公开(公告)号：US09437582B2

公开(公告)日：2016-09-06

申请号：US14257795

申请日：2014-04-21

Applicant: Tessera, Inc.

Inventor： David Gibson ,  Andy Stavros

IPC: H01L25/10 ,  H05K1/11 ,  H01L23/498 ,  H01L23/00 ,  H05K1/14 ,  H05K3/34 ,  H01L25/065

CPC classification number: H01L25/10 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/14 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/1437 ,  H01L2924/15311 ,  H05K1/112 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2201/10515 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and bottom surfaces. Top unit terminals are exposed at the top surfaces and bottom unit terminals are exposed at the bottom surfaces. The top and bottom unit terminals are provided at a set of ordered column positions. Each top unit terminal of the set, except the top unit terminals at the highest ordered column position, is connected to a respective bottom unit terminal of the same unit at a next higher ordered column position. Each bottom unit terminal of the set, except the bottom unit terminals of the lowest unit in the stack, is connected to a respective upper unit terminal of the next lower unit in the stack at the same column position.

Abstract translation: 微电子组件包括彼此叠置以形成具有垂直方向的至少一个堆叠的单元。 每个单元包括一个或多个微电子器件，并且具有顶表面和底表面。 顶部单元端子在顶部表面露出，底部单元端子暴露在底部表面。 顶部和底部单元端子设置在一组有序列位置。 除了在最高有序列位置的顶部单元端子之外，组件的每个顶部单元端子在下一个更高排序的列位置处连接到同一单元的相应底部单元端子。 除了堆叠中最低单元的底部单元端子之外，组件的每个底部单元端子连接到堆叠中的下一个下部单元的相应上部单元端子处于相同的列位置。

公开(公告)号：US20140332982A1

公开(公告)日：2014-11-13

申请号：US14257795

申请日：2014-04-21

Applicant: TESSERA, INC.

Inventor： David Gibson ,  Andy Stavros

IPC: H01L25/10 ,  H01L23/00

CPC classification number: H01L25/10 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/14 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/1437 ,  H01L2924/15311 ,  H05K1/112 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2201/10515 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and bottom surfaces. Top unit terminals are exposed at the top surfaces and bottom unit terminals are exposed at the bottom surfaces. The top and bottom unit terminals are provided at a set of ordered column positions. Each top unit terminal of the set, except the top unit terminals at the highest ordered column position, is connected to a respective bottom unit terminal of the same unit at a next higher ordered column position. Each bottom unit terminal of the set, except the bottom unit terminals of the lowest unit in the stack, is connected to a respective upper unit terminal of the next lower unit in the stack at the same column position.

Abstract translation: 微电子组件包括彼此叠置以形成具有垂直方向的至少一个堆叠的单元。 每个单元包括一个或多个微电子器件，并且具有顶表面和底表面。 顶部单元端子在顶部表面露出，底部单元端子暴露在底部表面。 顶部和底部单元端子设置在一组有序列位置。 除了最高排列列位置的顶部单元端子之外，该组的每个顶部单元端子在下一个更高排序的列位置连接到同一单元的相应底部单元端子。 除了堆叠中最低单元的底部单元端子之外，组件的每个底部单元端子连接到堆叠中的下一个下部单元的相应上部单元端子处于相同的列位置。