公开(公告)号：US10664739B2

公开(公告)日：2020-05-26

申请号：US14973399

申请日：2015-12-17

Applicant: Toppan Printing Co., Ltd.

Inventor： Tetsuya Tsukada ,  Shonosuke Mizoguchi ,  Eriko Hatakeyama

IPC: G06K19/077

Abstract: A dual IC card of the present invention includes: an IC module having a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an IC chip having a contact communication function and a contactless communication function; an antenna formed along a coil wiring path that defines an inductance and having a coupling coil portion electromagnetically coupling with the connecting coil of the IC module, a main coil portion formed along a coil wiring path that defines an inductance and connected to the coupling coil portion for performing contactless communication with the external machine, and a resistance-increasing portion provided in a section that forms the coil wiring path of at least one of the coupling coil portion and the main coil portion increase electrical resistance in the section; and a plate-like card body in which the antenna is arranged.

公开(公告)号：US10679117B2

公开(公告)日：2020-06-09

申请号：US16247325

申请日：2019-01-14

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Tetsuya Tsukada ,  Shonosuke Mizoguchi ,  Eriko Hatakeyama

IPC: G06K19/077

Abstract: A dual IC card of the present invention includes: an IC module having a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an IC chip having a contact communication function and a contactless communication function; an antenna formed along a coil wiring path that defines an inductance and having a coupling coil portion electromagnetically coupling with the connecting coil of the IC module, a main coil portion formed along a coil wiring path that defines an inductance and connected to the coupling coil portion for performing contactless communication with the external machine, and a resistance-increasing portion provided in a section that forms the coil wiring path of at least one of the coupling coil portion and the main coil portion increase electrical resistance in the section; and a plate-like card body in which the antenna is arranged.

公开(公告)号：US09633301B2

公开(公告)日：2017-04-25

申请号：US14973457

申请日：2015-12-17

Applicant: Toppan Printing Co., Ltd.

Inventor： Shonosuke Mizoguchi ,  Tetsuya Tsukada ,  Eriko Hatakeyama

IPC: H05K1/14 ,  G06K19/077 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/522 ,  H01L23/00

CPC classification number: G06K19/07747 ,  G06K19/07775 ,  G06K19/07779 ,  H01L21/486 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49827 ,  H01L23/49855 ,  H01L23/5227 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48225 ,  H01L2224/48228 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754

Abstract: An IC module of the present invention includes: a sheet-like base having a first surface and a second surface and having a first through hole and a second through hole spaced apart from the first through hole; an IC chip provided to the first surface, having a contact communication function and a contactless communication function, and having two terminals formed thereon; a connecting coil formed on the first surface and having two ends; a contact terminal portion provided to the second surface and configured to contact an external contact machine; bridge wiring provided to the second surface, provided at a position overlapping with the first and second through holes, and electrically insulated from the contact terminal portion; a first conductive wire inserted through the first through hole and connecting the first terminal of the IC chip to the bridge wiring; a second conductive wire inserted through the second through hole and connecting the bridge wiring to the first end of the connecting coil; and a third conductive wire connecting the second end of the connecting coil to the second terminal of the IC chip.