity of an input video signal; and detects an upper region of a predetermined range of the histogram as a light emission section. An area-active control/brightness stretch portion (4) stretches and boosts the brightness of a backlight portion (6). A mapping portion (3) reduces the brightness of the video signal in a non-light-emission section, which excludes the detected light emission section. An increase in the screen brightness of the non-light-emission section is thereby suppressed, and the display brightness of the light emission section is enhanced.

Abstract translation: 检测用于发光的视频信号的一部分，并且以更明显的方式增强和显示发光部分的显示亮度，从而增加了感光度并提高了图像质量。 视频显示装置的发光检测器（2）生成其中像素数被集成到输入视频信号的预定特征量中的直方图; 并且将直方图的预定范围的上部区域检测为发光部。 区域主动控制/亮度伸展部分（4）延伸和提升背光部分（6）的亮度。 映射部分（3）降低非发光部分中的视频信号的亮度，其不包括检测到的发光部分。 由此抑制了非发光部分的屏幕亮度的增加，并且增强了发光部分的显示亮度。

公开(公告)号：US20070289706A1

公开(公告)日：2007-12-20

申请号：US11649203

申请日：2007-01-04

Applicant: Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

Inventor： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

IPC: C09J5/06

CPC classification number: H05K3/4614 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4069 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/0568 ,  H05K2203/063 ,  Y10T29/49117

Abstract: A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.

Abstract translation: 一种制造多层板的方法包括以下步骤：将粘合油墨施加到第一基板的端子上，粘合油墨包括含有填料和固化剂的热固性树脂，填料由镀有焊料的金属颗粒形成， 金属颗粒各自具有第一熔点，并且焊料具有低于第一熔点的第二熔点; 将第二基板接合到由热固性树脂构成的接合片，并且具有设置在与第二基板的端子对应的部分中的通孔; 并且利用接合片以这样的方式对第一和第二基板进行加热和加压，使得端子彼此相对以实现粘合片和粘合油墨的固化并形成一体结构。

公开(公告)号：US20070222039A1

公开(公告)日：2007-09-27

申请号：US11526100

申请日：2006-09-25

Applicant: Takashi Kanda ,  Kenji Fukuzono

Inventor： Takashi Kanda ,  Kenji Fukuzono

IPC: H01L23/58

CPC classification number: H01L24/83 ,  H01L21/6835 ,  H01L23/36 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/16 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81101 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19106 ,  H05K3/323 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/467 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/05599

Abstract: A semiconductor device includes a multi-layer substrate and a semiconductor element mounted on the multi-layer substrate. The multi-layer substrate contains a plurality of circuit-formation layers joined by a first resin material. The semiconductor element is mounted on the multi-layer substrate by being joined to the multi-layer substrate by a second resin material. The first resin material and the second resin material are curable in the same heating condition.

Abstract translation: 半导体器件包括多层基板和安装在多层基板上的半导体元件。 多层基板包含由第一树脂材料连接的多个电路形成层。 半导体元件通过第二树脂材料与多层基板接合而安装在多层基板上。 第一树脂材料和第二树脂材料在相同的加热条件下可固化。

公开(公告)号：US07053493B2

公开(公告)日：2006-05-30

申请号：US10992651

申请日：2004-11-22

Applicant: Takashi Kanda ,  Kenji Fukuzono

Inventor： Takashi Kanda ,  Kenji Fukuzono

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A semiconductor device including a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted. The adhesive has a coefficient of thermal expansion smaller than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or larger than 10 GPa. Otherwise, the adhesive has a coefficient of thermal expansion larger than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or smaller than 10 GPa. The height of the stiffener is less than that of the external terminals.

Abstract translation: 一种半导体器件，包括衬底，安装在衬底上的半导体元件和经由粘合剂附着到衬底的与安装半导体元件的表面相对的表面的加强件。 粘合剂的热膨胀系数小于基材和加强件的热膨胀系数，并且粘合剂的纵向弹性模量等于或大于10GPa。 否则，粘合剂的热膨胀系数大于基材和加强件的热膨胀系数，并且粘合剂的纵向弹性模量等于或小于10GPa。 加强件的高度小于外部端子的高度。

公开(公告)号：US20050096363A1

公开(公告)日：2005-05-05

申请号：US10491935

申请日：2002-10-09

Applicant: Shogo Sakuma ,  Tomio Yamakawa ,  Takashi Kanda ,  Seiichiro Masui

Inventor： Shogo Sakuma ,  Tomio Yamakawa ,  Takashi Kanda ,  Seiichiro Masui

IPC: A61K31/00 ,  A61K31/423 ,  A61K31/427 ,  A61K31/454 ,  A61P3/04 ,  A61P3/06 ,  A61P3/10 ,  A61P9/00 ,  A61P9/10 ,  A61P19/10 ,  A61P25/28 ,  A61P29/00 ,  A61P35/00 ,  C07D403/06 ,  C07D405/06 ,  C07D409/06 ,  C07D413/06 ,  C07D413/12 ,  C07D413/14 ,  C07D417/06 ,  C07D417/12 ,  C07D417/14 ,  A61K31/4178 ,  A61K31/422 ,  A61K31/4439 ,  C07D43/14

CPC classification number: C07D403/06 ,  A61K31/00 ,  A61K31/423 ,  A61K31/427 ,  A61K31/454 ,  C07D405/06 ,  C07D409/06 ,  C07D413/06 ,  C07D413/12 ,  C07D413/14 ,  C07D417/06 ,  C07D417/12 ,  C07D417/14

Abstract: A compound represented by the formula (I) or a salt of the compound, and a PPAR-δ activator which contains the compound or salt as the active ingredient: (wherein A represents O or S; B1 represents N, etc.; B2 represents O, etc.; each of X1 and X2 represents O, S, a bond, etc.; Y represents C1-8 alkylene chain; Z represents O or S; R1 represents aryl, etc. which can have substituents; R2 represents C1-8 alkyl, etc.; R3 represents C1-8 alkyl, C2-8 alkenyl, etc.; each of R4 and R5 represents hydrogen, C1-8 alkyl, etc.; and R6 represents hydrogen, etc.; provided that each of Z and R3 is attached to the benzene ring, and X2 is not attached to the benzene ring).

Abstract translation: 由式（I）表示的化合物或化合物的盐和含有该化合物或盐作为活性成分的PPAR-δ活化剂：（其中A表示O或S; B < 表示N等; B 2表示O等; X 1和X 2各自表示O，S，键， Y表示C 1-8亚烷基链; Z表示O或S; R 1表示可具有取代基的芳基等; R 2， / SUP表示C 1-8烷基等; R 3表示C 1-8烷基，C 2-8 链烯基等; R 4和R 5各自代表氢，C 1-8烷基等;和 R 6表示氢等;条件是Z和R 3各自连接到苯环上，并且X 2不连接 到苯环）。

公开(公告)号：US20050054674A1

公开(公告)日：2005-03-10

申请号：US10486783

申请日：2002-08-02

Applicant: Shogo Sakuma ,  Tomio Yamakawa ,  Takashi Kanda ,  Seiichiro Masui

Inventor： Shogo Sakuma ,  Tomio Yamakawa ,  Takashi Kanda ,  Seiichiro Masui

IPC: A61P3/04 ,  A61P3/06 ,  A61P3/10 ,  A61P5/14 ,  A61P9/00 ,  A61P9/10 ,  A61P19/10 ,  A61P21/04 ,  A61P25/28 ,  A61P31/00 ,  A61P35/00 ,  A61P43/00 ,  C07D233/54 ,  C07D263/32 ,  C07D263/62 ,  C07D277/24 ,  C07D277/26 ,  A61K31/4709 ,  A61K31/4178 ,  A61K31/422 ,  A61K31/427 ,  A61K31/4439

CPC classification number: C07D263/62 ,  C07D263/32 ,  C07D277/24

Abstract: A compound represented by the following general formula (I): (wherein R1 represents phenyl, etc. which can have substituents selected from the group consisting of C1-8 alkyl, C1-8 alkyl having halogen, halogen, hydroxyl, etc.; R2 represents C1-8 alkyl, etc.; A represents oxygen, sulfur, etc.; X represents C1-8 alkylene chain, etc.; Y represents C(═O), CH═CH, etc.; R3, R4, and R5 each represents hydrogen, C1-8 alkyl, etc.; B represents CH or nitrogen; Z represents oxygen or sulfur; R6 and R7 each represents hydrogen, C1-8 alkyl, etc.; and R8 represents hydrogen or C1-8 alkyl; provided that at least one of R3, R4, and R5 is not hydrogen) or a salt of the compound; and a PPAR-δ activator which contains the compound or salt as the active ingredient.

Abstract translation: 由以下通式（I）表示的化合物：其中R 1表示可具有选自C 1-8烷基，具有卤素，卤素，羟基等的C 1-8烷基的取代基的苯基等 ; R 2表示C 1-8烷基等; A表示氧，硫等; X表示C 1-8亚烷基链等; Y表示C（= O），CH = CH等; R 3，R 4和R 5各自表示氢，C 1-8烷基等; B表示CH或氮; Z表示氧或硫; R 6和R 7各自表示 氢，C 1-8烷基等; R 8表示氢或C 1-8烷基;条件是R 3，R 4和R 5中的至少一个不是氢）或 化合物的盐; 和含有该化合物或盐作为活性成分的PPAR-δ活化剂。

公开(公告)号：US06555607B1

公开(公告)日：2003-04-29

申请号：US09786245

申请日：2001-02-28

Applicant: Takashi Kanda ,  Hatsuyuki Tanaka

Inventor： Takashi Kanda ,  Hatsuyuki Tanaka

IPC: C08L6100

CPC classification number: G03F7/0048 ,  G03F7/0035 ,  G03F7/40

Abstract: A water-soluble resin composition comprising (1) a water-soluble resin, (2) a water-soluble crosslinking agent, (3) at least one of surface active agents selected from acetylene alcohols, acetylene glycols, polyethoxylates of acetylene alcohols and polyethoxylates of acetylene glycols, and (4) a solvent consisting of water or a mixture of water and a water-soluble solvent. This water-soluble resin composition is applied onto a resist pattern, then heated to crosslink by an acid supplied from the resist, followed by development to remove the non-crosslinked water-soluble resin coating layer. This water-soluble resin composition is excellent in coating characteristics on steps of resist patterns and in dimensional regulation upon fining of patterns so that resist patterns such as trench patterns and hole patterns can effectively be fined.

Abstract translation: 一种水溶性树脂组合物，其包含（1）水溶性树脂，（2）水溶性交联剂，（3）选自乙炔醇，乙炔二醇，乙炔醇的聚乙氧基化物和聚乙氧基化物的至少一种表面活性剂 的乙炔二醇，和（4）由水或水和水溶性溶剂的混合物组成的溶剂。 将该水溶性树脂组合物涂布在抗蚀剂图案上，然后通过由抗蚀剂供给的酸进行加热交联，进行显影，除去未交联的水溶性树脂被覆层。 这种水溶性树脂组合物在抗蚀剂图案的步骤和图案的澄清时的尺寸调节中具有优异的涂布特性，使得可以有效地处理诸如沟槽图案和孔图案的抗蚀图案。

公开(公告)号：US5920155A

公开(公告)日：1999-07-06

申请号：US958326

申请日：1997-10-27

Applicant: Takashi Kanda ,  Kazuo Yoshida ,  Masahiro Naruo ,  Kazuhiro Hori ,  Masahito Ohnishi

Inventor： Takashi Kanda ,  Kazuo Yoshida ,  Masahiro Naruo ,  Kazuhiro Hori ,  Masahito Ohnishi

IPC: H05B41/295 ,  G05F1/00

CPC classification number: H05B41/295 ,  Y10S315/04

Abstract: An electronic ballast for discharge lamps comprises a main resonance circuit for applying a voltage necessary for operating of a discharge lamp having filaments to both ends of the discharge lamp and a filament resonance circuit for supplying a filament current to the filaments, wherein the main resonance circuit and filament resonance circuit have resonance circuits having different resonance characteristics in an output path leading to the discharge lamp and also change their outputs depending on an operating frequency of switching elements. Thereby a filament current and a voltage across the discharge lamp can be set at suitable one of respective operational modes of the discharge lamp according to an operational state of the discharge lamp.

Abstract translation: 一种用于放电灯的电子镇流器包括：主谐振电路，用于将放电灯的两端具有长丝的放电灯的操作所需的电压和用于向灯丝提供灯丝电流的灯丝共振电路，其中主谐振电路 并且灯丝谐振电路具有在通向放电灯的输出路径中具有不同谐振特性的谐振电路，并且还根据开关元件的工作频率改变它们的输出。 由此，可以根据放电灯的工作状态，将灯丝电流和放电灯两端的电压设定为放电灯的各个动作模式的适当一个。

公开(公告)号：US5804924A

公开(公告)日：1998-09-08

申请号：US683957

申请日：1996-07-19

Applicant: Masahito Ohnishi ,  Tadao Uetsuki ,  Takashi Kanda ,  Masahiro Naruo

Inventor： Masahito Ohnishi ,  Tadao Uetsuki ,  Takashi Kanda ,  Masahiro Naruo

IPC: H05B41/282 ,  H05B41/292 ,  H05B41/38 ,  H05B37/00

CPC classification number: H05B41/2928 ,  H05B41/282 ,  H05B41/38 ,  Y02B20/183

Abstract: A discharge lamp lighting device includes first voltage source of a high voltage capable of increasing lamp current, the voltage value of which being sequentially variable, and second voltage source of a low voltage capable of decreasing the lamp current, the voltage value of which being sequentially variable, lighting connection of the first and second voltages sources to a discharge lamp being alternately changed over for its stable lighting, whereby the stable lighting of the lamp can be made with any current limiting element minimized and a response to variation in outputs over a wide range as well as any radiant noise can be effectively improved.

Abstract translation: 放电灯点亮装置包括能够增加其电压值可以变化的高电压的第一电压源和能够降低灯电流的低电压的第二电压源，其电压值依次为 可变的，将第一和第二电压源的照明连接交替地切换到用于其稳定照明的放电灯，由此可以使任何限流元件最小化并且对宽广的输出变化的响应来进行灯的稳定照明 范围以及任何辐射噪声都可以有效提高。

公开(公告)号：US5532844A

公开(公告)日：1996-07-02

申请号：US283214

申请日：1994-07-29

Applicant: Yuichi Kagami ,  Takashi Kanda

Inventor： Yuichi Kagami ,  Takashi Kanda

IPC: G06F3/00 ,  H04N1/00 ,  H04N1/10 ,  H04N1/12 ,  H04N1/193 ,  H04N1/32 ,  H01J3/00

CPC classification number: H04N1/00241 ,  H04N1/00236 ,  H04N1/10 ,  H04N1/121 ,  H04N1/00204 ,  H04N1/193 ,  H04N2201/0034

Abstract: An image data transferring system interfaces an image processor and an image scanner by utilization of signal input and output ports of a common printer connector mounted on the image processor without using a specific dedicated interface to rationally transfer a multiple-bit image data signal from the image scanner. The image processor and said image scanner can share the signal input and output ports by classifying said ports into an output port block for feeding out a command signal from the image processor, an image data input port block for transferring the image data signal from the image scanner, and a control port block for issuing a control signal to be given to the image scanner. The effective transfer ports can be recognized by comparing a check signal to be given to the image scanner and its echo signal sent back from the image scanner.

Abstract translation: 图像数据传送系统通过利用安装在图像处理器上的公共打印机连接器的信号输入和输出端口来连接图像处理器和图像扫描器，而不使用特定的专用接口来合理地从图像中传输多位图像数据信号 扫描器。 图像处理器和图像扫描器可以通过将所述端口分类为输出端口块来共享信号输入和输出端口，用于从图像处理器输出命令信号，用于从图像传送图像数据信号的图像数据输入端口块 扫描器和用于发出要给予图像扫描器的控制信号的控制端口块。 可以通过比较要给予图像扫描器的检查信号和从图像扫描器发送的回波信号来识别有效传送端口。