公开(公告)号：US09183492B2

公开(公告)日：2015-11-10

申请号：US14255534

申请日：2014-04-17

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Hiroshige Nihei ,  Tetsuya Tsukada

IPC: G06K19/06 ,  G06K19/077 ,  H01Q7/00 ,  H01Q1/40 ,  H01Q1/22

CPC classification number: G06K19/07783 ,  G06K19/07769 ,  G06K19/07794 ,  H01Q1/2225 ,  H01Q1/40 ,  H01Q7/00

Abstract: Provided is a composite IC card including: a card base having a recess; an antenna sheet arranged inside the card base; an IC module arranged in the recess of the card base. The IC module includes an IC chip having a module substrate provided with an external terminal, and a first coupling coil. The antenna sheet includes an antenna coil configured to perform reception of electric power and transmission and reception of signals with an external reader, and a second coupling coil connected to the antenna coil. The first coupling coil and the second coupling coil are arranged so as to be capable of achieving close coupling therebetween and configured to couple the IC module with the antenna sheet in a non-contact manner by trans coupling. The second coupling coil of the antenna sheet is arranged outside a region in which the recess of the card base is formed.

Abstract translation: 提供一种复合IC卡，包括：具有凹部的卡座; 布置在卡底部内的天线片; 配置在卡座的凹部中的IC模块。 IC模块包括具有设置有外部端子的模块基板的IC芯片和第一耦合线圈。 天线片包括被配置为执行电力接收和外部读取器的信号的发送和接收的天线线圈和连接到天线线圈的第二耦合线圈。 第一耦合线圈和第二耦合线圈被布置成能够在它们之间实现紧密耦合，并且被配置为通过反耦合以非接触方式将IC模块与天线片耦合。 天线片的第二耦合线圈布置在卡基部的凹部形成的区域的外侧。

公开(公告)号：US09633301B2

公开(公告)日：2017-04-25

申请号：US14973457

申请日：2015-12-17

Applicant: Toppan Printing Co., Ltd.

Inventor： Shonosuke Mizoguchi ,  Tetsuya Tsukada ,  Eriko Hatakeyama

IPC: H05K1/14 ,  G06K19/077 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/522 ,  H01L23/00

CPC classification number: G06K19/07747 ,  G06K19/07775 ,  G06K19/07779 ,  H01L21/486 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49827 ,  H01L23/49855 ,  H01L23/5227 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48225 ,  H01L2224/48228 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754

Abstract: An IC module of the present invention includes: a sheet-like base having a first surface and a second surface and having a first through hole and a second through hole spaced apart from the first through hole; an IC chip provided to the first surface, having a contact communication function and a contactless communication function, and having two terminals formed thereon; a connecting coil formed on the first surface and having two ends; a contact terminal portion provided to the second surface and configured to contact an external contact machine; bridge wiring provided to the second surface, provided at a position overlapping with the first and second through holes, and electrically insulated from the contact terminal portion; a first conductive wire inserted through the first through hole and connecting the first terminal of the IC chip to the bridge wiring; a second conductive wire inserted through the second through hole and connecting the bridge wiring to the first end of the connecting coil; and a third conductive wire connecting the second end of the connecting coil to the second terminal of the IC chip.

公开(公告)号：US10936932B2

公开(公告)日：2021-03-02

申请号：US16428389

申请日：2019-05-31

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Tetsuya Tsukada

IPC: G06K19/077 ,  H01Q7/00 ,  H04B5/02

Abstract: A dual IC card with an IC chip having both a contact-type transmission function and a contactless-type transmission function, and a module substrate having an external terminal, which is a contact-type transmission portion, and a connecting coil, which is a contactless-type transmission portion; an antenna sheet including an antenna substrate having first and second surfaces, a coupling coil having a second surface coil provided on a second surface of the antenna substrate, the coupling coil configured to be electromagnetically coupled to the connecting coil, and an antenna coil connected to the coupling coil for contactless communication with an external device; and a card body in a plate-shape housing the antenna sheet and with a recess for the IC module, with at least a part of the second surface coil positioned inside the recess when viewed in a thickness direction.

公开(公告)号：US10679117B2

公开(公告)日：2020-06-09

申请号：US16247325

申请日：2019-01-14

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Tetsuya Tsukada ,  Shonosuke Mizoguchi ,  Eriko Hatakeyama

IPC: G06K19/077

Abstract: A dual IC card of the present invention includes: an IC module having a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an IC chip having a contact communication function and a contactless communication function; an antenna formed along a coil wiring path that defines an inductance and having a coupling coil portion electromagnetically coupling with the connecting coil of the IC module, a main coil portion formed along a coil wiring path that defines an inductance and connected to the coupling coil portion for performing contactless communication with the external machine, and a resistance-increasing portion provided in a section that forms the coil wiring path of at least one of the coupling coil portion and the main coil portion increase electrical resistance in the section; and a plate-like card body in which the antenna is arranged.

公开(公告)号：US11200479B2

公开(公告)日：2021-12-14

申请号：US16406875

申请日：2019-05-08

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Eriko Uehara ,  Tetsuya Tsukada

IPC: G06K19/06 ,  G06K19/077 ,  B42D25/305 ,  H04B5/02 ,  H01Q7/00

Abstract: An electromagnetic-coupling dual IC card includes an IC module and a plate-like card body. The IC module includes a module substrate having a first surface and a second surface, contact terminals provided on the first surface of the module substrate to be contactable with an external contact-type device, an IC chip having a contact communication function and a contactless communication function and disposed on the second surface, and a first connecting coil provided on the first surface. The plate-like card body includes an antenna sheet embedded therein and has a recess for holding the IC module, the antenna sheet being provided with a coupling coil to be electromagnetically coupled to the first connecting coil, and a main coil connected to the coupling coil to perform contactless communication with an external contactless-type device. The first connecting coil does not overlap with the contact terminals in plan view.

公开(公告)号：US20140224886A1

公开(公告)日：2014-08-14

申请号：US14255534

申请日：2014-04-17

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Hiroshige NIHEI ,  Tetsuya Tsukada

IPC: G06K19/077

CPC classification number: G06K19/07783 ,  G06K19/07769 ,  G06K19/07794 ,  H01Q1/2225 ,  H01Q1/40 ,  H01Q7/00

Abstract: Provided is a composite IC card including: a card base having a recess; an antenna sheet arranged inside the card base; an IC module arranged in the recess of the card base. The IC module includes an IC chip having a module substrate provided with an external terminal, and a first coupling coil. The antenna sheet includes an antenna coil configured to perform reception of electric power and transmission and reception of signals with an external reader, and a second coupling coil connected to the antenna coil. The first coupling coil and the second coupling coil are arranged so as to be capable of achieving close coupling therebetween and configured to couple the IC module with the antenna sheet in a non-contact manner by trans coupling. The second coupling coil of the antenna sheet is arranged outside a region in which the recess of the card base is formed.

Abstract translation: 提供一种复合IC卡，包括：具有凹部的卡座; 布置在卡底部内的天线片; 配置在卡座的凹部中的IC模块。 IC模块包括具有设置有外部端子的模块基板的IC芯片和第一耦合线圈。 天线片包括被配置为执行电力接收和外部读取器的信号的发送和接收的天线线圈和连接到天线线圈的第二耦合线圈。 第一耦合线圈和第二耦合线圈被布置成能够在它们之间实现紧密耦合，并且被配置为通过反耦合以非接触方式将IC模块与天线片耦合。 天线片的第二耦合线圈布置在卡基部的凹部形成的区域的外侧。

公开(公告)号：US10664739B2

公开(公告)日：2020-05-26

申请号：US14973399

申请日：2015-12-17

Applicant: Toppan Printing Co., Ltd.

Inventor： Tetsuya Tsukada ,  Shonosuke Mizoguchi ,  Eriko Hatakeyama

IPC: G06K19/077

Abstract: A dual IC card of the present invention includes: an IC module having a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an IC chip having a contact communication function and a contactless communication function; an antenna formed along a coil wiring path that defines an inductance and having a coupling coil portion electromagnetically coupling with the connecting coil of the IC module, a main coil portion formed along a coil wiring path that defines an inductance and connected to the coupling coil portion for performing contactless communication with the external machine, and a resistance-increasing portion provided in a section that forms the coil wiring path of at least one of the coupling coil portion and the main coil portion increase electrical resistance in the section; and a plate-like card body in which the antenna is arranged.