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1.发明申请Assembly For Inspecting Machine Parts Used In The Production Of Semiconductor Components 审中-公开用于半导体元件生产中使用的检查机器零件的组件公开(公告)号：US20150300962A1
公开(公告)日：2015-10-22
申请号：US14254774
申请日：2014-04-16
Applicant: Texas Instruments Incorporated
Inventor： Mohd Azri Hashim , Mohd Muzamir Kamalluddin
CPC classification number: G01N21/95684 , G01N21/9515 , G01N2201/101
Abstract: An assembly for inspecting machine parts used in the production of semiconductor devices, such as integrated circuit (IC) dies. The assembly includes a laser scanning apparatus adapted to precisely measure predetermined parameters of the machine parts.
Abstract translation: 用于检查用于生产半导体器件（诸如集成电路（IC））芯片的机器部件的组件。 组件包括适于精确地测量机器部件的预定参数的激光扫描装置。
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公开(公告)号：US10679962B2
公开(公告)日：2020-06-09
申请号：US15019692
申请日：2016-02-09
Applicant: Texas Instruments Incorporated
Inventor： Mohd Azri Hashim , Mohd Muzamir Kamalluddin
Abstract: A jig for holding a wire bonding capillary includes a first arm and an opening in the first arm, wherein a wire bonding capillary is receivable within the opening. A second arm is pivotally attached to the first arm. The second arm has a surface facing the first arm, wherein the surface is contactable with a capillary mount of a wire bonding machine.
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公开(公告)号：US20170229419A1
公开(公告)日：2017-08-10
申请号：US15019692
申请日：2016-02-09
Applicant: Texas Instruments Incorporated
Inventor： Mohd Azri Hashim , Mohd Muzamir Kamalluddin
Abstract: A jig for holding a wire bonding capillary includes a first arm and an opening in the first arm, wherein a wire bonding capillary is receivable within the opening. A second arm is pivotally attached to the first arm. The second arm has a surface facing the first arm, wherein the surface is contactable with a capillary mount of a wire bonding machine.
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