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公开(公告)号:US20220404647A1
公开(公告)日:2022-12-22
申请号:US17896303
申请日:2022-08-26
Applicant: Texas Tech University System
Inventor: Hongxing Jiang , Changzhi Li , Jing Li , Jingyu Lin
Abstract: Disclosed is a system and method for solid-state 2D optical phased arrays (OPAs), which are fabricated from In-rich In1-xGaxN/GaN multiple quantum wells (MQWs). In-rich InxGa1-xN alloys possess the unique properties of exceptionally high free-carrier-induced refractive index (n) change and low optical loss. InGaN/GaN MQW pixels play the role of using a very small fraction of a laser beam to modulate the phase of the laser beam. The phase of each MQW pixel in the OPA is controlled independently via electro-optic effect through the integration between OPA pixels with a Laterally Diffused MOSFET (LDMOS) integrated circuit driver to achieve the manipulation of the distribution of optical power in the far field. The present invention is applicable to a wide range of applications, including the operation of LIDAR systems, laser weapons, laser illuminators, and laser imaging systems.
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公开(公告)号:US11460723B1
公开(公告)日:2022-10-04
申请号:US16703496
申请日:2019-12-04
Applicant: Texas Tech University System
Inventor: Hongxing Jiang , Changzhi Li , Jing Li , Jingyu Lin
Abstract: Disclosed is a system and method for solid-state 2D optical phased arrays (OPAs), which are fabricated from In-rich In1-xGaxN/GaN multiple quantum wells (MQWs). In-rich InxGa1-xN alloys possess the unique properties of exceptionally high free-carrier-induced refractive index (n) change and low optical loss. InGaN/GaN MQW pixels play the role of using a very small fraction of a laser beam to modulate the phase of the laser beam. The phase of each MQW pixel in the OPA is controlled independently via electro-optic effect through the integration between OPA pixels with a Laterally Diffused MOSFET (LDMOS) integrated circuit driver to achieve the manipulation of the distribution of optical power in the far field. The present invention is applicable to a wide range of applications, including the operation of LIDAR systems, laser weapons, laser illuminators, and laser imaging systems.
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公开(公告)号:US20210111299A1
公开(公告)日:2021-04-15
申请号:US16897742
申请日:2020-06-10
Applicant: Texas Tech University System
Inventor: Hongxing Jiang , Jingyu Lin , Jing Li , Avisek Maity , Sam Grenadier
IPC: H01L31/115 , G01T3/08 , H01L31/0224 , H01L31/036 , H01L31/02 , H01L31/18 , H01L31/0304
Abstract: A method for fabricating a neutron detector includes providing an epilayer wafer of Boron-10 enriched hexagonal boron nitride (h-10BN or h-BN or 10BN or BN) having a thickness (t), dicing or cutting the epilayer wafer into one or more BN strips having a width (W) and a length (L), and depositing a first metal contact on a first surface of at least one of the BN strip and a second metal contact on a second surface of the at least one BN strip. The neutron detector includes an electrically insulating submount, a BN epilayer of Boron-10 enriched hexagonal boron nitride (h-10BN or h-BN or 10BN or BN) placed on the insulating submount, a first metal contact deposited on a first surface of the BN epilayer, and a second metal contact deposited on a second surface of the BN epilayer.
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公开(公告)号:US10714651B2
公开(公告)日:2020-07-14
申请号:US16170500
申请日:2018-10-25
Applicant: Texas Tech University System
Inventor: Hongxing Jiang , Jingyu Lin , Jing Li , Avisek Maity , Sam Grenadier
IPC: H01L21/02 , H01L31/115 , G01T3/08 , H01L31/0224 , H01L31/036 , H01L31/02 , H01L31/18 , H01L31/0304
Abstract: A method for fabricating a neutron detector includes providing an epilayer wafer of Boron-10 enriched hexagonal boron nitride (h-10BN or h-BN or 10BN or BN) having a thickness (t), dicing or cutting the epilayer wafer into one or more BN strips having a width (W) and a length (L), and depositing a first metal contact on a first surface of at least one of the BN strip and a second metal contact on a second surface of the at least one BN strip. The neutron detector includes an electrically insulating submount, a BN epilayer of Boron-10 enriched hexagonal boron nitride (h-10BN or h-BN or 10BN or BN) placed on the insulating submount, a first metal contact deposited on a first surface of the BN epilayer, and a second metal contact deposited on a second surface of the BN epilayer.
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公开(公告)号:US20200135958A1
公开(公告)日:2020-04-30
申请号:US16170500
申请日:2018-10-25
Applicant: Texas Tech University System
Inventor: Hongxing Jiang , Jingyu Lin , Jing Li , Avisek Maity , Sam Grenadier
IPC: H01L31/115 , G01T3/08 , H01L31/0224 , H01L31/0304 , H01L31/02 , H01L31/18 , H01L31/036
Abstract: A method for fabricating a neutron detector includes providing an epilayer wafer of Boron-10 enriched hexagonal boron nitride (h-10BN or h-BN or 10BN or BN) having a thickness (t), dicing or cutting the epilayer wafer into one or more BN strips having a width (W) and a length (L), and depositing a first metal contact on a first surface of at least one of the BN strip and a second metal contact on a second surface of the at least one BN strip. The neutron detector includes an electrically insulating submount, a BN epilayer of Boron-10 enriched hexagonal boron nitride (h-10BN or h-BN or 10BN or BN) placed on the insulating submount, a first metal contact deposited on a first surface of the BN epilayer, and a second metal contact deposited on a second surface of the BN epilayer.
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公开(公告)号:US11747658B2
公开(公告)日:2023-09-05
申请号:US17896303
申请日:2022-08-26
Applicant: Texas Tech University System
Inventor: Hongxing Jiang , Changzhi Li , Jing Li , Jingyu Lin
CPC classification number: G02F1/017 , G02F1/292 , H01L27/156 , H01S3/0085 , G02F2202/10 , G02F2202/36 , G02F2203/50
Abstract: Disclosed is a system and method for solid-state 2D optical phased arrays (OPAs), which are fabricated from In-rich In1-xGaxN/GaN multiple quantum wells (MQWs). In-rich InxGa1-xN alloys possess the unique properties of exceptionally high free-carrier-induced refractive index (n) change and low optical loss. InGaN/GaN MQW pixels play the role of using a very small fraction of a laser beam to modulate the phase of the laser beam. The phase of each MQW pixel in the OPA is controlled independently via electro-optic effect through the integration between OPA pixels with a Laterally Diffused MOSFET (LDMOS) integrated circuit driver to achieve the manipulation of the distribution of optical power in the far field. The present invention is applicable to a wide range of applications, including the operation of LIDAR systems, laser weapons, laser illuminators, and laser imaging systems.
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7.
公开(公告)号:US20230223741A1
公开(公告)日:2023-07-13
申请号:US17439321
申请日:2020-03-12
Applicant: Texas Tech University System
Inventor: Hongxing Jiang , Zhenyu Sun , Yaqiong Yan , Jing Li , Jingyu Lin
CPC classification number: H01S5/2214 , H01S5/0265 , H01S3/0632
Abstract: Core-cladding planar waveguide (PWG) structures and methods of making and using same. The core-cladding PWG structures can be synthesized by hydride vapor phase epitaxy and processed by mechanical and chemical-mechanical polishing. An Er doping concentration of [Er] between 1×1018 atoms/cm3 and 1×1022 atoms/cm3 can be in the core layer. Such PWGs have a core region that can achieve optical confinement between 96% and 99% and above.
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公开(公告)号:US11195968B2
公开(公告)日:2021-12-07
申请号:US16897742
申请日:2020-06-10
Applicant: Texas Tech University System
Inventor: Hongxing Jiang , Jingyu Lin , Jing Li , Avisek Maity , Sam Grenadier
IPC: H01L31/115 , G01T3/08 , H01L31/0224 , H01L31/036 , H01L31/02 , H01L31/18 , H01L31/0304
Abstract: A method for fabricating a neutron detector includes providing an epilayer wafer of Boron-10 enriched hexagonal boron nitride (h-10BN or h-BN or 10BN or BN) having a thickness (t), dicing or cutting the epilayer wafer into one or more BN strips having a width (W) and a length (L), and depositing a first metal contact on a first surface of at least one of the BN strip and a second metal contact on a second surface of the at least one BN strip. The neutron detector includes an electrically insulating submount, a BN epilayer of Boron-10 enriched hexagonal boron nitride (h-10BN or h-BN or 10BN or BN) placed on the insulating submount, a first metal contact deposited on a first surface of the BN epilayer, and a second metal contact deposited on a second surface of the BN epilayer.
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