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公开(公告)号：US11273464B2
公开(公告)日：2022-03-15
申请号：US16986412
申请日：2020-08-06
Applicant: Tokyo Electron Limited
Inventor： Satoshi Shimmura , Yuji Sakai , Kenta Shibasaki , Koji Takayanagi , Kenji Yada , Hiroichi Inada , Shinichi Seki , Kento Ogata
Abstract: A substrate processing apparatus includes a cover member placed to surround a substrate held by a rotary holder; a collecting member placed in an exhaust path formed between the cover member and the rotary holder; and a solvent supply placed above the collecting member and configured to supply a solvent to the collecting member. The solvent supply includes an inner storage space surrounding the substrate; an outer storage space surrounding the inner storage space; and a partition wall extending along a circumferential direction to partition the inner storage space and the outer storage space. Multiple communication holes are extended to penetrate the partition wall such that the solvent introduced into the outer storage space flows to the inner storage space. Multiple dripping holes are extended to penetrate a bottom wall of the inner storage space such that the solvent within the inner storage space drops toward the collecting member.
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公开(公告)号：US20160054653A1
公开(公告)日：2016-02-25
申请号：US14919869
申请日：2015-10-22
Applicant: Tokyo Electron Limited
Inventor： Norihiko Sasagawa , Hiroichi Inada , Yasushi Takiguchi
IPC: G03F7/16
CPC classification number: G03F7/162 , B05D1/005 , G03F7/3021 , G06F19/00 , H01L21/6715 , H01L21/67178
Abstract: A liquid processing method includes: accommodating a substrate horizontally in each of a first processing region and a second processing region, for performing therein a process on the substrate by a processing solution from a nozzle; rotating a rotary body about a vertical axis; keeping a plurality of processing nozzles provided at the rotary body; supplying different kinds of processing solutions to the substrate from the plurality of processing nozzles; holding a processing nozzle selected from the plurality of processing nozzles by a nozzle holder provided at the rotary body; transferring the nozzle holder into selected one of the first and the second processing regions by a nozzle transfer device; and rotating the rotary body by a rotation driving unit so as to allow a front of the nozzle holder in a forward/backward direction thereof to face the selected one of the first and the second processing regions.
Abstract translation: 液体处理方法包括：在第一处理区域和第二处理区域中的每一个中水平地容纳衬底，用于通过来自喷嘴的处理溶液在衬底上进行处理; 围绕垂直轴旋转旋转体; 保持设置在所述旋转体上的多个处理喷嘴; 从所述多个处理喷嘴向所述基板供应不同种类的处理溶液; 通过设置在所述旋转体的喷嘴保持从所述多个处理喷嘴中选择的处理喷嘴; 通过喷嘴传送装置将喷嘴保持器转移到第一和第二处理区域中的选定的一个中; 并且通过旋转驱动单元旋转所述旋转体，以使得所述喷嘴保持器的前后方向与所述第一和第二处理区域中的所选择的一个相对。
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公开(公告)号：US11862485B2
公开(公告)日：2024-01-02
申请号：US17471457
申请日：2021-09-10
Applicant: Tokyo Electron Limited
Inventor： Satoshi Shimmura , Kohei Kawakami , Hiroichi Inada , Koji Takayanagi
CPC classification number: H01L21/67051 , H01L21/02307 , H01L21/6715
Abstract: A nozzle standby device configured to allow a nozzle to stand by therein includes a nozzle accommodation unit, having an inner circumferential surface formed to surround a leading end portion of the nozzle, provided with a drain opening facing a discharge opening of the nozzle; and a solvent discharge opening opened within the nozzle accommodation unit. The nozzle accommodation unit has a diameter reducing portion having a first and a second inner circumferential surfaces having different angles with respect to a center line of the nozzle accommodation unit such that an inner diameter of the diameter reducing portion becomes smaller toward the drain opening. An intersection point of two straight lines extending along two opposite portions of the first inner circumferential surface is located above the discharge opening of the nozzle when the leading end portion of the nozzle is placed in the diameter reducing portion.
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公开(公告)号：US10074548B2
公开(公告)日：2018-09-11
申请号：US14795213
申请日：2015-07-09
Applicant: Tokyo Electron Limited
Inventor： Norihiko Sasagawa , Hiroichi Inada , Masahito Hamada
CPC classification number: H01L21/6715 , B01F3/0853 , B01F3/0861 , B01F5/0057 , B01F5/0071 , B01F7/00908 , B01F7/00916 , B01F15/00883 , B01F15/00889 , B01F2003/0896 , G03F7/3021
Abstract: Disclosed is a chemical liquid discharge mechanism. The mechanism includes: a storage portion including a chemical liquid storage space; a diluent supply port opened to supply a diluent for reducing a viscosity of the chemical liquid to the storage space; a vertex flow forming portion that forms vortex flows in the diluent and the chemical liquid by supplying a fluid to the storage space to stir the diluent and the chemical liquid; and a liquid discharge port opened to an upper side of the diluent supply port in the storage space such that, by the supply of the diluent, the diluent and the chemical liquid flow into the liquid discharge port to be discharged from the storage space. Thus, the viscosity of the waste liquid discharged from the liquid discharge port may be reduced, and thus, it is not necessary to largely set the inclination of the liquid discharge path.
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公开(公告)号：US11868057B2
公开(公告)日：2024-01-09
申请号：US17485698
申请日：2021-09-27
Applicant: Tokyo Electron Limited
Inventor： Kenta Shibasaki , Hiroichi Inada , Satoshi Shimmura , Koji Takayanagi , Kenji Yada , Shinichi Seki , Akihiro Teramoto
CPC classification number: G03F7/70925 , B05C1/02 , B08B3/08 , G03F7/162
Abstract: A solution treatment apparatus applies a coating solution onto a substrate. The apparatus includes a holder holding and rotating the substrate; a coating solution supplier supplying the coating solution to the substrate on the holder; and an inner cup surrounding the holder from a lateral side and having a peripheral edge side upper surface inclining down outward in a radial direction from an apex part located below a peripheral edge side of the substrate on the holder. The inner cup has discharge ports formed along a circumferential direction at the apex part; and the discharge ports are formed to discharge a cleaning solution and make the cleaning solution flow down along the peripheral edge side upper surface of the inner cup, thereby cleaning the peripheral edge side upper surface, and to discharge the cleaning solution outward in the radial direction and obliquely upward.
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Patent Agency Ranking
公开(公告)号：US10755952B2
公开(公告)日：2020-08-25
申请号：US16059265
申请日：2018-08-09
Applicant: Tokyo Electron Limited
Inventor： Norihiko Sasagawa , Hiroichi Inada , Masahito Hamada
Abstract: Disclosed is a chemical liquid discharge mechanism. The mechanism includes: a storage portion including a chemical liquid storage space; a diluent supply port opened to supply a diluent for reducing a viscosity of the chemical liquid to the storage space; a vertex flow forming portion that forms vortex flows in the diluent and the chemical liquid by supplying a fluid to the storage space to stir the diluent and the chemical liquid; and a liquid discharge port opened to an upper side of the diluent supply port in the storage space such that, by the supply of the diluent, the diluent and the chemical liquid flow into the liquid discharge port to be discharged from the storage space. Thus, the viscosity of the waste liquid discharged from the liquid discharge port may be reduced, and thus, it is not necessary to largely set the inclination of the liquid discharge path.
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7.发明申请公开(公告)号：US20180350633A1
公开(公告)日：2018-12-06
申请号：US16059265
申请日：2018-08-09
Applicant: Tokyo Electron Limited
Inventor： Norihiko Sasagawa , Hiroichi Inada , Masahito Hamada
CPC classification number: H01L21/6715 , B01F3/0853 , B01F3/0861 , B01F5/0057 , B01F5/0071 , B01F7/00908 , B01F7/00916 , B01F15/00883 , B01F15/00889 , B01F2003/0896 , G03F7/3021
Abstract: Disclosed is a chemical liquid discharge mechanism. The mechanism includes: a storage portion including a chemical liquid storage space; a diluent supply port opened to supply a diluent for reducing a viscosity of the chemical liquid to the storage space; a vertex flow forming portion that forms vortex flows in the diluent and the chemical liquid by supplying a fluid to the storage space to stir the diluent and the chemical liquid; and a liquid discharge port opened to an upper side of the diluent supply port in the storage space such that, by the supply of the diluent, the diluent and the chemical liquid flow into the liquid discharge port to be discharged from the storage space. Thus, the viscosity of the waste liquid discharged from the liquid discharge port may be reduced, and thus, it is not necessary to largely set the inclination of the liquid discharge path.
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公开(公告)号：US10168618B2
公开(公告)日：2019-01-01
申请号：US14919869
申请日：2015-10-22
Applicant: Tokyo Electron Limited
Inventor： Norihiko Sasagawa , Hiroichi Inada , Yasushi Takiguchi
Abstract: A liquid processing method includes: accommodating a substrate horizontally in each of a first processing region and a second processing region, for performing therein a process on the substrate by a processing solution from a nozzle; rotating a rotary body about a vertical axis; keeping a plurality of processing nozzles provided at the rotary body; supplying different kinds of processing solutions to the substrate from the plurality of processing nozzles; holding a processing nozzle selected from the plurality of processing nozzles by a nozzle holder provided at the rotary body; transferring the nozzle holder into selected one of the first and the second processing regions by a nozzle transfer device; and rotating the rotary body by a rotation driving unit so as to allow a front of the nozzle holder in a forward/backward direction thereof to face the selected one of the first and the second processing regions.
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公开(公告)号：US20170358464A1
公开(公告)日：2017-12-14
申请号：US15619920
申请日：2017-06-12
Applicant: Tokyo Electron Limited
Inventor： Masahiro Abe , Hiroichi Inada , Tohru Azuma , Tsunenaga Nakashima , Naofumi Kishita , Hideki Kajiwara
IPC: H01L21/67 , G03F7/16 , H01L21/677
CPC classification number: H01L21/6715 , G03F7/162
Abstract: Disclosed is a liquid processing apparatus including: a plurality of substrate placement regions; a nozzle that supplies a processing liquid to a substrate from each processing position; a nozzle placement region provided behind a row of the substrate placement regions; an arm that detachably holds the nozzle at one end side; a driving unit that horizontally pivots the arm around a pivot axis; and a controller that outputs a control signal to convey the nozzle from the nozzle placement region to a standby position corresponding to a processing position of a conveyance destination, cause the nozzle to stand by at the standby position, and then, convey the nozzle to the processing position. The standby position is outside the substrate placement regions and is located between the processing position and the nozzle placement region when viewed in a front-and-rear direction.
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公开(公告)号：US12257611B2
公开(公告)日：2025-03-25
申请号：US17914108
申请日：2021-03-15
Applicant: Tokyo Electron Limited
Inventor： Satoshi Shimmura , Koji Takayanagi , Kenta Shibasaki , Hiroichi Inada
Abstract: A cleaning jig of a disc shape used for cleaning an inside of a container while being held by a rotary holding device in a same manner as a substrate in a spin coating apparatus that supplies a processing liquid onto a substrate held by the rotary holding device disposed in the container and forms a film of the processing liquid on the substrate by rotating the substrate. A peripheral ceiling portion and a peripheral bottom portion are formed over an entire periphery of the cleaning jig, a discharge port is formed over the entire periphery between the peripheral ceiling portion and the peripheral bottom portion, a plurality of holes is formed in the peripheral bottom portion at intervals in a circumferential direction to communicate with the discharge port, and a lower surface of the peripheral ceiling portion is inclined toward an upper periphery.
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