公开(公告)号：US20250068059A1

公开(公告)日：2025-02-27

申请号：US18813332

申请日：2024-08-23

Applicant: Tokyo Electron Limited

Inventor： Hiroyuki Ide

IPC: G03F1/82 ,  G03F7/00

Abstract: A substrate processing method of patterning a resist film formed on a substrate by exposing and developing the resist film is provided. The substrate processing method includes performing, before forming the resist film containing a metal on the substrate, an auxiliary process of adjusting moisture adhesion to a formation surface of the substrate on which the resist film is to be formed.

公开(公告)号：US10048664B2

公开(公告)日：2018-08-14

申请号：US14963802

申请日：2015-12-09

Applicant: Tokyo Electron Limited

Inventor： Takafumi Hasimoto ,  Shinichi Hatakeyama ,  Naoki Shibata ,  Kousuke Yoshihara ,  Minoru Kubota ,  Hiroyuki Ide

IPC: B05C5/00 ,  G05B15/02 ,  H01L21/02 ,  B05C13/02 ,  B05B1/00 ,  B05D1/00 ,  G03F7/16 ,  H01L21/67 ,  B05D3/04 ,  B05D3/10

Abstract: There is provided a coating method which can apply a coating solution uniformly onto a substrate surface while reducing the amount of the coating solution supplied. The coating method for applying a coating solution onto a wafer includes the steps of: supplying a solvent for the coating solution onto the wafer to form an annular liquid film of the solvent in a peripheral area of the wafer; supplying the coating solution to the center of the wafer while rotating the wafer at a first rotational speed (time t1-t2); and allowing the coating solution to spread on the wafer by rotating the wafer at a second rotational speed which is higher than the first rotational speed (time t4-t5). The supply of the solvent is continued until just before the coating solution comes into contact with the liquid film of the solvent (time t0-t3).

公开(公告)号：US20210008588A1

公开(公告)日：2021-01-14

申请号：US17040206

申请日：2019-03-20

Applicant: Tokyo Electron Limited

Inventor： Hiroyuki Ide ,  Hideo Shite ,  Kousuke Yoshihara

IPC: B05C11/10 ,  B05D1/26 ,  H01L21/027

Abstract: A liquid processing device includes: a nozzle configured to discharge, onto a substrate, a processing liquid supplied from a processing liquid source, the processing liquid being configured to process the substrate; a main flow path which connects the processing liquid source and the nozzle; a filter provided in the main flow path; a branch path branched from the main flow path; a pump provided at an end of the branch path; and a controller configured to output a control signal to perform a first process of sucking the processing liquid supplied from the processing liquid source by the pump to flow the processing liquid into the branch path and then a second process of discharging the processing liquid of a smaller amount than a capacity of the branch path from the pump to the branch path to discharge the processing liquid from the nozzle.

公开(公告)号：US11465168B2

公开(公告)日：2022-10-11

申请号：US17040206

申请日：2019-03-20

Applicant: Tokyo Electron Limited

Inventor： Hiroyuki Ide ,  Hideo Shite ,  Kousuke Yoshihara

IPC: B05C11/10 ,  B05D1/26 ,  H01L21/027 ,  B05C11/02 ,  B05C11/08

Abstract: A liquid processing device includes: a nozzle configured to discharge, onto a substrate, a processing liquid supplied from a processing liquid source, the processing liquid being configured to process the substrate; a main flow path which connects the processing liquid source and the nozzle; a filter provided in the main flow path; a branch path branched from the main flow path; a pump provided at an end of the branch path; and a controller configured to output a control signal to perform a first process of sucking the processing liquid supplied from the processing liquid source by the pump to flow the processing liquid into the branch path and then a second process of discharging the processing liquid of a smaller amount than a capacity of the branch path from the pump to the branch path to discharge the processing liquid from the nozzle.

公开(公告)号：US11433420B2

公开(公告)日：2022-09-06

申请号：US16768216

申请日：2018-12-07

Applicant: Tokyo Electron Limited

Inventor： Ryouichirou Naitou ,  Masato Hayashi ,  Hideo Shite ,  Hiroyuki Ide ,  Yosuke Kameda ,  Seiya Totsuka ,  Atsumu Maita ,  Takami Satoh ,  Hirofumi Araki ,  Kentaro Yoshihara

IPC: B05C19/06 ,  B05C11/10 ,  H01L21/67

Abstract: A solution supply apparatus is for supplying a treatment solution to a treatment solution discharger which discharges the treatment solution to a treatment object. The solution supply apparatus includes: a supply pipe line connected to the treatment solution discharger; a filter provided on the supply pipe line which filters the treatment solution to remove foreign substances; and a controller. The controller performs a determination of a state of the treatment solution to be supplied to a primary side of the filter and, when the state of the treatment solution is determined to be bad, outputs a control signal for restricting supply of the treatment solution to the primary side of the filter.